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Michalk

Andrea Michalk, Wiesbaden DE

Patent application numberDescriptionPublished
20100197571EXTRUDATES WITH IMPROVED TASTE MASKING - The invention relates to extrudates comprising one or more pharmaceutically active substances, where the extrudates have a strand diameter of 0.5 mm or less, and to the use of these extrudates for the manufacture of medicaments.08-05-2010

Manfred Michalk, Erfurt DE

Patent application numberDescriptionPublished
20080258873Functional Laminate - The invention refers to a functional laminate including at least one electrically conductive component, particularly an antenna coil or a track, arranged on a non-woven substrate with a grammage of less than 25 g/m10-23-2008
20090085226METHOD AND ARRANGEMENT FOR CONTACT-CONNECTING SEMICONDUCTOR CHIPS ON A METALLIC SUBSTRATE - The method comprises the following steps: the substrate in the form of a one-piece basic substrate (04-02-2009
20090291271FUNCTIONAL LAMINATE - The invention refers to a functional laminate (11-26-2009
20100201586METHOD TO STRIP A PORTION OF AN INSULATED WIRE - According to the method of stripping a portion of a wire of the invention, the insulated wire including the wire core are first flattened before the insulation is stripped away. The flattening eases the stripping as the insulation is partially cracked and dissociated of the wire core, and the stripping is more efficiently applied on a flat surface. A wire stripping machine and a transponder antenna with stripped portions are also claim as being part of the invention.08-12-2010
20100230151Circuit layout and method and device for producing a circuit pattern on a substrate - A circuit layout having a substrate with at least one electronic component, wherein contacts of the electronic component are electrically connected to contacting regions of a conductor strip. Furthermore, a method for producing a circuit pattern is provided, whereby at least one conductor strip is attached onto at least one surface side of the substrate, the conductor strip being coated with a meltable insulating varnish and whereby the insulating varnish is heated and the conductor strip is pressed onto the substrate. A device is also provided for producing a circuit pattern comprising a conductor strip coil and a cylindrical or conical laying tool, which at least over a part of its length has an interior bore guiding the conductor strip and an annular active area arranged perpendicular to its longitudinal axis and merging in inner and outer radius.09-16-2010

Patent applications by Manfred Michalk, Erfurt DE

Martin Michalk, Leipzig DE

Patent application numberDescriptionPublished
20090085226METHOD AND ARRANGEMENT FOR CONTACT-CONNECTING SEMICONDUCTOR CHIPS ON A METALLIC SUBSTRATE - The method comprises the following steps: the substrate in the form of a one-piece basic substrate (04-02-2009

Vincent Michalk, Montreal CA

Patent application numberDescriptionPublished
20100130094INTERLOCKING PANEL AND KIT OF SUCH PANELS - A modular system for forming without tools a variety of 3-dimensional structures comprises panels (05-27-2010