| Patent application number | Description | Published |
|---|
| 20080217288 | METHOD OF MANUFACTURING A MAGNETIC SENSOR WITH TILTED MAGNETORESISTIVE STRUCTURES - A method of manufacturing a magnetic field sensor device in one embodiment includes applying a mask on a substrate, performing a wet etching procedure on the substrate for generating at least a first groove having tilted side walls, and depositing at least one layer of magnetoresistive material onto a section of the surface of at least a first tilted side wall of the groove. A method of manufacturing a magnetic field sensor device on a substrate having a plurality of tilted planar sections, each of the tilted planar sections having a surface normal angled with respect to a surface normal of the substrate is also provided. The method includes depositing a magnetoresistive layered structure positioned at each of the tilted planar sections of the substrate, wherein the tilted planar sections are oriented such that a direction of an applied magnetic field in at least one of an x-, y- and z-direction relative to the substrate is detectable based on field-induced resistance changes of the magnetoresistive layered structures. | 09-11-2008 |
| 20100037936 | SOLAR CELL ASSEMBLIES AND METHOD OF MANUFACTURING SOLAR CELL ASSEMBLIES - Solar cell assemblies and method of making solar cell assemblies. The method, including: fabricating solar cell chips on solar cell wafers; dicing the solar cell wafers into individual solar cell chips; packaging the individual solar cell chips in molded plastic packages to form solar cell chip packages; and mounting on and electrically connecting one or more of the solar cell chip packages to a printed circuit board. The assemblies including a printed circuit board; one or more solar cell chip packages mounted on and electrically connected to the printed circuit board, each of said one or more solar chip packages comprising a solar cell chip and a lead frame encapsulated in a molded plastic body, top surfaces the solar cell chips exposed in top surfaces of the molded plastic bodies. | 02-18-2010 |
| 20100037939 | METHODS OF FABRICATING SOLAR CELL CHIPS - A method of fabricating solar cell chips. The method includes creating an integrated circuit chip process route for fabricating integrated circuit chips using integrated circuit wafers in an integrated circuit fabrication facility; creating a solar cell process route for fabricating solar cells using solar cell wafers in the integrated circuit fabrication facility; releasing integrated circuit chip wafers and solar cell wafers into tool queues of tools of the an integrated circuit fabrication facility; and processing the solar cell wafers on at least some tools of the integrated circuit fabrication facility used to process the integrated circuit wafers. Also the process used to fabricate the solar cell chips. | 02-18-2010 |
| 20100050428 | Method for Manufacturing a Solar Module - A method for manufacturing a solar concentrator cell module assembly within an integrated circuit process, which solar concentrator cell module assembly includes at least one solar device and which solar device includes one printed circuit board and one Fresnel lens. A printed circuit board is assembled according to a pre-defined circuit board base design layout that allows pick and place of a single solar concentrator cell chip onto a circuit board base. Connections are provided for the solar concentrator cell chip in a serialized or a parallelized arrangement on the circuit board base, and a plurality of openings are formed in the circuit board base below a backside of the solar concentrator chip to enable attachment of cooling fingers. A solar device based on a solar device layout is assembled using the assembled circuit board base and one Fresnel lens, the solar device having a solar concentration ratio by modifying the solar device surface versus the solar cell surface and covering a full extension of the circuit board base, which circuit board base provides means for interconnecting a plurality of the solar devices to one another to form the solar concentrator cell module assembly. | 03-04-2010 |
| 20100132760 | BACKSIDE CONTACTING ON THIN LAYER PHOTOVOLTAIC CELLS - A method of backside contacting of thin layer photovoltaic cells having Si elements as well as thin film cells, like CIGS, is provided, including the following steps:
| 06-03-2010 |
| 20100297802 | SOLAR CELL ASSEMBLIES AND METHOD OF MANUFACTURING SOLAR CELL ASSEMBLIES - Solar cell assemblies and method of making solar cell assemblies. The method, including: fabricating solar cell chips on solar cell wafers; dicing the solar cell wafers into individual solar cell chips; packaging the individual solar cell chips in molded plastic packages to form solar cell chip packages; and mounting on and electrically connecting one or more of the solar cell chip packages to a printed circuit board. The assemblies including a printed circuit board; one or more solar cell chip packages mounted on and electrically connected to the printed circuit board, each of said one or more solar chip packages comprising a solar cell chip and a lead frame encapsulated in a molded plastic body, top surfaces the solar cell chips exposed in top surfaces of the molded plastic bodies. | 11-25-2010 |
| 20100304519 | METHOD OF FABRICATING SOLAR CELL CHIPS - A method of fabricating solar cell chips. The method includes creating an integrated circuit chip process route for fabricating integrated circuit chips using integrated circuit wafers in an integrated circuit fabrication facility; creating a solar cell process route for fabricating solar cells using solar cell wafers in the integrated circuit fabrication facility; releasing integrated circuit chip wafers and solar cell wafers into tool queues of tools of the an integrated circuit fabrication facility; and processing the solar cell wafers on at least some tools of the integrated circuit fabrication facility used to process the integrated circuit wafers. Also the process used to fabricate the solar cell chips. | 12-02-2010 |
