Patent application number | Description | Published |
20100246140 | Circuit Board and Method for Manufacturing Semiconductor Modules and Circuit Boards - The deterioration of dielectric breakdown strength arising from an opening of a metal plate is prevented and the reliability as a circuit board is enhanced. A circuit board is provided with a metal plate, having openings, as core material. The opening is provided in a manner that the size of the opening gradually increases from a lower surface side toward an upper surface side of the metal plate. On both surface sides of the metal plate there are provided wiring patterns, respectively, via insulating layers. The insulating layer provided on an upper region of the opening and the corresponding wiring pattern are provided such that they have a recess on the upper surface of them. To electrically connect each wiring pattern, the circuit board further includes a conductor which penetrates the metal plate via the opening and which connects the wiring patterns with each other. An LSI chip is directly coupled to the upper surface side of the metal plate via a solder ball. | 09-30-2010 |
20100264552 | CIRCUIT DEVICE, METHOD OF MANUFACTURING THE CIRCUIT DEVICE, DEVICE MOUNTING BOARD AND SEMICONDUCTOR MODULE - A circuit device includes an insulating base provided with a resin layer mixed with a fibrous filler, bumps provided in the insulating base and functioning as electrodes for connection, a semiconductor device that is flip-chip mounted, and an underfill filling a gap between the semiconductor device and the insulating base. By allowing the fibrous filler projecting through the top surface of the resin layer to be in contact with the underfill, strength of adhesion between the underfill and the insulating base is improved. | 10-21-2010 |
20100299920 | METHODS FOR MANUFACTURING DEVICE MOUNTING BOARD AND CIRCUIT SUBSTRATE - To reduce connection defects between a circuit substrate provided on a core substrate and a circuit to be mounted thereon, thereby improving reliability as a multilayered device mounting substrate. The device mounting substrate includes: a first circuit substrate composed of a substrate, an insulating layer formed on this substrate, and a first conductive layer (including conductive parts) formed on this insulating layer; and a second circuit substrate mounted on the first circuit substrate, being composed of a base, a second conductive layer (including conductive parts) formed on the bottom of the base, and a third conductive layer (including conductive parts) formed on the top of the base. Here, the first and second circuit substrates are bonded by pressure so that the first and second conductive parts are laminated and embedded together into the insulating layer. The first and second conductive parts form connecting areas in the insulating layer, thereby connecting the first and second circuit substrates electrically. | 12-02-2010 |
20110180933 | SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD - A wiring layer is formed on a substrate, and a semiconductor device is mounted on the substrate. The wiring layer and the semiconductor device are sealed by a sealing resin. A conductive member is used to fill a through hole formed in the sealing resin in a predetermined position of the wiring layer and is provided so as to cover over the sealing resin. The metal foil is provided on the upper surface of the conductive member, and the metal foil and the wiring layer are electrically connected via the conductive member. | 07-28-2011 |
20110186993 | SEMICONDUCTOR MODULE AND PORTABLE APPARATUS PROVIDED WITH SEMICONDUCTOR MODULE - A semiconductor element mounted on an insulating resin layer formed on a wiring layer is sealed by a sealing resin. On the wiring layer, a protruding electrode protruding to the side of the semiconductor element and a protruding section are integrally formed with the wiring layer, respectively. The protruding electrode is electrically connected to an element electrode of the semiconductor element by penetrating the insulating resin layer. The protruding section is arranged to surround the semiconductor element along the four sides of the semiconductor element, and is embedded in the sealing resin up to a position above a section where the protruding electrode and the element electrode are bonded. | 08-04-2011 |
20110241203 | SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, AND PORTABLE APPARATUS - A semiconductor module includes a device mounting board and a semiconductor device. The semiconductor device and the device mounting board are flip-chip connected to each other, and a device electrode provided in the semiconductor device and a substrate electrode provided in the device mounting board are connected by soldering. In a cross section along a line connecting the adjacent substrate electrodes, the width L | 10-06-2011 |
20120098137 | ELEMENT MOUNTING SUBSTRATE AND SEMICONDUCTOR MODULE - Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal can be obstructed, and the metal protected; by covering substantially the whole area of the front and back sides of the metal core, consisting of metal as the main material, with a first ceramic film and a second ceramic film that obstruct the ductility of the aforementioned metal-core; and covering each of the ceramic films with insulated resin films, to cover the fragility of these ceramics. | 04-26-2012 |
20140063767 | CIRCUIT DEVICE - A circuit device according to one exemplary embodiment includes a ceramic substrate, a first conductive pattern provided on one face of the ceramic substrate, a second conductive pattern, formed mainly of Cu, which is provided on the other face of the ceramic substrate, and a semiconductor element provided on an island that constitutes the second conductive pattern. An electrode, whose outermost surface is formed mainly of Cu, is provided in the semiconductor element, and the interface between the island and the electrode is directly fixed by solid-phase bonding. | 03-06-2014 |
20140084452 | ELEMENT MOUNTING BOARD AND SEMICONDUCTOR MODULE - Prepared in advance is a substrate formed of metallic material where slits are formed between mounting regions. Oxide films are generated all over the substrate including end faces of the substrate. Exposed are only lateral faces corresponding to the cross sections cut when tie bars are cut. This structure and the fabrication method minimize the area of cutting faces in the metallic material. | 03-27-2014 |