Patent application number | Description | Published |
20120273594 | METHOD FOR FABRICATING FLUID EJECTION DEVICE - Disclosed is a method for fabricating a fluid ejection device that includes forming a drive circuitry layer on a substrate and fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and filling each slot of the at least one slot with a protective material. Additionally, the method includes grinding the substrate from a bottom portion thereof. Moreover, the method includes removing the protective material from the each slot. Further, the method includes depositing a layer of a polymeric bonding material on a bottom surface of the substrate. Furthermore, the method includes attaching a manifold chip to the layer of the polymeric bonding material. The method also includes laminating a flow feature layer and a nozzle plate over the substrate. Further disclosed are an ejection chip and a method for fabricating the ejection chip. | 11-01-2012 |
20120273597 | METHOD FOR FABRICATING FLUID EJECTION DEVICE - Disclosed is a method for fabricating a fluid ejection device. The method includes forming a drive circuitry layer on a substrate. The method further includes fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and forming at least one fluid feed trench within a bottom portion of the substrate. Each fluid feed trench of the at least one fluid feed trench is in fluid communication with one or more slots of the at least one slot. Additionally, the method includes laminating a flow feature layer and a nozzle plate over the substrate having the at least one slot and the at least one fluid feed trench formed therewithin. Further disclosed is a fluid ejection device fabricated using the aforementioned to method. | 11-01-2012 |
20130002771 | FLUID EJECTION DEVICES - Disclosed is a fluid ejection device for an inkjet printer that includes a substrate. The substrate includes at least one trench and a plurality of fluid flow vias configured in at least three parallel rows arranged over each trench of the at least one trench. Each row of the at least three parallel rows includes a set of fluid flow vias from the plurality of fluid flow vias arranged in one of a uniform manner and a non-uniform manner such that each fluid flow via of the set of fluid flow vias is configured in a spaced-apart relation with an adjacent fluid flow via. The each fluid flow via is configured in a diagonal relationship relative to a neighboring fluid flow via of an adjacent row of the at least three parallel rows. The fluid ejection device also includes a flow feature layer and a nozzle plate. | 01-03-2013 |
Patent application number | Description | Published |
20090058945 | MICRO-FLUID EJECTION HEADS AND METHODS FOR BONDING SUBSTRATES TO SUPPORTS - A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is hermetically sealed and bonded to a support material, and a method of bonding a silicon device, such as a micro-fluid ejection head, to a support material. | 03-05-2009 |
20090256891 | HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE AND METHODS OF FABRICATING THE HEATER CHIPS - A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction. | 10-15-2009 |
20090258322 | METHODS FOR PLANARIZING UNEVENNESS ON SURFACE OF WAFER PHOTORESIST LAYER AND WAFERS PRODUCED BY THE METHODS - A wafer has a substrate and a photoresist layer thereon with a surface that is planarized by positioning over a starting surface of the photoresist layer a gray-scale mask having a pattern that correlates with a gradient height profile of unevenness present on the starting surface, patterning the photoresist layer using the gray-scale mask to produce the pattern thereof in the photoresist layer which, in effect, produces a profile of evenness in the photoresist layer underlying the gradient height profile of unevenness, and developing the patterned photoresist layer such that only a three-dimensional portion thereof corresponding to the gradient height profile of unevenness located above the profile of evenness is removed which, in effect, leaves behind a resulting surface on the photoresist layer made substantially more even and thus substantially in a planarized condition. | 10-15-2009 |
20100045736 | MODULAR MICRO-FLUID EJECTION HEAD ASSEMBLY - A micro-fluid ejection head assembly and methods for fabricating micro-fluid ejection heads using separately fabricated electrical components. The micro-fluid ejection head has at least one base substrate, at least one fluid ejector actuator substrate attached to the base substrate; and at least a first logic component substrate hermetically sealed to the base substrate. The fluid ejector actuator substrate and the first logic component substrate are in electrical communication with each other. | 02-25-2010 |
20100229391 | MICRO-FLUID EJECTION HEADS AND METHODS FOR BONDING SUBSTRATES TO SUPPORTS - A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is hermetically sealed and bonded to a support material, and a method of bonding a silicon device, such as a micro-fluid ejection head, to a support material. | 09-16-2010 |
20100230047 | MICRO-FLUID EJECTION HEADS AND METHODS FOR BONDING SUBSTRATES TO SUPPORTS - A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is hermetically sealed and bonded to a support material, and a method of bonding a silicon device, such as a micro-fluid ejection head, to a support material. | 09-16-2010 |
20110205305 | HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE - A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die. | 08-25-2011 |