Patent application number | Description | Published |
20080248331 | Coating composition - The invention relates to organic coating compositions useful for photolithographic processes including the manufacture of semiconductors and other electronic devices. Compositions of the invention comprise component that comprise a nitrile-containing component, such as a resin component that contains nitrile moieties. Compositions of the invention are particularly useful as an underlayer material in two, three, four or more layer pattern forming processes. | 10-09-2008 |
20090148789 | Coating compositions for use with an overcoated photoresist - In one aspect, the invention relates to silicon-containing organic coating compositions, particularly antireflective coating compositions, that contain a repeat unit wherein chromophore moieties such as phenyl are spaced from Si atom(s). In another aspect, silicon-containing underlayer compositions are provided that are formulated as a liquid (organic solvent) composition, where at least one solvent of the solvent component comprise hydroxy groups. | 06-11-2009 |
20090233224 | Compositions and processes for photolithography - Overcoating layer compositions are provided that are applied above a photoresist composition including for immersion lithography processing as well as non-immersion imaging. | 09-17-2009 |
20100297539 | ANTIREFLECTIVE HARD MASK COMPOSITIONS - The invention includes new organic-containing compositions that can function as an antireflective layer for an overcoated photoresist. Compositions of the invention also can serve effectively as a hard mask layer by exhibiting a sufficient plasma etch selectivity from an undercoated layer. Preferred compositions of the invention have a high Si content and comprise a blend of distinct resins. | 11-25-2010 |
20110123937 | COMPOSITIONS AND PROCESSES FOR IMMERSION LITHOGRAPHY - The present invention relates to barrier layer compositions that are applied above a photoresist composition for immersion lithography processing. In a further aspect, new methods are provided for immersion lithography processing. | 05-26-2011 |
20110143281 | COATING COMPOSITIONS FOR PHOTORESISTS - In one aspect, the present invention relates to coating compositions that comprise a resin component, wherein the predominant portion of the resin component comprising one or more resins that are at least substantially free of fluorine. Coating compositions of the invention are useful as photoresist overcoat layers, including in immersion lithography processing. | 06-16-2011 |
20130082089 | CURABLE FLUX COMPOSITION AND METHOD OF SOLDERING - A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; a fluxing agent represented by formula I: | 04-04-2013 |
20130082092 | Curable Amine, Carboxylic Acid Flux Composition And Method Of Soldering - A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; and, an amine fluxing agent represented by formula I: | 04-04-2013 |
20130082093 | Amine, Carboxylic Acid Flux Composition And Method Of Soldering - A flux composition is provided, comprising, as initial components: a carboxylic acid; and, an amine fluxing agent represented by formula I: | 04-04-2013 |
20130082094 | POLYAMINE, CARBOXYLIC ACID FLUX COMPOSITION AND METHOD OF SOLDERING - A flux composition is provided, comprising, as initial components: a carboxylic acid; and, a polyamine fluxing agent represented by formula I: | 04-04-2013 |
20130082095 | Flux Composition And Method Of Soldering - A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I: | 04-04-2013 |
20140030653 | COATING COMPOSITIONS FOR PHOTOLITHOGRAPHY - Underlying coating compositions are provided that comprise one or more resins comprising one or more modified imide groups. These coating compositions are particularly useful as antireflective layers for an overcoated photoresist layer. Preferred systems can be thermally treated to increase hydrophilicity of the composition coating layer to inhibit undesired intermixing with an overcoated organic composition layer, while rendering the composition coating layer removable with aqueous alkaline photoresist developer. | 01-30-2014 |
20140117503 | EPHEMERAL BONDING - Compositions suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate, are disclosed. Methods of temporarily bonding two surfaces, such as the active side of a wafer and a substrate using the compositions disclosed herein are also provided. | 05-01-2014 |
20140117504 | EPHEMERAL BONDING - Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer. | 05-01-2014 |
20140120242 | ADHESION PROMOTER - Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, to a substrate are provided. Also provided are methods of improving the adhesion of coating compositions to a substrate. | 05-01-2014 |
20140120244 | ADHESION PROMOTER - Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate. | 05-01-2014 |
20150064851 | PRE-APPLIED UNDERFILL - Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first polymer region and a second polymer region, wherein the second polymer region comprises inorganic filler. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-layer structured pre-applied underfill. | 03-05-2015 |
20150072290 | COATING COMPOSITIONS - In one aspect, coating compositions are provided that comprise a component a component that comprises one or more silicon, antimony, aluminum, yttrium, cerium, lanthanum, tin, titanium, zirconium, hafnium, indium or zinc compounds. In another aspect, coating compositions are provided that comprise a plurality of discrete particles. Preferred coating compositions of the invention are useful for antireflective purposes, particularly with an underlaying photoresist coating layer, as well as for a barrier layer in immersion lithography. | 03-12-2015 |