Patent application number | Description | Published |
20090145648 | MULTILAYER WIRING BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE - A multilayer wiring board is so constituted that: a group of electronic part mounting capture pads are provided on one surface thereof; a first wiring layer formed on an uppermost layer thereof includes a first connection part arranged on the same surface as the surface where the pads are provided, and a second connection part spaced from the first connection part; the pad and the first connection part are electrically connected through a conductor wire, and the conductor wire is provided in a first insulating layer laminated on the first wiring layer; and the first connection part is connected linearly or curvedly to the second connection part through a first wiring pattern. | 06-11-2009 |
20100294552 | ELECTRONIC COMPONENT MOUNTED STRUCTURE - An electronic component (chip) mounted structure includes a chip having a terminal, a wiring board having a terminal electrically connected to the terminal of the chip, and an interposing board disposed between the chip and the wiring board and having a structure including an insulating base material provided with a large number of filamentous conductors penetrating the insulating base material in a thickness direction thereof. The terminal of the chip is electrically connected to the terminal of the wiring board via a plurality of filamentous conductors provided in the interposing board. | 11-25-2010 |
20100307808 | WIRING BOARD - A wiring board includes a core substrate having a structure including an insulating base material and a large number of filamentous conductors densely provided in the insulating base material and piercing the insulating base material in a thickness direction thereof. Pads made of portions of wiring layers are oppositely disposed on both surfaces of the core substrate and electrically connected to opposite ends of a plurality of filamentous conductors in such a manner that the pads share the filamentous conductors. A wiring connection between one surface side and the other surface side of the core substrate is made through the pads. The insulating base material is made of an inorganic dielectric. Pads made of portions of the wiring layers are disposed on both surfaces of the core substrate and electrically connected only to corresponding one end sides of different groups each formed of a plurality of filamentous conductors. | 12-09-2010 |
20110013340 | CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A capacitor includes a dielectric substrate and a large number of filamentous conductors formed to penetrate through the dielectric substrate in a thickness direction thereof. An electrode is connected to only respective one ends of a plurality of filamentous conductors constituting one of groups each composed of a plurality of filamentous conductors. The electrode is disposed in at least one position on each of both surfaces of the dielectric substrate, or in at least two positions on one of the surfaces. Further, an insulating layer is formed on each of both surfaces of the dielectric substrate so as to cover regions between the electrodes, and a conductor layer is formed on the corresponding insulating layer integrally with a desired number of electrodes. | 01-20-2011 |
20110080247 | Inductor and Manufacturing Method Thereof - An inductor includes a core substrate including minute column-like electrical conductors extending between a front surface and a back surface of the core substrate. Each column-like electrical conductor is insulated from adjacent column-like electrical conductors by being surrounded by an insulating material. Insulation layers are formed on the front surface and the back surface of the core substrate, respectively. At least two connection electrical conductors extend through each of the insulation layers. Each connection electrical conductor is electrically connected to a plurality of the column-like electrical conductors. Wirings are formed on each of the insulation layers to connect said connection electrical conductors to each other electrically. The wirings, the connection electrical conductors and the column-like electrical conductors are connected to form a coil in a three-dimensional manner. | 04-07-2011 |
20110175235 | WIRING SUBSTRATE AND SEMICONDUCTOR APPARATUS INCLUDING THE WIRING SUBSTRATE - A wiring substrate includes a core substrate including an inorganic dielectric insulating base material having first and second surfaces, and linear conductors penetrating the insulating base; a first wiring layer on the first surface electrically connected to a portion of linear conductors; a second wiring layer on the second surface electrically connected to the portion of the linear conductors; a first insulating layer on the first surface covering the first wiring layer and including a first through-hole; a third wiring layer on the first insulating layer electrically connected to the first wiring layer via the first through-hole; a second insulating layer on the second surface covering the second wiring layer and including a second through-hole; and a fourth wiring layer on the second insulating layer electrically connected to the second wiring layer via the second through-hole. | 07-21-2011 |
20110220404 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate includes a composite substrate including an oxidized aluminum substrate portion in which a large number of penetration conductors penetrating in a thickness direction are provided, and a frame-like aluminum substrate portion provided around the oxidized aluminum substrate portion, and a wiring layer of n layers (n is an integer of 1 or more) connected to the penetration conductors. | 09-15-2011 |
20140117539 | WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE - A wiring substrate includes a core layer, first and second wiring layers, and a first insulating layer. The core layer has one and another surfaces and includes a plate-shaped member formed of an aluminum oxide and multiple linear conductors penetrating the plate-shaped member in a thickness direction of the plate-shaped member. The first wiring layer is formed on the one surface of the core layer. The second wiring layer is formed on the other surface of the core layer. The first insulating layer has a same thickness as the first wiring layer and is formed in an area of the one surface of the core layer on which the first wiring layer is not formed. The first and second wiring layers are positioned superposing each other in a plan view. The first and second wiring layers are electrically connected by way of the multiple linear conductors. | 05-01-2014 |