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Michael Teich

Michael Teich, Moritzburg Ot Friedewald DE

Patent application numberDescriptionPublished
20080212078ARRANGEMENT AND METHOD FOR FOCUSING A MULTIPLANE IMAGE ACQUISITION ON A PROBER - The invention relates to a system and a method for capturing images in a prober. According to the invention, the surface of a test object is illuminated in succession with light of a first, second and third color; and an image capturing device records a gray scale image of the surface; and a composite image is produced from the three gray scale images by means of an image evaluating device. The object of the invention is to qualitatively improve the image capturing, in order to raise the positioning accuracy by means of an improved display, as a result of which, finely structured test objects can be used. This object of the invention is achieved in that the lighting device is designed as a unit, which can be controlled by the image evaluating unit and which produces at least three colors and which exhibits at least one light emitting diode (LED) as the lighting means.09-04-2008
20080224426CHUCK WITH TRIAXIAL CONSTRUCTION - A chuck with triaxial construction comprises a receiving surface for a test substrate and arranged below the receiving surface: an electrically conductive first surface element, an electrically conductive second surface element electrically insulated therefrom, and an electrically conductive third surface element electrically insulated therefrom, and, between the first and the second surface element, a first insulation element and, between the second and the third surface element, a second insulation element. A chuck for very low current measurements which can be used to prevent the occurrence of leakage currents and a triboelectric charge and which is configured favourably in terms of production, is achieved because at least one of the electrically conductive surface elements is mechanically connected to at least one insulation element and has an elasticity that compensates for an expansion difference resulting from differences in different coefficients of expansion between a respective surface element and an adjoining insulation element.09-18-2008
20100045265METHOD AND DEVICE FOR FORMING A TEMPORARY ELECTRICAL CONTACT TO A SOLAR CELL - In a method and devices for forming a temporary electrical contact to a solar cell for testing purposes, probes form a contact to the electrode terminals of a solar cell held by a sample holder. The probes are held by a probe holder and exhibit an elastic, electrically conductive contact element and at least one reference sensor. In order to form a contact, the solar cell and the probes are positioned in relation to each other, and then a probe is placed on an electrode terminal of the solar cell. To this end, a feed motion of the probe is carried out until a reference sensor of the probe generates a reference signal upon reaching a predefined distance. Then the feed motion is continued by a predefined path that goes beyond the contact element making contact with the electrode terminal, in order to carry out an overtravel.02-25-2010
20110013011ARRANGEMENT AND METHOD FOR FOCUSING A MULTIPLANE IMAGE ACQUISITION ON A PROBER - A focused multi-planar image acquisition in real time even while a test object is moving, is achieved with a system and a method for a focused multi-planar image acquisition in a prober. When a surface of a test object is positioned laterally in relation to tips of separated probe needles, a microscope is focused on the surface of the test object at a first time and on a plane of the probe needles at a second time. The objective lens is provided with a microscope objective lens focusing system, which can focus the objective lens, independently of a vertical adjustment drive of the microscope, on the surface of the test object in a first focal plane and in a second focal plane, which is on a level with the probe needle tips.01-20-2011

Patent applications by Michael Teich, Moritzburg Ot Friedewald DE

Michael Teich, Friedewald DE

Patent application numberDescriptionPublished
20100289511METHOD FOR TESTING A TEST SUBSTRATE UNDER DEFINED THERMAL CONDITIONS AND THERMALLY CONDITIONABLE PROBER - In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.11-18-2010

Michael Teich, Moritz Ot Friedewald DE

Patent application numberDescriptionPublished
20100045264PROBE FOR TEMPORARILY ELECTRICALLY CONTACTING A SOLAR CELL - A probe for temporarily electrically contacting a solar cell for testing purposes, has at least one elastic, electrically conductive contact element for producing the electrical contact, at least one reference sensor for indicating a distance of the contact element to an external reference surface using an electrical signal of the reference sensor, and a mounting plane to which the tip of the contact element is oriented. The probe ensures a secure electrical contact of the solar cell in a testing station with minimal mechanical stress, and is also suitable for use in an industrial continuous production method.02-25-2010

Michael Teich, Moritzburg DE

Michael Teich, Riedewald DE

Patent application numberDescriptionPublished
20080298671Method For Increasing The Accuracy Of The Positioning Of A First Object Relative To A Second Object - A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method. The relative displacement determined at the second instant is used to correct the positioning of the first and second objects as necessary to maintain a desired position of the two objects.12-04-2008