Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Meeus
Liesbeth Maria Fernande Meeus, Everberg BE
| Patent application number | Description | Published |
|---|---|---|
| 20100273873 | DIRECT COMPRESSIBLE DEXTROSE - This invention relates to a direct compressible dextrose composition, a process for preparing such a direct compressible dextrose composition by compression and subsequent granulation, and processes for preparing pharmaceutical formulations or food formulations in tablet form using the direct compressible dextrose composition. The invention further concerns pharmaceutical or food formulations, which comprise the directly compressible dextrose composition, and the use of the direct compressible dextrose composition for the preparation of pharmaceutical and food formulations. | 10-28-2010 |
Pascal Meeus, Turnhout BE
| Patent application number | Description | Published |
|---|---|---|
| 20080213696 | Negative Working, Heat-Sensitive, Lithographic Printing Plate Precursor - A heat-sensitive negative-working lithographic printing plate precursor includes on a grained and anodized aluminum support a coating including hydrophobic thermoplastic polymer particles, a hydrophilic binder, and an organic compound, wherein the organic compound includes at least one phosphonic acid group or at least one phosphoric acid group or a salt thereof. | 09-04-2008 |
| 20100203458 | METHOD FOR DEVELOPING A PRINTING PLATE PRECURSOR - A method for developing a printing plate precursor comprising the step of immersing the precursor in an aqueous alkaline developing solution comprising a (co) polymer comprising a monomeric unit which is represented by the following formula (I): wherein L is a linking group; R | 08-12-2010 |
Thomas Meeus, Retie BE
| Patent application number | Description | Published |
|---|---|---|
| 20090081823 | ELECTROFORMED STENCILS FOR SOLAR CELL FRONT SIDE METALLIZATION - A method for providing metallization upon a semiconductor substrate utilizing a stencil having at least one aperture extending from the contact side to the fill side, the contact side of the stencil being substantially flat and forming a sharp edge with a wall of the at least one aperture, the at least one aperture being tapered such that an area of a cross-section of the at least one aperture at the fill side is larger than an area of the cross-section of the at least one aperture at the contact side. A method of forming a stencil for depositing metallization lines on a semiconductor substrate is also disclosed. | 03-26-2009 |