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Michael Beck
Michael Beck, Saint Joseph, MO US
| Patent application number | Description | Published |
|---|---|---|
| 20100272759 | MODIFIED LIVE VACCINE OF MYCOPLASMA BOVIS, METHODS OF PRODUCING MODIFIED LIVE MYCOPLASMA BOVIS VACCINES, COMBINATION VACCINES AND METHODS OF TREATMENT - The present invention relates to new attenuated | 10-28-2010 |
Michael Beck, Stephanskirchen DE
| Patent application number | Description | Published |
|---|---|---|
| 20100228385 | System, method and operating unit for forming mixed layers for pallets | 09-09-2010 |
Michael Beck, Dresden DE
| Patent application number | Description | Published |
|---|---|---|
| 20090194850 | Crack Stops for Semiconductor Devices - Crack stops for semiconductor devices, semiconductor devices, and methods of manufacturing semiconductor devices are disclosed. In one embodiment, a barrier structure for a semiconductor device includes a plurality of substantially V-shaped regions. Each of the plurality of substantially V-shaped regions is disposed adjacent another of the plurality of substantially V-shaped regions. | 08-06-2009 |
| 20100054022 | Method and Apparatus for Reducing Charge Trapping in High-K Dielectric Material - In one embodiment, an integrated circuit includes a memory array having a plurality of capacitors for storing data of an initial state in the memory array in an initial state. The integrated circuit also includes circuitry for occasionally inverting the data stored by the plurality of capacitors and tracking whether the current state of the data stored by the plurality of capacitors corresponds to the initial state. The circuitry inverts the data read out of the memory array during a read operation when the current state of the data does not correspond to the initial state. | 03-04-2010 |
| 20100099253 | Method for Structuring a Layered Stack - One implementation is a method for fabricating a semiconductor on a substrate. A first layer is formed on the substrate. An implanted pattern is introduced into the first layer by implanting using a structured implantation mask arranged over the first layer. A structured second layer is formed on the first layer after removing the implantation mask. A first pattern is generated in the substrate using the second layer as a mask. The first layer is developed with regard to the implanted pattern. A second pattern is generated in the substrate using the first layer as a mask. | 04-22-2010 |
Michael Beck, Milpitas, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100013104 | INTEGRATED CIRCUIT HARD MASK PROCESSING SYSTEM - An integrated circuit processing system is provided including a substrate having an integrated circuit; an interconnect layer over the integrated circuit; a low-K dielectric layer over the interconnect layer; a hard mask layer over the low-K dielectric layer; a via opening through the hard mask layer and the low-K dielectric layer to the interconnect layer; and an interconnect metal in the via opening. | 01-21-2010 |
Michael Beck, Monheim DE
| Patent application number | Description | Published |
|---|---|---|
| 20090221596 | Substtituted aryl oximes - The invention relates to compounds of the formula (I) | 09-03-2009 |
| 20090247551 | SUBSTITUTED ENAMINOCARBONYL COMPOUNDS - The present invention relates to novel substituted enaminocarbonyl compounds, to processes for their preparation and to their use for controlling animal pests, especially arthropods, in particular insects. | 10-01-2009 |
Michael Beck, St. Joseph, MO US
| Patent application number | Description | Published |
|---|---|---|
| 20090130148 | MYCOPLASMA BOVIS VACCINE AND METHODS OF USE THEREOF - The present invention relates to new attenuated | 05-21-2009 |
Michael Beck, Dressen DE
| Patent application number | Description | Published |
|---|---|---|
| 20090008361 | OXIDANT AND PASSIVANT COMPOSITION AND METHOD FOR USE IN TREATING A MICROELECTRONIC STRUCTURE - A composition that may be used for cleaning a metal containing conductor layer, such as a copper containing conductor layer, within a microelectronic structure includes an aqueous acid, along with an oxidant material and a passivant material contained within the aqueous acid. The composition does not include an abrasive material. The composition is particularly useful for cleaning a residue from a copper containing conductor layer and an adjoining dielectric layer that provides an aperture for accessing the copper containing conductor layer within a microelectronic structure. | 01-08-2009 |
Michael Beck, Hanau DE
| Patent application number | Description | Published |
|---|---|---|
| 20080293935 | Method for the Production of 2,4,6- Trimercapto-1,3,5-Triazine - The present invention is directed towards a method for the production of 2,4,6-trimercapto-1,3,5-triazine (TMT-H | 11-27-2008 |
Michael Beck, San Jose, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20080265409 | INTEGRATED CIRCUIT HARD MASK PROCESSING SYSTEM - An integrated circuit hard mask processing system is provided including providing a substrate having an integrated circuit; forming an interconnect layer over the integrated circuit; applying a low-K dielectric layer over the interconnect layer; applying a hard mask layer over the low-K dielectric layer; forming a via opening through the hard mask layer and the low-K dielectric layer to the interconnect layer; applying a first fluid and a second fluid in the via opening for removing an overhang of the hard mask layer; depositing an interconnect metal in the via opening; and chemical-mechanical polishing the interconnect metal and the ultra low-K dielectric layer. | 10-30-2008 |