Patent application number | Description | Published |
20090093508 | THERAPEUTIC OR PROPHYLACTIC AGENT FOR ALLERGIC DERMATITIS - A therapeutic or prophylactic agent for allergic dermatitis is disclosed. The therapeutic or prophylactic agent comprises as an effective ingredient a glycine derivative having a specific structure or a pharmaceutically acceptable salt thereof, for example, the below-described compound [(E)-2-(2,6-dichlorobenzamido)-5-[4-(isopropyl-pyrimidin-2-ylamino)phenyl]pent-4-enoic acid]. The therapeutic or prophylactic agent for allergic dermatitis according to the present invention has high therapeutic or prophylactic effect. | 04-09-2009 |
20090253724 | THERAPEUTIC OR PROPHYLACTIC AGENT FOR LEUKEMIA - A therapeutic or prophylactic agent for leukemia is disclosed. The therapeutic or prophylactic agent comprises as an effective ingredient a glycine derivative having a specific structure or a pharmaceutically acceptable salt thereof, for example, the below-described compound [(E)-2-(2,6-dichlorobenzamido)-5-[4-(isopropyl-pyrimidin-2-ylamino)phenyl]pent-4-enoic acid]. The therapeutic or prophylactic agent for leukemia according to the present invention shows the excellent absorbability and in vivo stability when orally administered, and exhibits prominent therapeutic or prophylactic effects. | 10-08-2009 |
20130050659 | PROJECTION DISPLAY APPARATUS - A projection display apparatus includes: a substantially box-shaped enclosure having a bottom surface portion, the bottom surface portion having an ventilation groove and an air inlet formed through a wall of the ventilation groove; an air sucking fan provided in the enclosure and forming an air flow flowing through the air inlet into the enclosure, and a filter through which the air flowing through the air inlet into the enclosure passes. | 02-28-2013 |
20130150390 | THERAPEUTIC OR PROPHYLACTIC AGENT FOR ALLERGIC DERMATITIS - A therapeutic or prophylactic agent for allergic dermatitis is disclosed. The therapeutic or prophylactic agent comprises as an effective ingredient a glycine derivative having a specific structure or a pharmaceutically acceptable salt thereof, for example, the below-described compound [(E)-2-(2,6-dichlorobenzamido)-5-[4-(isopropyl-pyrimidin-2-ylamino)phenyl]pent-4-enoic acid]. The therapeutic or prophylactic agent for allergic dermatitis according to the present invention has high therapeutic or prophylactic effect. | 06-13-2013 |
Patent application number | Description | Published |
20090084880 | MAGNETIC TAPE REEL AND MAGNETIC TAPE CARTRIDGE - An aspect of the present invention relates to a magnetic tape reel. The magnetic tape reel comprises a hub on which a magnetic tape is wound, and a flange provided on at least one of upper and lower ends of the hub. The flange comprises a surface coating on at least a portion of a surface thereof on the hub side, the surface coating having a hardness equal to or greater than a hardness of an edge surface of the magnetic tape. A further aspect of the present invention relates to a magnetic tape cartridge comprising a magnetic tape and the magnetic tape reel. | 04-02-2009 |
20090086369 | MAGNETIC RECORDING MEDIUM, MAGNETIC SIGNAL REPRODUCTION METHOD AND MAGNETIC SIGNAL REPRODUCTION SYSTEM - An aspect of the present invention relates to a magnetic recording medium comprising a magnetic layer comprising a ferromagnetic powder and a binder on one surface of a nonmagnetic support and a backcoat layer on the other surface of the nonmagnetic support, wherein a number of indentations equal to or greater than 20 nm in depth present on the magnetic layer surface is equal to or less than 100/10,000 μm | 04-02-2009 |
20090087686 | MAGNETIC RECORDING MEDIUM AND METHOD OF MANUFACTURING THE SAME - An aspect of the present invention relates to a magnetic recording medium comprising a coating layer on a nonmagnetic support, wherein the coating layer comprises a nonmagnetic layer comprising a nonmagnetic powder and a binder and a magnetic layer comprising a ferromagnetic powder and a binder in this order, the nonmagnetic support comprises a main component in the form of a resin obtained by mixing and/or copolymerizing a polyester and a polymer having compatibility with the polyester, has a glass transition temperature of equal to or higher than 80° C. but less than 125° C., and has a heat absorption peak, based on enthalpy relaxation, ranging from 0.5 to 2.0 J/g. Another aspect of the present invention relates to a method of manufacturing a magnetic recording medium. | 04-02-2009 |
20100233414 | MULTILAYER OPTICAL RECORDING MEDIUM, METHOD AND APPARATUS FOR MANUFACTURING THE MULTILAYER OPTICAL RECORDING MEDIUM - A multilayer optical recording medium includes: a substrate; a plurality of optical recording layers provided on the substrate; and a plurality of intermediate layers each provided between adjoining optical recording layers disposed in a thickness direction. In this multilayer optical recording medium, each of the intermediate layers has a birefringence property and a principal axis direction of birefringence of each intermediate layer is oriented at 90 degrees with respect to that of an adjoining intermediate layer. | 09-16-2010 |
Patent application number | Description | Published |
20090034135 | Differential magnetoresistive magnetic head - Embodiments of the present invention help to provide a single element type differential magnetoresistive magnetic head capable of achieving high resolution and high manufacturing stability. According to one embodiment, a magnetoresistive layered film is formed by stacking an underlayer film, an antiferromagnetic film, a ferromagnetic pinned layer, a non-magnetic intermediate layer, a soft magnetic free layer, a long distance antiparallel coupling layered film, and a differential soft magnetic free layer. The long distance antiparallel coupling layered film exchange-couples the soft magnetic free layer and the differential soft magnetic free layer in an antiparallel state with a distance of about 3 nanometers through 20 nanometers. By manufacturing the single element type differential magnetoresistive magnetic head using the magnetoresistive layered film, it becomes possible to achieve the high resolution and the high manufacturing stability without spoiling the GMR effect. | 02-05-2009 |
