| Patent application number | Description | Published |
|---|
| 20080283276 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A wiring board and a method of forming a wiring board including a first substrate, a second substrate having a smaller mounting area than a mounting area of the first substrate, and a base substrate laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate. An IVH (Interstitial Via Hole) penetrates the base substrate. | 11-20-2008 |
| 20080283287 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A wiring board and method of forming a wiring board including a first substrate, a second substrate having a smaller mounting area than a mounting area of the first substrate, and a base substrate laminated between the first substrate and the second substrate, such that the first substrate extends beyond an edge of the second substrate. An IVH (Interstitial Via Hole) or through hole penetrates the base substrate and vias are formed in at least one of the first substrate or the second substrate. | 11-20-2008 |
| 20090014207 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board has a base substrate, a conductive pattern formed on the base substrate, an insulation layer formed on the conductive pattern and the base substrate and including a resin-impregnated inorganic cloth, a conductive pattern formed on the insulating layer, a via formed in the insulation layer and connecting the conductive pattern formed on the base substrate and the conductive pattern formed on the insulating layer, and a through-hole connected to the conductive pattern formed on the base substrate, penetrating through the base substrate and having a hole diameter in a range of 10 μm to 150 μm. | 01-15-2009 |
| 20090188703 | MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A multilayer wiring board includes a multilayer wiring substrate having a concave portion which accommodates an electronic component. The multilayer wiring substrate has multiple insulation layers, multiple conductive circuits, multiple vias and an electromagnetic shielding layer. The conductive circuits are separated by the insulation layers and electrically connected through the vias. The electromagnetic shielding layer has a roughened surface and formed along one of a bottom surface and side surfaces of the concave portion in the multilayer wiring substrate. | 07-30-2009 |
| 20090255111 | MULTILAYER PRINTED WIRING BOARD - A method of forming a circuit board which includes generating laser light with a carbon dioxide laser and making a hole through an insulating substrate by irradiating the insulating substrate with the laser light. The hole includes a top opening in a top surface of the insulating substrate, a bottom opening in a bottom surface of the insulating substrate, and an inner wall extending from the top opening to the bottom opening along a thickness direction of the insulating substrate, the inner wall including a bulge which extends in a direction generally orthogonal to the thickness direction. A via hole is formed in the insulating substrate by providing metal in the hole such that the metal extends from the top opening to the bottom opening along the inner wall, and completely closes each of the top and bottom openings. | 10-15-2009 |
| 20100155130 | Multilayer Printed Wiring Board - A multilayer printed wiring board comprises insulating layers and conductor layers being stacked alternately on each other. The conductor layers are electrically connected to each other through viaholes formed in the insulating layers. Each of the viaholes is formed to bulge in a direction generally orthogonal to the direction of thickness of the insulating layer. The multilayer printed wiring board is to have electronic components such as a capacitor, IC and the like mounted on the surface layer thereof. | 06-24-2010 |
| 20100252318 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board including insulating layers, conductor layers stacked alternately over the insulating layers, respectively, and viaholes formed in the insulation layers and electrically connecting the conductor layers through the insulation layers. The viaholes include a first group of viaholes and a second group of viaholes. The viaholes in the first group are tapered toward the viaholes in the second group, and the viaholes in the second group are tapered toward the viaholes in the first group. The viaholes in the first group and the the viaholes in the second group are formed in the insulating layers, respectively, and the viaholes are formed by plating openings formed after lamination of respective ones of the insulating layers, and each of the insulating layers is about 100 μm or less in thickness. | 10-07-2010 |
