| Patent application number | Description | Published |
|---|
| 20090062479 | Heat-curable polyimide silicone Composition and a cured film therefrom - A heat-curable resin composition, comprising
| 03-05-2009 |
| 20090062480 | Heat-curable polyimide silicone resin composition - A heat-curable polyimide silicone resin composition comprising | 03-05-2009 |
| 20090131620 | POLYIMIDE HAVING AN ALCOHOLIC HYDROXYL GROUP AND A PROCESS FOR THE PREPARATION THEREOF - This invention relates to a novel polyimide silicone having an alcoholic hydroxyl group and a process for the preparation thereof. The polyimide of the invention having a primary alcoholic hydroxyl group is represented by the following general formula (1), | 05-21-2009 |
| 20090156753 | SILPHENYLENE COMPOUND AND PROCESS FOR PRODUCING THE SAME - The present invention relates to a silphenylene compound represented by the following formula (1): | 06-18-2009 |
| 20100056730 | SOLVENT-FREE POLYIMIDE SILICONE RESIN COMPOSITION AND CURED PRODUCT THEREOF - A solvent-free polyimide silicone resin composition, and a cured product thereof, includes (A) a polyimide silicone resin having recurring units having a specific type of structure and having a weight average molecular weight of 5,000 to 150,000, (B) an epoxy resin, and (C) an epoxy resin curing agent wherein the resin composition having a fluidity at 25° C. and is free of a solvent. | 03-04-2010 |
| 20100233619 | NOVEL POLYIMIDE SILICONE, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE NOVEL POLYIMIDE SILICONE, AND METHOD FOR PATTERN FORMATION - A polyimide silicone having in the molecule a phenolic hydroxy group in which a part or all of hydrogen atoms are substituted with an acid labile group is provided. The polyimide silicone comprises the unit represented by the formula (1): | 09-16-2010 |
| 20110077374 | NOVEL POLYIMIDESILICONE HAVING ALCOHOLIC HYDROXYL GROUP AND PROCESS FOR PRODUCING THE SAME - The present invention provides a polyimidesilicone having a primary alcoholic hydroxyl group, which is represented by the following general formula (1): | 03-31-2011 |
| 20110082321 | ALCOHOLIC HYDROXYL-CONTAINING COMPOUNDS AND MAKING METHOD - Bisphenol derivatives having both alcoholic hydroxyl and allyl groups are novel and useful as reagents for modifying organic resins and silicone resins. | 04-07-2011 |
| 20110143103 | PHOTO-CURABLE RESIN COMPOSITION, PATTERN FORMING METHOD AND SUBSTRATE PROTECTING FILM, AND FILM-SHAPED ADHESIVE AND ADHESIVE SHEET USING SAID COMPOSITION - The invention relates to a photo-curable resin composition, which contains a polyimide silicone having a primary alcoholic hydroxyl group, as a component (A); at least one compound selected from the group consisting of an amino condensation product modified with formalin or a formalin-alcohol and a phenol compound having two or more in average of methylol group or alkoxymethylol group in one molecule thereof, as a component (B); and a photo-acid generator as a component (C). When used as an adhesive, the photo-curable resin composition further contains a multifunctional epoxy compound as a component (D). | 06-16-2011 |
