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Matthew R. Archibald, Morrisville US

Matthew R. Archibald, Morrisville, NC US

Patent application numberDescriptionPublished
20090150123METHOD OF LAYING OUT A DATA CENTER USING A PLURALITY OF THERMAL SIMULATORS - A method is provided for facilitating installation of one or more electronics racks within a data center. The method includes: placing a plurality of thermal simulators in the data center in a data center layout to establish a thermally simulated data center, each thermal simulator simulating at least one of airflow intake or heated airflow exhaust of a respective electronics rack of a plurality of electronics racks to be installed in the data center; monitoring temperature within the thermally simulated data center at multiple locations, and verifying the data center layout if measured temperatures are within respective acceptable temperature ranges for the data center when containing the plurality of electronics racks; and establishing the plurality of electronics racks within the data center using the verified data center layout, the establishing including at least one of reconfiguring or replacing each thermal simulator with a respective electronics rack.06-11-2009
20090150129APPARATUS AND METHOD FOR SIMULATING HEATED AIRFLOW EXHAUST OF AN ELECTRONICS SUBSYSTEM, ELECTRONICS RACK OR ROW OF ELECTRONICS RACKS - Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.06-11-2009
20090150133APPARATUS AND METHOD FOR SIMULATING ONE OR MORE OPERATIONAL CHARACTERISTICS OF AN ELECTRONICS RACK - Apparatus and method are provided for facilitating simulation of one or more operating characteristics of an electronics rack. The apparatus includes a rack frame, one or more air-moving devices associated with the rack frame, and an adjustable heat source associated with the rack frame. The one or more air-moving devices establish airflow through the rack frame from an air inlet side to an air outlet side thereof, wherein the established airflow through the rack frame is related to airflow through the electronics rack to be simulated. The adjustable heat source heats air passing through the rack frame, with heated air exhausting from the air outlet side of the rack frame simulating heated air exhausting from the electronics rack.06-11-2009
20100138174Establishing A Power Profile For Generating Electrical Ratings - Establishing a power profile of power consuming components of computer system configurations for generating electrical ratings, beginning with a default, limited configuration of a computer system and continuing for a number of configurations of the computer system, each configuration including additional power consuming components not included in a previous configuration, where establishing a power profile includes: measuring, for a present configuration, power consumption of the computer system; calculating, in dependence upon the measured power consumption for the present configuration, an estimated power rating for the one or more additional power consuming components; and recording, in a power profile, estimated power ratings for the additional power consuming components, where the number of configurations of the computer system for which power consumption is measured is less than the number of possible configurations of the computer system.06-03-2010
20110010151FLUID DISTRIBUTION APPARATUS AND METHOD FACILITATING COOLING OF ELECTRONICS RACK(S) AND SIMULATING HEATED AIRFLOW EXHAUST OF ELECTRONICS RACK(S) - Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.01-13-2011
20120020009Computer Chassis Cooling Sidecar - A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar including an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis.01-26-2012
20120033368Hot Or Cold Aisle Computer Chassis - A chassis for a plurality of computers for use in a data center, the chassis at least one extensible fin, the fin either extensible perpendicularly from the front of the chassis or extensible parallel with the front of the chassis.02-09-2012
20120035781Dynamically Adjustable Floor Tile For A Data Center - A dynamically adjustable floor tile for a data center including a plurality of perforations; and a dynamically adjustable aperture, wherein opening the aperture exposes one or more of the perforations to airflow through the floor tile and closing the aperture blocks one or more of the apertures to airflow through the floor tile.02-09-2012

Patent applications by Matthew R. Archibald, Morrisville, NC US