Patent application number | Description | Published |
20090281618 | Prosthetic Heart Valve Devices and Methods of Valve Replacement - A stented valve of two or more leaflets made of pericardium or other material having a relatively thin profile at the annulus. The leaflet surfaces are attached via chords to a stent frame, where the chords are positioned to mimic the native valve anatomy and functionality. In particular, the valves of one exemplary embodiment of the invention are sized to replace a mitral valve and therefore the chords are arranged to prevent prolapse of the leaflets into the atrium. The stented valve has a relatively short height at its annulus due to the positioning of the chords. In addition, the stented valve is capable of being crimped to a small enough size that it can be delivered to the implantation site via transcatheter delivery systems and methods. | 11-12-2009 |
20100114136 | CUTTING DEVICE AND METHOD OF VESSEL HARVESTING - Embodiments of the invention provide a cutting device and method of vessel harvesting. The cutting device can include at least one tubular member, a cutting element, and a centering member. The cutting device can include at least one tubular member with a flexible section and a cutting element. The method of vessel harvesting can include spacing a cutting element of the cutting device from the vessel as the cutting element is advanced over the vessel. | 05-06-2010 |
20100121362 | VESSEL SUPPORT DEVICE AND METHOD OF VESSEL HARVESTING - Embodiments of the invention provide a vessel support system and a method of vessel harvesting. The system can include a cutting device, a catheter adapted to be inserted into a section of the vessel in order to support the vessel as the cutting device is advanced over the vessel, and a cannula adapted to be coupled to the vessel and adapted to receive the catheter as the catheter is inserted into the section of the vessel. The method can include orienting a cutting device coaxially with the cannula and the catheter and advancing the cutting device over the cannula, the catheter, and the section of the vessel in order to core out the section of the vessel and a portion of the surrounding tissue. | 05-13-2010 |
20100211028 | CARDIOTOMY AND VENOUS BLOOD RESERVOIR AND METHOD - A cardiotomy and venous blood reservoir including a housing assembly, a downtube, and a bowl. The housing assembly forms a chamber. The downtube extends from an inlet port to a downstream end within the chamber. A diameter of the tube lumen increases to the downstream end. The bowl forms a floor surface shoulder, intermediate segment, and protrusion. The shoulder circumferentially surrounds, and is spatially above, the downstream end. The intermediate segment extends radially inwardly and downwardly from the shoulder to a bottom face. The protrusion extends radially inwardly and upwardly from the bottom face to a center that is aligned with the lumen and below the downstream end. The flared inner diameter of the lumen reduces fluid velocity as venous blood enters the reservoir. The bowl floor surface gently receives the incoming venous blood at the protrusion, and smoothly guides the blood flow. | 08-19-2010 |
20100268148 | Cardiotomy and Venous Blood Reservoir and Method - A cardiotomy and venous blood reservoir, including a housing assembly, a venous inlet port, a venous sub-assembly, a cardiotomy inlet port, and a cardiotomy sub-assembly. The housing forms a chamber. The venous sub-assembly includes a downtube and a bowl. A diameter of the downtube lumen increases to a downstream end. The bowl forms a floor surface for receiving flow from the lumen. The cardiotomy sub-assembly includes a dish and an inner post. The dish defines an aperture. The inner post extends from the dish and forms a guide surface received within the central aperture and forming an undulating curvature increasing to a diameter greater than the diameter of the central aperture. Cardiotomy liquid drops from the dish fall on to the undulating, closely positioned guide surface with minimal splashing. | 10-21-2010 |
20130184727 | VESSEL SUPPORT DEVICE AND METHOD OF VESSEL HARVESTING - Embodiments of the invention provide a vessel support system and a method of vessel harvesting. The system can include a cutting device, a catheter adapted to be inserted into a section of the vessel in order to support the vessel as the cutting device is advanced over the vessel, and a cannula adapted to be coupled to the vessel and adapted to receive the catheter as the catheter is inserted into the section of the vessel. The method can include orienting a cutting device coaxially with the cannula and the catheter and advancing the cutting device over the cannula, the catheter, and the section of the vessel in order to core out the section of the vessel and a portion of the surrounding tissue. | 07-18-2013 |
Patent application number | Description | Published |
20090021024 | Retaining Ring with Shaped Profile - Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring. | 01-22-2009 |
20090088051 | LEADER AND TRAILER FOR LINEAR POLISHING SHEET - A polishing article includes an elongated substantially rectangular central portion and a substantially rectangular edge portion. The central portion includes a polishing layer with a polishing surface. The central portion has a width, a length greater than the width and defining a longitudinal axis, and an edge. The edge portion extends from the edge of the central portion, the edge portion is thinner than the central portion, and the polishing layer does not extend onto the edge portion. | 04-02-2009 |
20090253358 | POLISHING ARTICLE WITH INTEGRATED WINDOW STRIPE - A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear edge including a plurality of projections and a plurality of recesses extending parallel to the polishing surface and disposed in an alternating pattern along the first axis. | 10-08-2009 |
