Patent application number | Description | Published |
20130226307 | COATED ENDOPROSTHESES AND RELATED SYSTEMS & METHODS - Methods for performing a hemiarthroplasty procedure. In some implementations, the method may comprise providing a component of an endoprosthesis, such as a femoral component of a hip prosthesis. The component may comprise a silicon nitride ceramic material, and may further comprise a coated articulating surface. The coated articulating surface may comprise a coating configured to reduce a coefficient of friction of the articulating surface. The method may further comprise positioning the endoprosthesis such that the coated articulating surface is positioned adjacent to a patient's native articular cartilage. In this manner, the coated articulating surface may articulate with the native articular cartilage following the procedure. | 08-29-2013 |
20130236854 | CERAMIC ORAL IMPLANTS AND RELATED APPARATUS, SYSTEMS, AND METHODS - Oral implants and related methods, systems, and apparatus. Some embodiments may comprise a silicon nitride bone anchor configured to be integrated with and affixed to alveolar bone of a patient's oral bone cavity. The bone anchor may comprise a core and an outer layer comprising a silicon nitride ceramic material. The outer layer may have a density less than a density of the core. An anchor abutment may be coupled with the bone anchor, and may be configured to protrude above epithelial tissue of the patient's oral cavity and provide a substrate for positioning and fixation of a dental component, such as a crown or bridge. | 09-12-2013 |
20130302509 | ANTIBACTERIAL BIOMEDICAL IMPLANTS AND ASSOCIATED MATERIALS, APPARATUS, AND METHODS - Methods for improving the antibacterial characteristics of biomedical implants and related implants manufactured according to such methods. In some implementations, a biomedical implant comprising a silicon nitride ceramic material may be subjected to a surface roughening treatment so as to increase a surface roughness of at least a portion of the biomedical implant to a roughness profile having an arithmetic average of at least about 500 nm Ra. In some implementations, a coating may be applied to a biomedical implant. Such a coating may comprise a silicon nitride ceramic material, and may be applied instead of, or in addition to, the surface roughening treatment process. | 11-14-2013 |
20130302512 | METHODS FOR ALTERING THE SURFACE CHEMISTRY OF BIOMEDICAL IMPLANTS AND RELATED APPARATUS - Methods for improving the antibacterial characteristics of a biomedical implant. In some implementations, the method may comprise providing a biomedical implant material block. The biomedical implant material block may comprise a silicon nitride ceramic material. The surface chemistry of the biomedical implant material block may be altered to improve the antibacterial characteristics of the biomedical implant material block. In some implementations, the surface chemistry may be altered by firing the biomedical implant material block in a nitrogen-rich environment or otherwise increasing the nitrogen content in the transitional oxide layer of at least a portion of the biomedical implant material block. The surface of the biomedical implant material block may also, or alternatively, be roughened to improve antibacterial characteristics of the implant. | 11-14-2013 |
20140124991 | METHODS FOR THREADING SINTERABLE MATERIALS AND RELATED APPARATUS AND SYSTEMS - Methods for threading ceramic materials, such as ceramic materials used for spinal implants or other biomedical implants. In some implementations, an expected rate of shrinkage of the block upon undergoing a firing process may be determined. A scaling factor may then be applied using the expected rate of shrinkage to select a tap having a size larger than a desired thread size. A green block may then be tapped with the selected tap to form a threaded opening in the green block. The block may be machined in order to remove cracks caused by the tapping process and/or to form the block into a desired shape/size. The green block may then be fired, which may result in a reduction of a size of the block and a size of the threaded opening. | 05-08-2014 |
20140265064 | ALUMINA-ZIRCONIA CERAMIC IMPLANTS AND RELATED MATERIALS, APPARATUS, AND METHODS - Embodiments of apparatus, systems, and methods relating to biomedical implants and other devices made up of unique and improved alumina-zirconia ceramic materials. In an example of a method according to an implementation of the invention, a slurry is prepared, compressed, and fired to obtain a fired ceramic piece comprising at least aluminum oxide, zirconium dioxide, yttrium oxide, cerium oxide, strontium oxide, magnesium oxide, titanium dioxide, and calcium oxide. Some embodiments and implementations may comprise selected concentrations of one or more such compounds to yield certain preferred results. | 09-18-2014 |
20140265065 | CHARGE-COMPENSATING DOPANT STABILIZED ALUMINA-ZIRCONIA CERAMIC MATERIALS AND RELATED MATERIALS, APPARATUS, AND METHODS - Ceramic materials comprising charge-compensating dopants and related methods. In some embodiments, the materials may comprise dopants such as Y | 09-18-2014 |
Patent application number | Description | Published |
20090185988 | POLYVINYL ULTRAVIOLET LIGHT ABSORBERS FOR PERSONAL CARE - UV-absorbing polymers and copolymers suitable for Composition into sunscreens for the protection of human skin. The UV-absorbing chromophoric monomers chosen are simple and easily synthesized. With the correct choice of chromophoric monomer or mixture of monomers, protection against UV-A radiation or against both UV-A and UV-B radiation can be achieved. With the correct choice of comonomer, copolymers produced as aqueous latex emulsions or as Polyethylene Glycol solutions can also be achieved. | 07-23-2009 |
20100242999 | COMPOSITIONS AND METHODS FOR REMOVING ORGANIC SUBSTANCES - Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices. | 09-30-2010 |
20120073607 | POLYMERIC OR MONOMERIC COMPOSITIONS COMPRISING AT LEAST ONE MONO-AMIDE AND/OR AT LEAST ONE DIAMIDE FOR REMOVING SUBSTANCES FROM SUBSTRATES AND METHODS FOR USING THE SAME - Compositions and methods useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Methods are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. The compositions and methods may be suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices. | 03-29-2012 |
20120108486 | COMPOSITIONS AND METHODS FOR REMOVING ORGANIC SUBSTANCES - Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices. | 05-03-2012 |
20130123411 | Compositions and Methods for Removing Organic Substances - Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices. | 05-16-2013 |
20130273479 | PROCESSESS AND COMPOSITIONS FOR REMOVING SUBSTANCES FROM SUBSTRATES - Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices. | 10-17-2013 |
20140069458 | PROCESSES AND COMPOSITIONS FOR REMOVING SUBSTANCES FROM SUBSTRATES - Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices. | 03-13-2014 |