Patent application number | Description | Published |
20100259900 | HEAT SINK - A heat sink includes a cooling member to dissipate heat, and a fixing member for mounting fasteners. The cooling member includes a base and a number of fins extending from the base. The cooling member and the fixing member are independently formed, and the fixing member is fixed to a bottom of the base of the cooling member via fixing means. | 10-14-2010 |
20110069438 | COMPUTER ENCLOSURE - A computer enclosure includes a chassis, a mounting frame, two air-guiding members, and a fan. The chassis includes a ventilation area defining a plurality of ventilation through holes. The mounting frame is fixed to the chassis and faces the ventilation through holes. The mounting frame configured for receiving electronic components. The two air-guiding members respectively connect two opposite sides of the mounting frame to the chassis. The two air-guiding members incline relative to the mounting frame and the chassis to form an air passage. The fan is configured for exhausting air passing through the ventilation through holes and the mounting frame. | 03-24-2011 |
20110102998 | DISK DRIVE ASSEMBLY AND ELECTRONIC DEVICE HAVING THE SAME - A disk drive assembly includes a disk drive, a carrier containing the disk drive and a pad. The carrier includes a bottom frame and two opposite sidewalls connected to two opposite edges of the bottom frame. The pad is sandwiched between the disk drive and each of the two sidewalls. | 05-05-2011 |
20120035769 | SYSTEM AND METHOD FOR CONTROLLING AN ELECTRONIC DEVICE FAN - An electronic device and a method for controlling fan speed of the electronic device include setting a speed range corresponding to a variety of pulse-width modulation (PWM) duty cycles of the fan, and setting a speed variation value of the fan. The method further includes reading the PWM duty cycle and detecting an actual speed of the fan, and adjusting the PWM duty cycle in the PWM duty cycle instruction according to the speed variation value. | 02-09-2012 |
20120041614 | FAN SPEED CONTROL SYSTEM AND METHOD - A fan speed control system includes a fan, a hardware device, and a basic input/output system (BIOS) module. The BIOS module includes a memory unit, an edit unit, a searching unit, and a control unit. The memory unit stores a matching table of different hardware device numbers and corresponding fan speed control curves. The edit unit is operable to edit the matching table. The searching unit is operable to read the matching table and search which fan speed control curve matches with the hardware device number of the hardware device. The control unit is operable to select the matched fan speed control curve to control the fan speed of the fan. | 02-16-2012 |
20120127654 | COMPUTER SYSTEM AND HEAT SINK - A computer system includes an enclosure having an air intake, a heat sink and an electronic element. The heat sink includes a first heat dissipating portion, a second heat dissipating portion, and a third heat dissipating portion interconnecting the first and second heat dissipating portions. Each of the first heat dissipating portion, second heat dissipating portion, and third heat dissipating portion includes a number of fins and passages formed between each two adjacent fins. The passages of the first heat dissipating portion face toward the air intake. A space is maintained between the first heat dissipating portion and the second heat dissipating portion, and the electronic element is mounted in the space. | 05-24-2012 |
20120138273 | HEAT SINK WITH THERMALLY CONDUCTIVE COVER - A heat sink includes a base, two heat pipes, a fin assembly, and two thermally conductive cover. The heat pipes are thermally connected to the base. Each of the heat pipes includes a cylindrical body and an ineffective end portion distal from the base. The ineffective end portion is connected to the cylindrical body. A diameter of the ineffective end portion is smaller than that of the body. The fin assembly is thermally coupled to the two heat pipes. Each of the thermally conductive covers envelops the ineffective end portion and is in thermal contact with the ineffective end portion and the fin assembly. | 06-07-2012 |
20120152509 | HEAT SINK - A heat sink includes a substrate, a first heat dissipation body, and a second heat dissipation. The first heat dissipation body includes a first base plate attached to the substrate, and a number of first cooling fins extending from the first base plate. The second heat dissipation body includes a second base plate attached to tops of first cooling fins and a number of second cooling fins extending from the second base plate. | 06-21-2012 |
20130126214 | FIXING APPARATUS FOR HEAT SINK - An apparatus for fixing a heat sink having a bottom plate includes a circuit board, two fasteners, and two blocks. The circuit board defines two through holes. The fasteners respectively extend through the bottom plate of the heat sink for fixing the heat sink to the circuit board. Each of the fasteners includes two spaced feet to extend through a corresponding one of the through holes and engage with a bottom of the circuit board. Each of the blocks is inserted into a space between the feet of a corresponding one of the fasteners after the feet extend through the corresponding through hole, to prevent the feet from deforming and disengaging from the circuit board. | 05-23-2013 |
20130208427 | GROUNDING MECHANISM FOR HEAT SINK ASSEMBLY - A ground mechanism for a heat sink is attached to a circuit board. The ground mechanism includes a first latching member, a second latching member, a conductive member, and an elastic member. The first latching member and a second latching member latch the heat sink on the circuit board. The conductive member is formed on the circuit board. The elastic member is sandwiched between the first latching member and the heat sink. The elastic member electrically connects the first latching member to the heat sink, and the second latching member electrically connect the first latching member to the conductive member to conduct electromagnetic charges from the heat sink to a grounding pin of the circuit board. | 08-15-2013 |