Patent application number | Description | Published |
20090098357 | Structural Insulation Sheathing - Structural insulation sheathing (SIS), preferably in the form of a panel, comprises a structural facer and an insulation member. The structural facer and insulation members are in intimate, planar contact with one another, both are plastic, and the SIS structure meets both the structural (i.e., ASTM E72) and insulation (R>2) requirements for the North American residential market. The structural facer member of the SIS structure is high-density polyolefin foam. The structural facer comprises a skin/core structure with the skins of a higher density than the core, and the structural facer has a flexural modulus typically of at least about 30,000 pounds per square inch (psi). The insulation member of the SIS is a foamed sheet of thermoplastic, e.g., polyisocyanurate. | 04-16-2009 |
20090113831 | STRUCTURAL INSULATION SHEATHING - Structural insulation sheathing (SIS), preferably in the form of a panel, comprises a structural member and an insulation member. The structural member and insulation members are in intimate, planar contact with one another, and the SIS structure meets both the structural (that is, AC 269) and insulation (R>2) requirements for the North American residential market. The structural 23 member of the SIS structure is multi-layer laminated paperboard. The insulation member of the SIS is a foamed sheet of a thermoplastic material such as polyisocyanurate. | 05-07-2009 |
20090263645 | Anisotropic Foam-Film Composite Structures - Multilayer foam-film composite structures in which the cells of at least one foam layer have an anisotropic orientation exhibit at least one enhanced property of toughness, tear resistance and puncture resistance in comparison with a foam-film composite structure alike in all aspects except for the anisotropic orientation of the cells of at least one foam layer. | 10-22-2009 |
20110183540 | CONNECTOR DEVICE FOR BUILDING INTEGRATED PHOTOVOLTAIC DEVICE - The present invention is premised upon a connector device and method that can more easily electrically connect a plurality of PV devices or photovoltaic system components and/or locate these devices/components upon a building structure. It also may optionally provide some additional sub-components (e.g. at least one bypass diode and/or an indicator means) and may enhance the serviceability of the device. | 07-28-2011 |
20110285048 | Anisotropic Foam-Film Composite Structures - Multilayer foam-film composite structures in which the cells of at least one foam layer have an anisotropic orientation exhibit at least one enhanced property of toughness, tear resistance and puncture resistance in comparison with a foam-film composite structure alike in all aspects except for the anisotropic orientation of the cells of at least one foam layer. | 11-24-2011 |
20130112270 | ELECTRONIC DEVICE MODULE COMPRISING AN ETHYLENE MULTI-BLOCK COPOLYMER - An electronic device module comprises:
| 05-09-2013 |
20130118583 | ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER - An electronic device module comprising:
| 05-16-2013 |
20140007534 | WALL STRUCTURE WITH ENHANCED CLADDING SUPPORT - A building structure includes a framework of: (a) metal studs having walls that define an interior channel; (b) a cellular backing material extending lengthwise within the interior channel of at least a portion of the metal studs; (c) a thermally insulating layer extending over multiple metal studs; (d) fasteners extending through the thermally insulating layer, through a wall of a metal stud and into the cellular backing material within the interior channel of the metal stud; and (e) a cladding attached to the framework of metal studs by means of the fasteners. | 01-09-2014 |
20150072541 | CONNECTOR DEVICE FOR BUILDING INTEGRATED PHOTOVOLTAIC DEVICE - The present invention is premised upon a connector device and method that can more easily electrically connect a plurality of PV devices or photovoltaic system components and/or locate these devices/components upon a building structure. It also may optionally provide some additional sub-components (e.g. at least one bypass diode and/or an indicator means) and may enhance the serviceability of the device. | 03-12-2015 |