Mcalpin
Casey R. Mcalpin, Golden, CO US
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20120261567 | METAL OXIDE LASER IONIZATION-MASS SPECTROMETRY - Disclosed herein are metal oxides, metal oxide surfaces, and methods of using metal oxides and metal oxide surfaces for matrix-free analysis, identification, and characterization of small molecular mass compounds. The disclosed compounds and methods may be used with laser desorption/ionization-mass spectrometry. The disclosed surfaces may aid in producing mass/charge spectra having low or no interference found with traditional matrices. In some aspects, the method may be used to produce molecular ions. The disclosed compounds, surfaces, and methods may be used to analyze complex mixtures including fuels, vegetable shortening, lipid extracts from a variety of organic sources such as animals, plants, bacteria, algae, viruses, etc | 10-18-2012 |
John J. Mcalpin, Cary, NC US
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20150254686 | End of Life Product Planning - Embodiments include a data based methodology for projecting cumulative shipments of a product throughout the balance of its life cycle. Critical milestones are defines, and are employed to break a product life cycle into manageable segments. A double base line curve is employed, with a first baseline curve representing shipment of a predecessor product prior to announcement of the new product and a second baseline curve representing shipment of the predecessor product after announcement of the new product. The curves are used as a reference point with a product analysis to statistically forecast an end of life demand for the predecessor product. | 09-10-2015 |
20150254689 | End of Life Product Planning - Embodiments include a data based methodology for projecting cumulative shipments of a product throughout the balance of its life cycle. Critical milestones are defines, and are employed to break a product life cycle into manageable segments. A double base line curve is employed, with a first baseline curve representing shipment of a predecessor product prior to announcement of the new product and a second baseline curve representing shipment of the predecessor product after announcement of the new product. The curves are used as a reference point with a product analysis to statistically forecast an end of life demand for the predecessor product. | 09-10-2015 |
Ken Mcalpin US
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20120014102 | VERSATILE LIGHTING UNITS - Systems and methods which provide a versatile lighting module which may be utilized alone or in combination with other lighting modules to provide any number of lighting unit configurations are shown. Lighting modules of embodiments herein are adapted to facilitate electrical connection, whether to one or more power supply and/or to one or more other lighting module, along any portion of the entire periphery of the lighting module. Accordingly, lighting modules may be coupled together in any orientation, geometry, and topology to cooperate as a light source having various desired characteristics according to embodiments herein. | 01-19-2012 |
20120294008 | VERSATILE LIGHTING UNITS - Systems and methods which provide a versatile lighting module which may be utilized alone or in combination with other lighting modules to provide any number of lighting unit configurations are shown. Lighting modules of embodiments herein are adapted to facilitate electrical connection, whether to one or more power supply and/or to one or more other lighting module, along any portion of the entire periphery of the lighting module. Accordingly, lighting modules may be coupled together in any orientation, geometry, and topology to cooperate as a light source having various desired characteristics according to embodiments herein. | 11-22-2012 |
Ken Mcalpin, Hitchcock, TX US
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20130235584 | SYSTEMS AND METHODS FOR PROVIDING A FIELD REPAIRABLE LIGHT FIXTURE WITH A HOUSING THAT DISSIPATES HEAT - Systems and methods disclosed herein provide one or more light emitting diode (LED) lighting fixture, which effectively dissipate heat. Embodiments include one or more printed circuit board (PCB) each having a front surface and a back surface, wherein the front surface may comprise strategically spaced LEDs and one or more thermal heat dissipaters, which draw heat away from the LEDs. The back surface may comprise one or more thermal heat dissipaters, covering a substantial portion of the back surface, wherein the back surface thermal heat dissipaters are thermally connected to the front surface thermal heat dissipaters. The LED fixture may also comprise one or more drivers which drive the PCB. The PCB and driver may be housed within a PCB chamber and a driver chamber, respectively, of a housing fixture, which may provide heat dissipation, structural support, and environmental protection for the components housed therein. | 09-12-2013 |
Neil Mcalpin, Balmain AU
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20100045313 | METHOD FOR TESTING INTEGRATED CIRCUITS MOUNTED ON A CARRIER - A method for testing integrated circuits mounted on a carrier includes the step of securing the carrier. The carrier is displaced into an operative position in which the integrated circuits are in physical and electrical communication with a diagnostic probe. Test signals are generated in test circuitry in electrical communication with the diagnostic probe and communicated to the integrated circuits with the diagnostic probe. The test signals are received at the test circuitry via the diagnostic probe. The test signals are made available to a controller via a communications link and an automated server and displayed with the controller. | 02-25-2010 |
20100045315 | DIAGNOSTIC PROBE ASSEMBLY FOR PRINTHEAD INTEGRATED CIRCUITRY - The invention provides for a diagnostic probe assembly for a tester which is used to diagnose printhead integrated circuits. The probe assembly includes a support assembly and a controller board mounted on the support assembly and having a processor configured to generate test signals for testing a printhead integrated circuit. A routing board is in operative signal communication with the controller board and is configured to multiplex the generated test signals for respective dies of the printhead integrated circuits. The probe assembly also includes a probe interface in signal communication with the routing board and configured for relaying the multiplexed test signals to and from the respective dies. | 02-25-2010 |
20100045330 | APPARATUS FOR TESTING INTEGRATED CIRCUITRY - A testing apparatus for testing integrated circuits mounted in a carrier includes a support assembly. A controller is mounted in the support assembly. The controller is programmed to process test signals from the integrated circuits. A retaining assembly is arranged on the support assembly and is configured to receive and retain the carrier during testing. A displacement mechanism is arranged on the support assembly for displacing the retaining assembly relative to the support assembly into and out of an operative condition. Testing circuitry is operatively connected to the controller and has at least test signal generation and measurement circuitry and adaptor circuitry for operative engagement with the integrated circuits being tested, the adaptor circuitry being configured to provide both a physical and an electrical interface with the integrated circuits. | 02-25-2010 |
20100049464 | SYSTEM FOR TESTING INTEGRATED CIRCUITS - The invention provides for a system for testing integrated circuitry. The system includes a local computational device, a communications link connected to the computational device, and testing circuitry operatively connected to the computational device via the communications link and configured to generate integrated circuitry test signals. The system also includes adaptor circuitry connected to the testing circuitry and configured to provide an electrical and physical interface with the integrated circuits, as well as routing circuitry interposed between the testing and adaptor circuitry to rout the test signals to respective dies of the integrated circuits. Also included is a handling mechanism for retaining and manipulating a carrier on which the integrated circuits are positioned, and a controller operatively connected to the handling mechanism for controlling operation thereof and connected to the communications device for supervision by the computational device. | 02-25-2010 |