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Michinari
Michinari Abe, Oita JP
| Patent application number | Description | Published |
|---|---|---|
| 20090324648 | VACCINE FOR EDWARDSIELLA DISEASE AND STREPTOCOCCAL DISEASE IN FISH - Disclosed is a vaccine for edwardsiellosis and streptococcosis in a fish. Specifically, disclosed is a vaccine for edwardsiellosis in a fish, which comprises inactivated cells of (A) an | 12-31-2009 |
Michinari Momma, San Diego, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100324985 | METHOD AND APPARATUS FOR RECOMMENDATION ENGINE USING PAIR-WISE CO-OCCURRENCE CONSISTENCY - The invention, referred to herein as PeaCoCk, uses a unique blend of technologies from statistics, information theory, and graph theory to quantify and discover patterns in relationships between entities, such as products and customers, as evidenced by purchase behavior. In contrast to traditional purchase-frequency based market basket analysis techniques, such as association rules which mostly generate obvious and spurious associations, PeaCoCk employs information-theoretic notions of consistency and similarity, which allows robust statistical analysis of the true, statistically significant, and logical associations between products. Therefore, PeaCoCk lends itself to reliable, robust predictive analytics based on purchase-behavior. | 12-23-2010 |
Michinari Tetani, Osaka JP
| Patent application number | Description | Published |
|---|---|---|
| 20100044868 | SEMICONDUCTOR DEVICE - A semiconductor device includes an external terminal, a plurality of first interconnections, an electrode, a conductor, and a second interconnection. The first interconnections are positioned below the external terminal. The electrode is positioned at the same level as the first interconnections and is electrically connected to the external terminal through the conductor. The second interconnection is positioned below the first interconnections and the electrode. The semiconductor device has a region where the shortest distance between an edge surface of the electrode and an edge surface of one of the first interconnections positioned most adjacent to the electrode is less than 0.11 times the total thickness of the conductor and the electrode. The second interconnection is positioned at a position different from that of the region in a thickness direction of the semiconductor device. | 02-25-2010 |
| 20100283129 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - An upper surface of a semiconductor substrate includes a first portion where a dielectric film is provided, and a second portion where the dielectric film is not provided, wherein the second portion is located in the periphery of the first portion. The upper surface of the semiconductor substrate is covered with a sealing resin. | 11-11-2010 |
Michinari Tetani, Kadoma-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090096094 | SEMICONDUCTOR DEVICE - In a wafer level CSP package, with respect to signal wiring | 04-16-2009 |
Michinari Watanabe, Hiroshima JP
| Patent application number | Description | Published |
|---|---|---|
| 20090146455 | FRONT BODY STRUCTURE OF AUTOMOTIVE VEHICLE - A front side frame includes a bend portion which is operative to bend outward when an impact load acts on the front side frame from ahead. The bend portion is provided in a specified location such that the bend portion in a bending state substantially contacts a damper of the suspension from a vehicle front side. Accordingly, a rear end of the front side frame can be prevented properly from moving back when the impact load acts on the front side frame from ahead. | 06-11-2009 |
| 20090243336 | FRAME STRUCTURE OF AUTOMOTIVE VEHICLE - A reinforcement member is provided inside a frame member at a space which includes a bend portion operative to bend in such a manner that the reinforcement member comes to contact an inner face of an inside side face portion of the frame member as the frame member bends at the bend portion. Accordingly, the amount of energy absorption even after the bending start of the frame member can be properly increased. | 10-01-2009 |
Michinari Yamanaka, Hyogo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090147814 | SEMICONDUCTOR LASER DEVICE AND METHOD FOR MANUFACTURING THE SAME - A ridge stripe type semiconductor laser device is provided, on a semiconductor substrate ( | 06-11-2009 |