| Patent application number | Description | Published |
|---|
| 20080238582 | Flexible Capacitive Coupler Assembly And Method Of Manufacture - A flexible capacitive coupler assembly includes a flexible dielectric substrate assembly having a front surface and a rear surface, the front surface having thereon a macroscopic metal capacitive pad. A package supports the flexible dielectric substrate. An electrical connection is made to package wiring or leads on the flexible dielectric substrate to establish electrical contact with a computer subsystem. | 10-02-2008 |
| 20080266502 | METHOD OF PRODUCING UV STABLE LIQUID CRYSTAL ALIGNMENT - In a liquid crystal display device, a method for creating desirable pretilt angle by means of topography of the substrates, such as a surface that is sloped with respect to the surface of the electrodes. In combination with a low pretilt but highly photo-stable alignment layer, which may be very resistant to high levels of ultraviolet radiation, a high pretilt and photo-stable alignment structure is generated, by essentially combining two incompatible technical approaches. The ever more stringent requirements for projection displays are met. The methods for producing such sloped surfaces and the considerations related to design of the sloped surfaces are disclosed. | 10-30-2008 |
| 20080315409 | DIRECT EDGE CONNECTION FOR MULTI-CHIP INTEGRATED CIRCUITS - The present invention allows for direct chip-to-chip connections using the shortest possible signal path. | 12-25-2008 |
| 20090001248 | Methods of Creating Molds of Variable Solder Volumes for Flip Attach - A solder mold includes a substrate and a plurality of cavities for holding solder to be transferred to an integrated circuit. The plurality of cavities comprises cavities of at least two different volumes. | 01-01-2009 |
| 20090004840 | Method of Creating Molds of Variable Solder Volumes for Flip Attach - A method for fabricating a solder transfer mold includes masking a substrate with a masking agent. A pattern is transferred to the substrate mask. The masked substrate is etched until cavities of a first volume are formed. The cavities of the first volume are selectively coated. The masked substrate is etched until cavities of a second volume are formed. | 01-01-2009 |
| 20090289638 | MICROWAVE READOUT FOR FLUX-BIASED QUBITS - A method for determining whether a quantum system comprising a superconducting qubit is occupying a first basis state or a second basis state once a measurement is performed is provided. The method, comprising: applying a signal having a frequency through a transmission line coupled to the superconducting qubit characterized by two distinct, separate, and stable states of differing resonance frequencies each corresponding to the occupation of the first or second basis state prior to measurement; and measuring at least one of an output power or phase at an output port of the transmission line, wherein the measured output power or phase is indicative of whether the superconducting qubit is occupying the first basis state or the second basis state. | 11-26-2009 |
| 20090311849 | METHODS OF SEPARATING INTEGRATED CIRCUIT CHIPS FABRICATED ON A WAFER - Improved methods of separating integrated circuit chips fabricated on a single wafer are provided. In an embodiment, a method of separating integrated circuit chips fabricated on a wafer comprises: attaching a support to a back surface of the wafer; dicing the wafer to form individual integrated circuit chips attached to the support; attaching a carrier comprising a releasable adhesive material to a front surface of the wafer opposite from the back surface; separating the support from the back surface of the wafer; subjecting the carrier to an effective amount of heat, radiation, or both to reduce the adhesiveness of the adhesive material to allow for removal of at least one of the integrated circuit chips from the carrier; and picking up and moving at least one of the integrated circuit chips using a tool configured to handle the integrated circuit chips. | 12-17-2009 |
| 20100038126 | INTERPOSER STRUCTURES AND METHODS OF MANUFACTURING THE SAME - Flexible and rigid interposers for use in the semiconductor industry and methods for manufacturing the same are described. Auto-catalytic processes are used to minimize the costs associated with the production of flexible interposers, while increasing the yield and lifetime. Electrical contact regions are easily isolated and the risk of corrosion is reduced because all portions of the interposer are plated at once. Leads projecting from the flexible portion of the interposers accommodate a greater variety of components to be tested. Rigid interposers include a pin projecting from a probe pad affixed to a substrate. The rigidity of the pin penetrates oxides on a contact pad to be tested. Readily available semiconductor materials and processes are used to manufacture the flexible and rigid interposers according to the invention. The flexible and rigid interposers can accommodate pitches down to 25 μm. | 02-18-2010 |
