Patent application number | Description | Published |
20120248477 | HIGH EFFICIENCY LEDS AND LED LAMPS - In various embodiments, lighting systems include an electrically insulating carrier having a plurality of conductive elements disposed thereon, a light-emitting array, and at least one power source. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting strings, each light-emitting string comprising a plurality of unpackaged light-emitting diode (LED) dies electrically connected in series. Each LED die has at least two electrical contacts on one surface thereof, and each electrical contact is electrically connected to a conductive element by a conductive adhesive. The power source provides power to the light-emitting strings. | 10-04-2012 |
20130111744 | BROAD-AREA LIGHTING SYSTEMS - In accordance with certain embodiments, illumination systems are formed by aligning light-emitting elements with optical elements and/or disposing light-conversion materials on the light-emitting elements, as well as by providing electrical connectivity to the light-emitting elements | 05-09-2013 |
20130114255 | BROAD-AREA LIGHTING SYSTEMS - In accordance with certain embodiments, thermal stresses are mitigated in illumination systems by mating optical substrates with a plurality of discrete substrates each having one or more light-emitting elements thereon. | 05-09-2013 |
20130141909 | CONTROL OF LUMINOUS INTENSITY DISTRIBUTION FROM AN ARRAY OF POINT LIGHT SOURCES - In various embodiments, a lens array comprises a plurality of aspheric lens elements each optically coupled to a light-emitting element and producing an out-of-focus image thereof. The images combine to generate a target luminous intensity distribution, e.g., providing constant illuminance on a plane. | 06-06-2013 |
20130143339 | FORMATION OF UNIFORM PHOSPHOR REGIONS FOR BROAD-AREA LIGHTING SYSTEMS - In accordance with certain embodiments, phosphor arrangements are formed via adhering phosphors to activated regions on a substrate and transferring them to a different substrate. | 06-06-2013 |
20130181238 | ELECTRONIC DEVICES WITH YIELDING SUBSTRATES - In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts. | 07-18-2013 |
20130181619 | HIGH EFFICIENCY LEDS AND LED LAMPS - In various embodiments, lighting systems include an electrically insulating carrier having a plurality of conductive elements disposed thereon, a light-emitting array, and at least one power source. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting strings, each light-emitting string comprising a plurality of light-emitting diodes (LEDs) electrically connected in series. Each LED has at least two electrical contacts, and each electrical contact is electrically connected to a conductive element by a solder. The power source provides power to the light-emitting strings. | 07-18-2013 |
20130187174 | LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS - In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder. | 07-25-2013 |
20130187178 | LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS - In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder. | 07-25-2013 |
20130187540 | DISCRETE PHOSPHOR CHIPS FOR LIGHT-EMITTING DEVICES AND RELATED METHODS - In accordance with certain embodiments, phosphor chips are formed and subsequently attached to light-emitting elements. | 07-25-2013 |
20130328172 | WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS - In accordance with certain embodiments, semiconductor dies are at least partially coated with a conductive adhesive prior to singulation and subsequently bonded to a substrate having electrical traces thereon. | 12-12-2013 |
20130330853 | METHODS OF FABRICATING WAFER-LEVEL FLIP CHIP DEVICE PACKAGES - In accordance with certain embodiments, semiconductor dies are at least partially coated with a conductive adhesive prior to singulation and subsequently bonded to a substrate having electrical traces thereon. | 12-12-2013 |
20140062318 | WIRING BOARDS FOR ARRAY-BASED ELECTRONIC DEVICES - In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements. | 03-06-2014 |
20140218915 | CONTROL OF LUMINOUS INTENSITY DISTRIBUTION FROM AN ARRAY OF POINT LIGHT SOURCES - In various embodiments, a lens array comprises a plurality of aspheric lens elements each optically coupled to a light-emitting element and producing an out-of-focus image thereof. The images combine to generate a target luminous intensity distribution, e.g., providing constant illuminance on a plane. | 08-07-2014 |
20140264409 | ENGINEERED-PHOSPHOR LED PACKAGES AND RELATED METHODS - In accordance with certain embodiments, a phosphor element at least partially surrounding a light-emitting die is shaped to influence color-temperature divergence. | 09-18-2014 |