Patent application number | Description | Published |
20080316905 | Data Storage Device - A storage device including a storage medium for storing data in the form of topographic or magnetic marks. At least one probe is mounted on a common frame, the common frame and the storage medium designed for moving relative to each other for creating or detecting said marks. Each probe includes a tip facing the storage medium, a read sensing element, a write element and a capacitive platform, that forms a first electrode and is designed for a voltage potential applied to it independent from a control signal for said read sensing element and for said voltage potential applied to said capacitive platform being independent from a control signal for said write heating element. It further comprises a second electrode arranged in a fixed position relative to the storage medium forming a first capacitor together wherein said first electrode and a medium between the first and second electrode. | 12-25-2008 |
20090003188 | PROBE FOR SCANNING OVER A SUBSTRATE AND DATA STORAGE DEVICE - A data storage device comprises a storage medium for storing data in the form of marks and at least one probe for scanning the storage medium. The storage medium may be comprised in a substrate. The probe comprises a cantilever that comprises terminals serving as electrical contacts an being during operation of the probe mechanically fixed to a probe-holding structure, which may be a common frame of the data storage device. A probe further comprises a supporting structure, to which the terminals are mechanically directly coupled or coupled via hinges and which extends away from the terminals. A tip with a nanoscale apex is provided. A beam structure comprises a heating resistor and is attached at ends to the supporting structure. The beam structure is thinned at least in a direction parallel to an axis of the tip compared to an area of the supporting structure abutting the beam structure. | 01-01-2009 |
20090133914 | METHOD FOR PRODUCING AN INTEGRATED DEVICE AND A DEVICE PRODUCED THEREBY - A method for producing an integrated device. A source substrate is provided, the source substrate carrying one or more components to be attached to a receiver surface having a uneven topography. The source substrate includes a deformable layer on a surface on which the one or more components are carried. The source substrate is aligned such that said one or more components carried thereon are associated with contact areas of the receiver surface. The source substrate and the receiver surface are moved towards each other such that the one or more components are brought into contact with the contact areas wherein the deformable layer is at least partially deformed. The source substrate is removed such that the one or more of the components remain located on the contact areas of the receiver surface. | 05-28-2009 |
20090188108 | METHOD FOR ATTACHING A FLEXIBLE STRUCTURE TO A DEVICE AND A DEVICE HAVING A FLEXIBLE STRUCTURE - Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate. | 07-30-2009 |
20090211087 | METHOD AND SYSTEM FOR IMPROVING ALIGNMENT PRECISION OF PARTS IN MEMS - A method and system for improving alignment precision of MEMS parts during manufacturing are disclosed. According to the invention at least one of the MEMS parts comprises a cavity wherein a sphere or bearing is centered and preferably temporary blocked with a temperature dissipative material. When MEMS parts are in contact of the sphere or bearing, the temperature dissipative material is evaporated, offering a very low friction against two facing MEMS parts moving in different directions, enabling a very precise positioning. | 08-27-2009 |
20090245721 | THREE-DIMENSIONAL STACKED OPTICAL DEVICE - A three-dimensional stacked optical device includes a transparent substrate having at least one interconnect member, and an optical device mounted to the at least one interconnect member on the transparent substrate. The optical device includes a first surface coupled to the at least one interconnect member that extends to a second surface through an intermediate portion. An insulating layer encapsulates the optical device. The insulating layer includes a first surface that extends to a second surface. The first surface abuts the transparent substrate. A communication path extends between the first surface of the optical device and the second surface of the insulating layer. An electronic chip is mounted to the second surface of the insulating layer. The electronic chip includes a first surface and a second surface. The first surface is coupled to the communication path so as to form the three-dimensional stacked optical device. | 10-01-2009 |
