Patent application number | Description | Published |
20080205026 | Electromagnetic Compliance Spring of Drive Carrier - Systems and arrangements to provide electromagnetic compliance (EMC) for a drive carrier are disclosed. Embodiments may include an EMC spring. The EMC spring may include a shield portion to fasten to one side of a frame of the drive carrier and multiple fingers attached to the shield portion. At least one of the fingers may include an upper spring section to contact an adjoining drive carrier as the drive carrier is inserted into a computing device and a lower spring section. The lower spring section may be folded over against the upper spring section and attached to the shield portion of the spring. The lower spring section may deflect in response to the upper spring section contacting the adjoining drive carrier. In some embodiments, a lead in portion of the upper spring section may deflect to a position nearly parallel to the adjoining drive carrier. | 08-28-2008 |
20090116178 | Data Communications And Power Distribution In A Computer Equipment Rack - Methods and computer equipment racks configured for data communications and power distribution are disclosed that include a plurality of servers mounted horizontally, each server having a power distribution connection and one or more switch connections; one or more power distribution units (‘PDUs’) mounted vertically; and one or more network switches mounted vertically, each network switch comprising one or more rows of switch connections. | 05-07-2009 |
20110157829 | Container-based data center having greater rack density - A container includes first and second long sides parallel to the container's length. Racks are organized in rows parallel to the container's width. Each rack is receptive to installation of equipment along a height of the data rack parallel to the container's height. Openings are defined within the first and/or second long sides of the container. Heat exchangers may be installed, where each exchanger is installed on a rack to cool air exhausted by any equipment installed on this rack. Each row may include as many of the racks positioned side-to-side, length-wise, and parallel to the width of the container as can fit within the container. The racks of each row may be slidable in unison back and forth along the length of the container, between a first position at which the racks block an opening and a second position at which the racks block another opening. | 06-30-2011 |
20120009810 | DUAL FORCE SINGLE POINT ACTUATION INTEGRATED LOAD MECHANISM FOR SECURING A COMPUTER PROCESSOR TO A SOCKET - A dual force single point actuation integrated load mechanism for securing a computer processor to a socket, the dual force single point actuation integrated load mechanism including a base mounted around the socket; and a load plate rotatably coupled to the base and secured to the base when an activate lever and a hinge lever are secured above the load plate. | 01-12-2012 |
20120075806 | Container-based data center having greater rack density - A container includes first and second long sides parallel to the container's length. Racks are organized in rows parallel to the container's width. Each rack is receptive to installation of equipment along a height of the data rack parallel to the container's height. Openings are defined within the first and/or second long sides of the container. Heat exchangers may be installed, where each exchanger is installed on a rack to cool air exhausted by any equipment installed on this rack. Each row may include as many of the racks positioned side-to-side, length-wise, and parallel to the width of the container as can fit within the container. The racks of each row may be slidable in unison back and forth along the length of the container, between a first position at which the racks block an opening and a second position at which the racks block another opening. | 03-29-2012 |
20120123595 | CONTROLLING FLUID COOLANT FLOW IN COOLING SYSTEMS OF COMPUTING DEVICES - Methods and systems for controlling fluid coolant flow in cooling systems of computing devices are disclosed. According to an aspect, a method may include determining a temperature of a fluid coolant in a cooling system of a computing device. For example, a temperature of water exiting a cooling system of a server may be determined. The method may also include determining an operational condition of the computing device. For example, a temperature of a processor, memory, or input/output (I/O) component may be determined. Further, the method may include controlling a flow of the fluid coolant through the cooling system based on the temperature of the fluid coolant and/or the operational condition. | 05-17-2012 |
20130074339 | Overmolded Dual In-Line Memory Module Cooling Structure - Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph. | 03-28-2013 |
20140060798 | Configuring A Liquid Cooling System Associated With Electrical Computing Racks - Apparatuses and computer program products for configuring a liquid cooling system are provided. Embodiments include a valve controller determining a temperature of liquid within a particular portion of the liquid cooling system; determining whether the temperature of the liquid within the particular portion of the liquid cooling system exceeds a predetermined threshold; if predetermined threshold is not exceeded, configuring, one or more valves such that liquid directly exiting a first liquid cooling apparatus of a first electrical component rack is used in a second liquid cooling apparatus to cool a second electrical component rack; and if the predetermined threshold is exceeded, configuring the one or more valves such that liquid directly exiting a main supply line of the liquid cooling system is used in the second liquid cooling apparatus to cool the second electrical component rack. | 03-06-2014 |
20140060799 | Configuring A Liquid Cooling System Associated With Electrical Computing Racks - Configuring a liquid cooling system according to a particular embodiment of the present invention include a valve controller determining a temperature of liquid within a particular portion of the liquid cooling system; determining whether the temperature of the liquid within the particular portion of the liquid cooling system exceeds a predetermined threshold; if predetermined threshold is not exceeded, configuring, one or more valves such that liquid directly exiting a first liquid cooling apparatus of a first electrical component rack is used in a second liquid cooling apparatus to cool a second electrical component rack; and if the predetermined threshold is exceeded, configuring the one or more valves such that liquid directly exiting a main supply line of the liquid cooling system is used in the second liquid cooling apparatus to cool the second electrical component rack. | 03-06-2014 |
20140093251 | OPTICAL INTERCONNECTION TO AN INTEGRATED CIRCUIT - A system comprises an interposer positioned between an integrated circuit and a system planar. An electrical/optical transceiver is coupled to the interposer, wherein the electrical/optical transceiver converts electrical signals into optical signals. The interposer comprises a first set of electrical conductors that is electrically coupled to non-Input/Output (I/O) electrical connectors on the integrated circuit, and wherein the first set of electrical conductors passes through the interposer to directly connect the non-I/O electrical connectors on the integrated circuit to the system planar. The interposer further comprises a second set of electrical conductors that is electrically coupled to input/output (I/O) electrical connectors on the integrated circuit, wherein the second set of electrical conductors traverses through the interposer to the electrical/optical transceiver to convert electrical I/O signals from the integrated circuit into optical I/O signals. | 04-03-2014 |
20140240920 | SYSTEM FOR MOUNTING AND COOLING A COMPUTER COMPONENT - A system includes a support rack and a component housing. The support rack includes a pair of vertically-extending panels, and each panel of the pair of vertically-extending panels has one or more first mating members of a water coupler pair extending outwardly from the support rack. The component housing is slidably disposed between the pair of vertically-extending panels and has a front panel, a pair of sidewalls extending rearwardly from the front panel, a component water line, and two second mating members of the water coupler pair connected to each other by the component water line. | 08-28-2014 |
20150033550 | OVERMOLDED DUAL IN-LINE MEMORY MODULE COOLING STRUCTURE - Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph. | 02-05-2015 |