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Meadowcroft
David J.k. Meadowcroft, San Jose, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100007034 | LENS SUPPORT AND WIREBOND PROTECTOR - A wirebond protector has an elongated shape that corresponds to the elongated array of wirebonds along the edge of a microelectronic device that connect a semiconductor die to electrical conductors on a substrate. In making the microelectronic device with wirebond protection, wirebonds are first formed in the conventional manner The wirebond protector is then attached to the device in an orientation in which it extends along the array of wirebonds to at least partially cover the wirebonds. | 01-14-2010 |
| 20100266236 | OPTICAL COMMUNICATIONS DEVICE HAVING A MOUNTING CORE AND METHOD - A parallel optical communications device is provided that has a mounting core that functions as a mounting system for mounting core components of the parallel optical communications device. In addition, the mounting core functions as a heat dissipation system for the core components of the parallel optical communications device, and also protects the core components and other elements of the communications device from dust and damage that can be caused by handling and other factors. In addition to performing the aforementioned functions, the mounting core is configured to enable the parallel optical communications device to be made extremely small in size while also protecting signal integrity. | 10-21-2010 |
| 20110008005 | PARALLEL OPTICAL COMMUNICATIONS DEVICE HAVING WELDABLE INSERTS - A parallel optical communications device is provided that has an OSA that includes at least one heat dissipation block having a slot formed in a lower surface thereof that contains a weldable insert. Likewise, an upper surface of the mounting device of the ESA has at least one slot formed therein that contains a weldable insert. After the OSA is placed in contact with the ESA and optically aligned with the ESA, the OSA is secured to the upper surface of the mounting device of the ESA by welding together the respective weldable inserts contained in the respective slots in the OSA and in the mounting device of the ESA. The welding process results in an extremely strong welded joint between the OSA and the ESA that prevents relative movement between the OSA and the ESA if external forces that are exerted on the OSA and/or on the ESA. | 01-13-2011 |
David J.k. Meadowcroft, Santa Clara, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100289160 | LENS SUPPORT AND WIREBOND PROTECTOR - A wirebond protector has an elongated shape that corresponds to the elongated array of wirebonds along the edge of a microelectronic device that connect a semiconductor die to electrical conductors on a substrate. In making the microelectronic device with wirebond protection, wirebonds are first formed in the conventional manner The wirebond protector is then attached to the device in an orientation in which it extends along the array of wirebonds to at least partially cover the wirebonds. | 11-18-2010 |
David J. K. Meadowcroft, San Jose, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100232800 | PARALLEL OPTICAL TRANSCEIVER MODULE HAVING A HEAT DISSIPATION SYSTEM THAT DISSIPATES HEAT AND PROTECTS COMPONENTS OF THE MODULE FROM PARTICULATES AND HANDLING - A parallel optical transceiver module is provided that has a heat dissipation system that dissipates large amounts of heat, while also protecting the laser diodes, ICs and other components of the module from particulates, such as dust, for example, and from mechanical handling forces. The heat dissipation system is configured to be secured to the optical subassembly (OSA) of the module such that when the OSA is secured to the upper surface of the leadframe of the module, the OSA and the heat dissipation system cooperate to encapsulate at least the laser diodes and laser diode driver IC in a way that protects these components from dust and other particulates and from external mechanical forces. The heat dissipation system of the module is disposed for coupling with an external heat dissipation system, e.g., with a heat dissipation system that is provided by the customer. | 09-16-2010 |
Simon Meadowcroft, Suffolk GB
| Patent application number | Description | Published |
|---|---|---|
| 20100220289 | Optical Alignment Apparatus and Method Therefor - An optical measurement apparatus comprises an optical system ( | 09-02-2010 |
Thomas Andrew Meadowcroft, North Canton, OH US
| Patent application number | Description | Published |
|---|---|---|
| 20110223664 | MATERIALS AND METHODS OF INTRODUCING GENETIC MATERIAL INTO LIVING CELLS - The present invention generally relates to introducing genetic material to living cells. In some embodiments, the present invention relates to compositions of matter for targeted delivery of nucleic acids to cells. In other embodiments, the present invention relates to methods of targeted delivery of nucleic acids to cells. In still other embodiments, the present invention relates to polymers that contain at least one amino acid in their backbone. In yet other embodiments, the present invention relates to polymers that contain at least one amino acid in their backbone thereby resulting in biodegradability, and in some embodiments, controlled biodegradability. | 09-15-2011 |