20090318060 | CLOSED-LOOP CONTROL FOR EFFECTIVE PAD CONDITIONING - A method and apparatus for conditioning a polishing pad is provided. The conditioning element is held by a conditioning arm rotatably mounted to a base at a pivot point. An actuator pivots the arm about the pivot point. The conditioning element is urged against the surface of the polishing pad, and translated with respect to the polishing pad to remove material from the polishing pad and roughen its surface. The interaction of the abrasive conditioning surface with the polishing pad surface generates a frictional force. The frictional force may be monitored by monitoring the torque applied to the pivot point, and material removal controlled thereby. The conditioning time, down force, translation rate, or rotation of the conditioning pad may be adjusted based on the measured torque. | 12-24-2009 |
20100035515 | CHEMICAL MECHANICAL POLISHER WITH HEATER AND METHOD - A chemical mechanical apparatus comprises a polishing platen, a roller pad assembly capable of advancing a polishing pad across the platen, a substrate carrier to press a substrate against the polishing pad, and a heater to heat the substrate to a temperature sufficiently high to provide a rate of removal of material from the substrate that compensates for the wear of the polishing pad. | 02-11-2010 |
20100112919 | MONOLITHIC LINEAR POLISHING SHEET - A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt. | 05-06-2010 |
20110256812 | CLOSED-LOOP CONTROL FOR IMPROVED POLISHING PAD PROFILES - Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs. | 10-20-2011 |
20120009847 | CLOSED-LOOP CONTROL OF CMP SLURRY FLOW - Embodiments of the present invention generally relate to methods for chemical mechanical polishing a substrate. The methods generally include measuring the thickness of a polishing pad having grooves or other slurry transport features on a polishing surface. Once the depth of the grooves on the polishing surface is determined, a flow rate of a polishing slurry is adjusted in response to the determined groove depth. A predetermined number of substrates are polished on the polishing surface. The method can then optionally be repeated. | 01-12-2012 |
20120021671 | REAL-TIME MONITORING OF RETAINING RING THICKNESS AND LIFETIME - A method and apparatus for monitoring the condition of a surface of a retaining ring disposed on a carrier head in a polishing module is described. In one embodiment, a method for monitoring at least one surface of a retaining ring coupled to a carrier head is provided. The method includes moving the carrier head adjacent a sensor device disposed in a polishing module, transmitting energy from the sensor device toward the retaining ring, receiving energy reflected from the retaining ring, and determining a condition of the retaining ring based on the received energy. | 01-26-2012 |
20120028548 | RETAINING RING WITH SHAPED PROFILE - Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring. | 02-02-2012 |
20120100779 | APPARATUS AND METHOD FOR COMPENSATION OF VARIABILITY IN CHEMICAL MECHANICAL POLISHING CONSUMABLES - Apparatus and methods for conditioning a polishing pad in a CMP system are provided. In one embodiment, a method includes performing a pre-polish process including urging a conditioner disk against a polishing surface of a polishing pad disposed in a polishing station, moving the conditioner disk relative to the polishing pad in a sweep pattern across the polishing surface while monitoring a rotational force value required to move the conditioner disk relative to the polishing pad, determining a metric indicative of an interaction between the conditioner disk and the polishing surface from the rotational force value, adjusting a polishing recipe in response to the metric, and polishing one or more substrates using the adjusted polishing recipe. | 04-26-2012 |
20130122783 | PAD CONDITIONING FORCE MODELING TO ACHIEVE CONSTANT REMOVAL RATE - A method and apparatus for conditioning a polishing pad in a CMP system is provided. In one embodiment, a method for conditioning a polishing pad includes applying a down force to the conditioning disk that urges the conditioning disk against the polishing pad, measuring a torque required to sweep the conditioning disk across the polishing pad, determining a change in down force by comparing the measured torque to a model force profile (MFP), and adjusting the down force that the conditioning disk applies against the polishing pad in response to the determined change. | 05-16-2013 |
20140113524 | ENDPOINTING WITH SELECTIVE SPECTRAL MONITORING - A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ spectrographic monitoring system to generate a sequence of measured spectra, selecting less than all of the measured spectra to generate a sequence of selected spectra, generating a sequence of values from the sequence of selected spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of values. | 04-24-2014 |
20140237905 | METHOD OF FORMING POLISHING SHEET - A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt. | 08-28-2014 |
20140242881 | FEED FORWARD PARAMETER VALUES FOR USE IN THEORETICALLY GENERATING SPECTRA - A method of controlling a polishing operation is described. A controller stores an optical model for a layer stack having a plurality of layers and a plurality of input parameters including a first parameter and a second parameter. The controller stores data defining a plurality of default values for the first parameter and measures an optical property of a substrate and generates a second value. Using the optical model and the second value and iterating over the first values, a number of reference spectra are calculated. A spectrum is measured and the measured spectrum is matched to the reference spectra and the best matched reference spectrum is determined. The first value of the best matched reference spectrum is determined and is used to adjust a polishing endpoint or a polishing parameter of a polishing apparatus. | 08-28-2014 |
20140323017 | METHODS AND APPARATUS USING ENERGIZED FLUIDS TO CLEAN CHEMICAL MECHANICAL PLANARIZATION POLISHING PADS - Methods adapted to clean a chemical mechanical polishing (CMP) pad are disclosed. The methods include positioning an energized fluid delivery assembly over a CMP polishing pad; rotating the polishing pad on a platen; energizing a fluid within the energized fluid delivery assembly; applying the energized fluid to the polishing pad to dislodge slurry residue and debris; and removing the dislodged slurry residue and debris using a vacuum suction unit. Systems and apparatus for carrying out the methods are provided, as are numerous additional aspects. | 10-30-2014 |