Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Michikazu
Michikazu Hashimoto, Higashimatsuyama JP
| Patent application number | Description | Published |
|---|---|---|
| 20100103491 | METHOD FOR DETECTING POSITION OF REPRODUCED HOLOGRAM IMAGE AND HOLOGRAM APPARATUS - A hologram reproduced image position detecting method used in a hologram apparatus which perfoming an image formation with light reproduced from a recording medium where a data page including a marker and a data area that have been displayed on a spatial light modulator is recorded, on an image sensor having a larger number of pixels than the spatial light modulator, thereby obtaining a reproduced image of the data page to reproduce the data page. The detecting method comprises the steps of storing a template image into which the marker has been interpolation-expanded, beforehand; oversampling the reproduced image of the data page in the image sensor to obtain a detected image; and performing a template matching process on the detected image using the template image, thereby detecting the position of the marker when recorded. | 04-29-2010 |
Michikazu Matsumoto, Kyoto JP
| Patent application number | Description | Published |
|---|---|---|
| 20090206454 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A method for fabricating a semiconductor device includes the steps of: forming a first insulating film on a semiconductor substrate; removing part of the first insulating film; forming a second insulating film having a leakage current density higher than that of the first insulating film on a region where the part of the first insulating film has been removed on the semiconductor substrate; forming an undoped semiconductor film on the first and second insulating films; implanting an impurity into part of the undoped semiconductor film, thereby defining semiconductor regions of a first conductivity type dotted as discrete islands; forming a third insulating film on the semiconductor regions of the first conductivity type and the undoped semiconductor film; and removing part of the third insulating film by wet etching. At least the second insulating film is formed under the semiconductor regions of the first conductivity type. | 08-20-2009 |
Michikazu Matsushima, Ise-City JP
| Patent application number | Description | Published |
|---|---|---|
| 20110083717 | Solar Cell Module and Method of Manufacturing the Same - A solar cell module includes a base body, a plurality of solar cell elements arranged at intervals over the base body, a resin layer disposed on the solar cell elements and comprising a plurality of recesses on its surface facing opposite to the solar cell elements, and a protective sheet disposed on the resin layer. The protective sheet comprises a plurality of protrusions which correspond to the recesses of the resin layer and which are in contact with the recesses. The height of first protrusion at a location corresponding to the interval between the solar cell elements among the plurality of protrusions is higher than the height of second protrusion at a location corresponding to the solar cell element among the plurality of protrusions. The interval between adjacent ones of the second protrusions in a portion corresponding to an end portion of the base body in longer than the interval between adjacent ones of the second protrusions in a portion corresponding to a central portion of the base body. | 04-14-2011 |
Michikazu Morimoto, Kudamatsu JP
| Patent application number | Description | Published |
|---|---|---|
| 20120003838 | PLASMA ETCHING METHOD - Line-wiggling and striation caused by collapse of a pattern after a silicon dioxide film is etched by plasma with the use of a multilayer resist mask are prevented or suppressed. In a plasma etching method of etching a film to be etched by plasma with the use of a multilayer resist mask, the multilayer resist mask includes an upper layer resist, an inorganic intermediate film, and a lower layer resist, and the method includes a side wall protective film forming step of forming a side wall protective film on a side wall of the lower layer resist. | 01-05-2012 |
Michikazu Nakamura, Nirasaki City JP
| Patent application number | Description | Published |
|---|---|---|
| 20120091187 | BONDING APPARATUS AND BONDING METHOD - A bonding apparatus includes a thermal treating unit and a bonding unit that are integrally bonded together. The thermal treating unit includes a first thermal treating plate for supporting and thermally processing a superimposed substrate. The bonding unit includes a second thermal treating plate for supporting and thermally processing the superimposed substrate processed in thermal treating unit, and a pressing mechanism for pressing the superimposed substrate against the second thermal treating plate. The first thermal treating plate includes a cooling mechanism for cooling the superimposed substrate placed on the first heating plate. Each unit can depressurize the internal atmosphere to a specified degree of vacuum. The thermal treating unit has a plurality of carrying mechanisms for conveying the wafers between the two units. | 04-19-2012 |
Michikazu Nomura, Mobara-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110201687 | AMIDE DERIVATIVE, PEST CONTROL AGENT CONTAINING THE AMIDE DERIVATIVE, AND USE OF THE AMIDE DERIVATIVE - An amide derivative represented by the following Formula (1) is provided as an amide derivative showing a significantly excellent effect for a pest control action. | 08-18-2011 |