Patent application number | Description | Published |
20090062479 | Heat-curable polyimide silicone Composition and a cured film therefrom - A heat-curable resin composition, comprising
| 03-05-2009 |
20090062480 | Heat-curable polyimide silicone resin composition - A heat-curable polyimide silicone resin composition comprising | 03-05-2009 |
20090131620 | POLYIMIDE HAVING AN ALCOHOLIC HYDROXYL GROUP AND A PROCESS FOR THE PREPARATION THEREOF - This invention relates to a novel polyimide silicone having an alcoholic hydroxyl group and a process for the preparation thereof. The polyimide of the invention having a primary alcoholic hydroxyl group is represented by the following general formula (1), | 05-21-2009 |
20090156753 | SILPHENYLENE COMPOUND AND PROCESS FOR PRODUCING THE SAME - The present invention relates to a silphenylene compound represented by the following formula (1): | 06-18-2009 |
20100056730 | SOLVENT-FREE POLYIMIDE SILICONE RESIN COMPOSITION AND CURED PRODUCT THEREOF - A solvent-free polyimide silicone resin composition, and a cured product thereof, includes (A) a polyimide silicone resin having recurring units having a specific type of structure and having a weight average molecular weight of 5,000 to 150,000, (B) an epoxy resin, and (C) an epoxy resin curing agent wherein the resin composition having a fluidity at 25° C. and is free of a solvent. | 03-04-2010 |
20100233619 | NOVEL POLYIMIDE SILICONE, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE NOVEL POLYIMIDE SILICONE, AND METHOD FOR PATTERN FORMATION - A polyimide silicone having in the molecule a phenolic hydroxy group in which a part or all of hydrogen atoms are substituted with an acid labile group is provided. The polyimide silicone comprises the unit represented by the formula (1): | 09-16-2010 |
20110077374 | NOVEL POLYIMIDESILICONE HAVING ALCOHOLIC HYDROXYL GROUP AND PROCESS FOR PRODUCING THE SAME - The present invention provides a polyimidesilicone having a primary alcoholic hydroxyl group, which is represented by the following general formula (1): | 03-31-2011 |
20110082321 | ALCOHOLIC HYDROXYL-CONTAINING COMPOUNDS AND MAKING METHOD - Bisphenol derivatives having both alcoholic hydroxyl and allyl groups are novel and useful as reagents for modifying organic resins and silicone resins. | 04-07-2011 |
20110143103 | PHOTO-CURABLE RESIN COMPOSITION, PATTERN FORMING METHOD AND SUBSTRATE PROTECTING FILM, AND FILM-SHAPED ADHESIVE AND ADHESIVE SHEET USING SAID COMPOSITION - The invention relates to a photo-curable resin composition, which contains a polyimide silicone having a primary alcoholic hydroxyl group, as a component (A); at least one compound selected from the group consisting of an amino condensation product modified with formalin or a formalin-alcohol and a phenol compound having two or more in average of methylol group or alkoxymethylol group in one molecule thereof, as a component (B); and a photo-acid generator as a component (C). When used as an adhesive, the photo-curable resin composition further contains a multifunctional epoxy compound as a component (D). | 06-16-2011 |
20110251371 | POLYIMIDE RESIN PRODUCED BY USING SILPHENYLENE COMPOUND - The present invention relates to a polyimide resin produced by using silphenylene compound represented by the following formula (1) as a monomer: | 10-13-2011 |
20130029145 | WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY BONDING ARRANGEMENT, AND THIN WAFER MANUFACTURING METHOD - A laminate comprising a support, a temporary adhesive layer, and a wafer having a circuit-forming front surface and a back surface to be processed allows for processing the wafer. The temporary adhesive layer consists of a first temporary bond layer (A) of thermoplastic organosiloxane polymer which is releasably bonded to the front surface of the wafer and a second temporary bond layer (B) of thermosetting modified siloxane polymer which is laid contiguous to the first temporary bond layer and releasably bonded to the support. | 01-31-2013 |
20130108866 | WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY BONDING ARRANGEMENT, AND THIN WAFER MANUFACTURING METHOD | 05-02-2013 |
20130113083 | RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD THEREOF - A resin composition which can be formed into a film for use in molding a large diameter thin film wafer is provided. The composition comprises components (A) a silicone resin containing repeating units represented by the following formulae (1-1), (1-2), and (1-3) and having a weight average molecular weight as measured by GPC in terms of polystyrene of 3,000 to 500,000, | 05-09-2013 |
20130280886 | WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY BONDING ARRANGEMENT, AND THIN WAFER MANUFACTURING METHOD - A wafer processing laminate is provided comprising a support ( | 10-24-2013 |