| Patent application number | Description | Published |
|---|
| 20090135583 | DISPLAY SYSTEM WITH DISTRIBUTED LED BACKLIGHT - A display system with a distributed LED backlight includes: providing a plurality of tile LED light sources, each tile LED light source having a tile and a plurality of similar LED light sources on each tile connected for emitting light therefrom; orienting the plurality of tile LED light sources for illuminating a display from the back of the display; and integrating the plurality of tile LED light sources into a thermally and mechanically structurally integrated distributed LED tile matrix backlight light source. | 05-28-2009 |
| 20090145802 | STORAGE SYSTEM FOR COMPONENTS INCORPORATING A LIQUID-METAL THERMAL INTERFACE - Embodiments of an apparatus that functions as a storage system for components are described. This apparatus includes a containment vessel enclosing a desiccant and a device. This device includes a layer mechanically coupled to a component, where the component can be one of a semiconductor die and a heat-removal device. Moreover, a thermal-interface material is coupled to a region of the layer, and a boundary material is mechanically coupled to the layer, where a perimeter defined by the boundary-material surrounds the region. | 06-11-2009 |
| 20090146294 | GASKET SYSTEM FOR LIQUID-METAL THERMAL INTERFACE - Embodiments of an apparatus are described. This apparatus includes a semiconductor-die layer mechanically coupled to a semiconductor die, and a heat-removal-device layer mechanically coupled to a heat-removal device. Moreover, a thermal-interface material is included between the semiconductor die and the heat-removal device, where the thermal-interface material is mechanically coupled to a region of the semiconductor-die layer and to a region of the heat-removal-device layer. Additionally, a boundary material is mechanically coupled to the semiconductor-die layer and the heat-removal-device layer, where the thermal-interface material is contained in a cavity defined, at least in part, by the semiconductor-die layer, the boundary material, and the heat-removal-device layer. | 06-11-2009 |
| 20090149021 | SPRAY DISPENSING METHOD FOR APPLYING LIQUID METAL - Embodiments of a method for applying a thermal-interface material are described. During this method, a first surface of a heat-removal device and a second surface of a semiconductor die are prepared. Next, a region on a given surface, which is at least one of the first surface and the second surface, is defined. Then, the thermal-interface material is applied to at least the region, where the thermal-interface material includes a material that is a liquid metal over a range of operating temperatures of the semiconductor die. | 06-11-2009 |
| 20100081229 | METHOD OF ASSEMBLING INTEGRATED CIRCUIT COMPONENTS - The disclosure identified as methods of mounting integrated circuits, including solar cells, to a substrate wherein the circuits are mounted prior to being singulated into discrete die. Once the semiconductor die sites or other circuits are formed on a wafer, the wafer will be attached, either whole, or divided into one or more multi-die site wafer segments, to a substrate. This attachment may be by conventional surface mount technology, for example. After such mounting, the individual die sites on the wafer segments will be singulated to form discrete die already mounted to the supporting substrate. The singulation may be preferably performed by laser dicing of the wafer segments. | 04-01-2010 |
| 20100092845 | PORTABLE COMPUTER BATTERY STRUCTURES - Portable computer battery structures are provided. The portable computer battery structures may include a battery with a metal enclosure and a battery cable with a floating end. The battery may have six cells. Three pairs of parallel-connected cells may be connected together in series. The six cells may be substantially planar in shape. The battery may have a connector with at least five conductive pins and six recesses. The battery cable may have a cable with at least five conductive pins that mate with the five pins of the battery's connector and with six support pins that slide into the six recesses of the battery's connector. The batter connector may be formed on a printed circuit board substrate that folds over on itself. | 04-15-2010 |
| 20100246133 | METHOD AND APPARATUS FOR DISTRIBUTING A THERMAL INTERFACE MATERIAL - Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip. | 09-30-2010 |
| 20110149502 | PORTABLE HARD DRIVE AND MOUNTING STRUCTURE FOR SAME - A portable computing device having an outer housing, and internal hard disk drive and a shock damping mounting assembly is disclosed. Multiple outer dimensions of the portable computing device can be less than the width of the hard drive due to a diagonal arrangement of the hard drive within the overall device. The hard drive can comply with a standardized form factor, such as a 3.5 inch form factor. A mounting assembly located within the outer housing and coupled to the hard drive can include one or more components adapted to damp a mechanical shock to the hard drive, which components can be mounted to corners and/or edges of the hard drive. Mounting assembly components can includes a first stage spring comprising a finger geometry that provides initial damping of the mechanical shock and a second stage spring comprising an elastic block that provides final damping of the mechanical shock. | 06-23-2011 |