20100053821 | CPP Structure Magnetoresistive Head - According to one embodiment, a magnetoresistive head has a magnetoresistive sensor film between a lower shield layer and an upper shield layer. The magnetoresistive sensor film is formed by stacking at least a pinning layer, a first ferromagnetic layer, an intermediate layer, and a second ferromagnetic layer, in which a sense current flows so as to pass through an interface between the intermediate layer and the second ferromagnetic layer, and a resistance change of the magnetoresistive sensor film in accordance with the change of an external magnetic field is detected. Also, a lateral side metal layer having an electric resistivity lower than the electric resistivity of the pinning layer is disposed at least on a side wall of the pinning layer among side walls of layers constituting the magnetoresistive sensor film, the lateral side metal layer being in contact with the lower shield layer. Other embodiments are described as well. | 03-04-2010 |
20100188771 | Magnetoresistive Magnetic Head - A magnetoresistive magnetic head according to one embodiment uses a current-perpendicular-to-plane magnetoresistive element having a laminate of a free layer, an intermediate layer, and a pinned layer, the pinned layer being substantially fixed to a magnetic field to be detected, wherein either the pinned layer or the free layer includes a Heusler alloy layer represented by a composition of X-Y-Z, wherein X is between about 45 at. % and about 55 at. % and is Co or Fe, Y accounts for between about 20 at. % and about 30 at. % and is one or more elements selected from V, Cr, Mn, and Fe, and Z is between about 20 at. % and about 35 at. % and is one or more elements selected from Al, Si, Ga, Ge, Sn, and Sb, the other layer including a high saturation magnetization material layer having higher saturation magnetization than that of the Heusler alloy, and where the direction of the current flowing perpendicular to plane being a direction in which an electron flows from the Heusler alloy layer into the high saturation magnetization material layer. Additional embodiments are also presented. | 07-29-2010 |
Patent application number | Description | Published |
20090174057 | SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD - The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion. | 07-09-2009 |
20090236721 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device in accordance with one embodiment of the invention can include a substrate onto which a wiring pattern is formed. In addition, the semiconductor device can include a plurality of semiconductor packages. Each semiconductor package can include a lead frame that is coupled to an electrode of a semiconductor chip. Each lead frame can be located on a side surface and a bottom surface of the semiconductor package. In addition, the semiconductor device can include a pressure-contact section for receiving the plurality of semiconductor packages and for causing the plurality of semiconductor packages to come into contact with the wiring pattern. | 09-24-2009 |
20090250800 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR - A semiconductor device is provided that includes a semiconductor chip and a resin section that molds the semiconductor chip and has a first through-hole. A through electrode that is electrically coupled to the semiconductor chip, extends through the resin section, and extends between a top edge and a bottom edge of an inner surface of the first through-hole. A cavity which extends between planes corresponding to an upper surface and a lower surface of the resin section is formed inside the first through-hole. | 10-08-2009 |
20090256250 | SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD - The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion. | 10-15-2009 |
20090267207 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor package having a molding unit that seals bonding wires connected to electrode pads of a semiconductor chip is provided with through electrode units comprising bonding wires embedded therein and penetrating the molding unit. A leading end of the respective through electrode units is exposed from an upper surface of the molding unit and a lower surface of the molding unit. | 10-29-2009 |
20090325346 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - The present invention provides a semiconductor device that includes: stacked semiconductor chips, each semiconductor chip including a semiconductor substrate and a first insulating layer that is provided on side faces of the semiconductor substrate and has concavities formed on side faces thereof; first metal layers that are provided in center portions of inner side faces of the concavities; and second metal layers that are provided in the concavities and are connected to the first metal layers formed on each semiconductor chip. The present invention also provides a method of manufacturing the semiconductor device. | 12-31-2009 |
20110201152 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR - A semiconductor device is provided that includes a semiconductor chip and a resin section that molds the semiconductor chip and has a first through-hole. A through electrode that is electrically coupled to the semiconductor chip, extends through the resin section, and extends between a top edge and a bottom edge of an inner surface of the first through-hole. A cavity which extends between planes corresponding to an upper surface and a lower surface of the resin section is formed inside the first through-hole. | 08-18-2011 |
20120025364 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - The present invention provides a semiconductor device that includes: stacked semiconductor chips, each semiconductor chip including a semiconductor substrate and a first insulating layer that is provided on side faces of the semiconductor substrate and has concavities formed on side faces thereof; first metal layers that are provided in center portions of inner side faces of the concavities; and second metal layers that are provided in the concavities and are connected to the first metal layers formed on each semiconductor chip. The present invention also provides a method of manufacturing the semiconductor device. | 02-02-2012 |