Mavliev
Rashid Mavliev, Campbell, CA US
Patent application number | Description | Published |
---|---|---|
20100007879 | SYSTEMS AND METHODS FOR IN-LINE MONITORING OF PARTICLES IN OPAQUE FLOWS - Systems and methods are disclosed for particle monitoring. An exemplary method includes confining a flowable sample which is opaque to at least a first range of wavelengths of light waves; measuring transparency of the flowable sample; compressing the flowable sample in a first direction while confining the sample in a second direction parallel to a flow direction of the flowable sample and orthogonal to the first direction, while elongating the sample in a third direction orthogonal to the first and second directions. When the sample is compressed in the first direction, the sample becomes transparent to at least one of the wavelengths in the first range of wavelengths, and the method can include identifying characteristics of particles contained in the sample which has been compressed. | 01-14-2010 |
20100231910 | SYSTEMS AND METHODS FOR IN-LINE MONITORING OF PARTICLES IN OPAGQUE FLOWS - Systems and methods are disclosed for particle monitoring. An exemplary method includes confining a flowable sample which is opaque to at least a first range of wavelengths of light waves; measuring transparency of the flowable sample; compressing the flowable sample in a first direction while confining the sample in a second direction parallel to a flow direction of the flowable sample and orthogonal to the first direction, while elongating the sample in a third direction orthogonal to the first and second directions. When the sample is compressed in the first direction, the sample becomes transparent to at least one of the wavelengths in the first range of wavelengths, and the method can include identifying characteristics of particles contained in the sample which has been compressed. | 09-16-2010 |
20110053465 | METHOD AND APPARATUS FOR LOCAL POLISHING CONTROL - A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conductive portions of a substrate by controlling an electrical bias profile across a processing area, thereby controlling processing rates between two or more conductive portions of the substrate. | 03-03-2011 |
Rashid Mavliev, Santa Clara, CA US
Patent application number | Description | Published |
---|---|---|
20090120803 | Pad for electrochemical processing - Systems and methods for electrochemically processing. In one embodiment, a plurality of grooves are formed in a polishing surface of a polishing pad. The grooves are adapted to facilitate the flow of polishing fluid over the polishing pad. Conductive layers are respectively formed in the grooves, wherein the conductive layers are in electrical communication with each other. | 05-14-2009 |
Rashid A. Mavliev, Campbell, CA US
Patent application number | Description | Published |
---|---|---|
20090032408 | ELECTROLYTE RETAINING ON A ROTATING PLATEN BY DIRECTIONAL AIR FLOW - A method and apparatus for retaining electrolyte on a rotating platen using directional air flow is provided. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surface for supporting a processing pad and disposed on a stationary base so that the platen assembly may rotate relative to the base; and an air knife coupled to the base and extended over a portion of the surface, the air knife operable to deliver a stream of air toward the pad to divert at least a portion of a fluid disposed on the pad toward a center of the pad. | 02-05-2009 |
20090042481 | METHOD OF CALIBRATING OR COMPENSATING SENSOR FOR MEASURING PROPERTY OF A TARGET SURFACE - A method of calibrating or compensating a sensor for measuring property of target surface is provided. In one embodiment, a liquid reference surface is formed on a platen. A sensor is used to measure a feature property of the reference surface. The measured feature property of the reference surface may be used to calibrate the sensor. Further, the sensor is used to measure the feature property of a polishing pad. The measured feature property of the reference surface may be used to compensate the measured feature property of the polishing pad. | 02-12-2009 |
20090241996 | SINGLE WAFER DRYER AND DRYING METHODS - In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing. | 10-01-2009 |