20090245722 | THREE-DIMENSIONAL STACKED OPTICAL DEVICE - A three-dimensional stacked optical device includes a transparent substrate, and an optical device having a main body mounted to the transparent substrate. The optical device includes a plurality of vias that extend into the main body and do not extend into the transparent substrate. A conductive member is provided in each of the plurality of vias to form backside contacts. An electronic chip including a plurality of vias is mounted to the backside contacts on the optical device. Another conductive member is deposited in each of the plurality of vias formed in the electronic chip. The another conductive member forms additional backside contacts on the electronic chip. | 10-01-2009 |
20100077516 | PLATINUM SILICIDE TIP APICES FOR PROBE-BASED TECHNOLOGIES - Tips including a platinum silicide at an apex of a single crystal silicon tip are provided herein. Also, techniques for creating a tip are provided. The techniques include depositing an amount of platinum (Pt) on a single crystal silicon tip, annealing the platinum and single crystal silicon tip to form a platinum silicide, and selectively etching the platinum with respect to the formed platinum silicide. | 03-25-2010 |
20100090565 | MICRO-ELECTRO-MECHANICAL DEVICE WITH A PIEZOELECTRIC ACTUATOR - A micro-electro-mechanical device including a substrate with a main surface, a piezoelectric actuator with a first side mechanically coupled to the substrate, an elastic member with a first end mechanically coupled to the substrate, and a transfer member mechanically coupling a second side of the piezoelectric actuator to the elastic member. The piezoelectric actuator is positioned lateral to an unfixed region of the elastic member. The method includes applying a voltage to a piezoelectric actuator altering the piezoelectric actuator's dimension vertical to the main surface of the substrate; and mechanically transferring the alteration to a coupling point of an elastic member. | 04-15-2010 |
20120164813 | RESISTOR WITH IMPROVED SWITCHABLE RESISTANCE AND NON-VOLATILE MEMORY DEVICE - A resistor with improved switchable resistance includes a first electrode, a second electrode, and an insulating dielectric structure between the first and second electrodes. The insulating dielectric structure includes a confined conductive region providing a first resistance state and a second resistance state; the resistance state of the confined conductive region being switchable between the first and second resistance states by a control signal. | 06-28-2012 |
20120222294 | METHOD FOR PRODUCING AN INTEGRATED DEVICE - An article for producing an integrated device includes a deformable layer and one or more components releasably attached on one surface of the deformable layer. | 09-06-2012 |
20120227846 | STAMP WITH DRAINAGE CHANNELS FOR TRANSFERRING A PATTERN IN THE PRESENCE OF A THIRD MEDIUM - A micro-electro-mechanical device includes a substrate; a piezoelectric actuator disposed on the substrate; and an elastic member affixed to the substrate at a first end thereof, and mechanically coupled to the piezoelectric actuator; wherein the elastic member comprises at least one of: a notch, a groove, and a recess. | 09-13-2012 |
20120279763 | METHOD FOR ATTACHING A FLEXIBLE STRUCTURE TO A DEVICE AND A DEVICE HAVING A FLEXIBLE STRUCTURE - Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate. | 11-08-2012 |
20130082181 | NANO-TIP SPACERS FOR PRECISE GAP CONTROL AND THERMAL ISOLATION IN MEMS STRUCTURES - A THz radiation detector comprising a vertical antenna separated from a suspended platform by an isolating thermal air gap for concentrating THz radiation energy into a smaller suspended MEMS platform upon which a thermal sensor element is located. THz photon energy is converted into electrical energy via a thermally isolated air gap between plates of a coupling capacitor separated by a plurality of nano-tip spacers that determine the gap distance. The capacitor couples energy from the antenna to the thermal sensor. | 04-04-2013 |
20130082345 | Hybrid FPA for Thz imaging with an antenna array, coupled to CMOS-MEMS thermal sensors, implementing per-pixel ES actuation and enabling tuning, correlated double sampling and AM modulation - A THz radiation detector comprising a vertical antenna separated from a suspended platform by an isolating thermal air gap for concentrating THz radiation energy into a smaller suspended MEMS platform upon which a thermal sensor element is located. THz photon energy is converted into electrical energy via a thermally isolated air gap between plates of a coupling capacitor that couples energy from the antenna to the thermal sensor. The capacitor plates used for capacitive coupling of the received signal realize an electro-static actuator whereby the application of a DC bias varies the coupling capacitor gap. The DC bias causes the actuator to pull the suspended platform close to the antenna to reduce the capacitive gap, increasing the coupling capacitance, to touch the antenna array thus quickly discharging the heat induced in the sensor platform or to perform advanced readout operations, such as amplitude modulation and correlated double sampling. | 04-04-2013 |