| Patent application number | Description | Published |
|---|
| 20080272095 | METHOD FOR MACHINING TAPERED MICRO HOLES - A method for laser machining through micro-holes having desired geometric cross-section requirements in a thin, substantially homogenous material. | 11-06-2008 |
| 20080272096 | LASER MICRO-MACHINING SYSTEM WITH POST-SCAN LENS DEFLECTION - A laser micro machining system includes a laser source positioned to direct a laser pulse through a scan lens to a work piece mounted on a work surface and a mirror positioned between the scan lens and the work piece and tilted with respect to the work surface to reflect the laser pulse toward the work piece. The mirror can be indexed to a number of positions so that only portions of the mirror are used for a number of processing steps, extending the life of the mirror. | 11-06-2008 |
| 20090242521 | ON-THE-FLY MANIPULATION OF SPOT SIZE AND CUTTING SPEED FOR REAL-TIME CONTROL OF TRENCH DEPTH AND WIDTH IN LASER OPERATIONS - Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface. | 10-01-2009 |
| 20090308852 | REDUCING BACK-REFLECTIONS IN LASER PROCESSING SYSTEMS - Systems and methods reduce or prevent back-reflections in a laser processing system. A laser processing system includes a laser source to generate an incident laser beam, a laser beam output to direct the incident laser beam toward a work surface, and a lens to receive the incident laser beam along a first axis of propagation that is substantially perpendicular to the work surface. The lens includes a primary axis that is substantially parallel to, and offset from, the first axis of propagation. The lens is configured to focus the incident laser beam onto the work surface along a second axis of propagation that forms a non-perpendicular angle with the work surface such that at least a substantial portion of a reflected laser beam from the work surface does not return to the laser beam output. | 12-17-2009 |
| 20090308853 | ELIMINATING HEAD-TO-HEAD OFFSETS ALONG COMMON CHUCK TRAVEL DIRECTION IN MULTI-HEAD LASER MACHINING SYSTEMS - The embodiments disclosed herein provide systems and methods for correcting a head-to-head offset in a laser machining system with two or more processing heads. A focusing lens is associated with each processing head, and is configured to receive an incident laser beam along an incident beam axis of propagation. The incident beam axis of propagation is offset from the primary axis of the focusing lens. The focusing lens is further configured to rotate about the incident beam axis of propagation in order to steer the incident laser beam's path with respect to a workpiece. | 12-17-2009 |
| 20090312858 | METHOD FOR DEFINING SAFE ZONES IN LASER MACHINING SYSTEMS - A method for defining machine cutting path safety zones for use in laser machining devices. The method includes indentifying safety zone positional coordinates in a computer aided design model, using a machine vision system to image the modeled physical machining device, determining the positional difference between the design model safety zone points and the imaged points and converting the design model safety zone coordinates into machine specific coordinates for input into a machining cutting path program. | 12-17-2009 |
| 20090312859 | MODIFYING ENTRY ANGLES ASSOCIATED WITH CIRCULAR TOOLING ACTIONS TO IMPROVE THROUGHPUT IN PART MACHINING - An apparatus for controlling a trajectory along which a tooling positioner system moves tooling for machining multiple features of the same type in a component includes a first tooling trajectory having an entry velocity at a time when the tooling begins machining a first feature and an exit velocity at a time when the tooling completes machining of the first feature. A second tooling trajectory has an entry velocity at a time when the tooling begins machining a second feature and an exit velocity at a time when the tooling completes machining of the second feature. The entry and exit velocities of the second tooling trajectory are different from the respective entry and velocities of the first tooling trajectory. Methods for controlling a trajectory are also taught. | 12-17-2009 |
| 20090314754 | PRE-PROCESS STRESS LOADING COMPONENTS FOR POST-PROCESS WARP CONTROL - A process and apparatus neutralizes a warp effect resulting from a build up of micro strains caused by machining a part with a long wavelength laser. The part to be machined is pre-stressed in an opposite direction of a warp stress due to machining using a fixture for holding the part without yielding any other features in the part. The part is machined while held in the pre-stressed position in the fixture. | 12-24-2009 |
| 20100078418 | METHOD OF LASER MICRO-MACHINING STAINLESS STEEL WITH HIGH COSMETIC QUALITY - A process to laser micro-machine a metal part with a high cosmetic quality surface includes applying a protective coating layer to at least one surface of the part before micro-machining the part with a laser. The protective coating applied to the high quality cosmetic surface can have a thickness of between about 5 mil and about 10 mil, inclusive and have sufficient adhesion strength to adhere to the part without delaminating during processing. The protective coating applied to the machining surface of the part can be a metallic material, such as a metallic foil or tape. | 04-01-2010 |
