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Matsuki, Tokyo

Hiroshi Matsuki, Tokyo JP

Patent application numberDescriptionPublished
20090246366APPARATUS AND METHOD FOR PREPARING PARTICULATES - Disclosed herein is an apparatus for preparing composite particulates, including a rotary body having a bottom surface and a side wall and operative to contain particulates to which an adhering material is to be made to adhere; a centrifugal machine for rotating the rotary body so as to apply centrifugal forces to the particulates in the rotary body; and an inclination varying device operative to vary the inclination of the rotary body to an arbitrary inclination angle in the range from an angle at which the bottom surface of the rotary body forms a horizontal surface perpendicular to the direction of gravity to an angle at which the bottom surface forms a vertical surface parallel to the direction of gravity, and operative to support the rotary body at the arbitrary inclination angle.10-01-2009
20100112203APPARATUS AND METHOD FOR PREPARING COMPOSITE PARTICULATES - A method of preparing composite materials by (a) containing particulates to which an adhering material is to be made to adhere, in a rotary body having a bottom surface and a side wall; (b) rotating the rotary body so as to apply centrifugal forces to the particulates in the rotary body; and (c) varying the inclination of the rotary body to an arbitrary inclination angle in the range from an angle at which the bottom surface of the rotary body forms a horizontal surface perpendicular to the direction of gravity to an angle at which the bottom surface forms a vertical surface parallel to the direction of gravity, and supporting the rotary body at the arbitrary inclination angle05-06-2010

Kazuhiko Matsuki, Tokyo JP

Patent application numberDescriptionPublished
20110156101SEMICONDUCTOR DEVICE AND LAYOUT DESIGN APPARATUS OF SEMICONDUCTOR DEVICE - A semiconductor device may include a plurality of logic circuits connected to each other through input and output terminals thereof. The plurality of logic circuits comprising a first sub-plurality of logic circuits coupled to a first one of different power systems. The first sub-plurality of logic circuits is laid out and adjacent to each other in a first direction. The first sub-plurality of logic circuits includes a first logic circuit and a second logic circuit. The second logic circuit is adjacent to the first logic circuit. The first logic circuit includes a first element comprising a first diffusion layer. The second logic circuit includes a second element comprising the first diffusion layer.06-30-2011

Kazuto Matsuki, Tokyo JP

Patent application numberDescriptionPublished
20120081538PATTERN INSPECTION APPARATUS - This pattern inspection apparatus includes an inspection region information storage unit that stores an inspection region specified in a pattern region, a pattern surface height detection unit that detects a pattern surface height signal corresponding to a pattern surface height measurement position on the inspection sample, an autofocus mechanism that focuses on the inspection sample using the pattern surface height signal detected by the pattern surface height detection unit, a determination unit, and an autofocus mechanism control unit. When the determination unit determines that the pattern surface height measurement position is located within the inspection region, the autofocus mechanism control unit drives the autofocus mechanism, and the determination unit determines that the pattern surface height measurement position is not located within the inspection region, the autofocus mechanism control unit stops the autofocus mechanism.04-05-2012

Naoki Matsuki, Tokyo JP

Patent application numberDescriptionPublished
20100067749IMAGE PROCESSING APPARATUS, IMAGE PROCESSING METHOD, AND PROGRAM - An image processing apparatus comprises an image processing unit configured to execute image processing which involves a change in a boundary shape of image data; a face detection unit configured to detect a face region included in the image data; a setting unit configured to set a parameter of the image processing; and a determination unit configured to determine whether or not to execute the image processing or whether or not to output a warning in accordance with the parameter of the image processing set by the setting unit and a position of the face region detected by the face detection unit.03-18-2010

Nobuo Matsuki, Tokyo JP

Patent application numberDescriptionPublished
20080299326PLASMA CVD APPARATUS HAVING NON-METAL SUSCEPTOR - A plasma CVD apparatus includes: a cooling susceptor for placing a substrate thereon and serving as an electrode; and a shower plate for introducing gas toward the susceptor via multiple throughholes formed therein. The shower plate serves as an electrode and is disposed in parallel to the susceptor. The cooling susceptor is made of a ceramic material provided with a cooling fluid flow path for passing a cooling fluid therethrough.12-04-2008
20080305648METHOD FOR FORMING INORGANIC SILAZANE-BASED DIELECTRIC FILM - A method of forming an inorganic silazane-based dielectric film includes: introducing a gas constituted by Si and H and a gas constituted by N and optionally H into a reaction chamber where an object is placed; controlling a temperature of the object at −50° C. to 50° C.; and depositing by plasma reaction a film constituted by Si, N, and H containing inorganic silazane bonds.12-11-2008
20090068852METHOD OF FORMING A CARBON POLYMER FILM USING PLASMA CVD - A method forms a hydrocarbon-containing polymer film on a semiconductor substrate by a capacitively-coupled plasma CVD apparatus. The method includes the steps of: vaporizing a hydrocarbon-containing liquid monomer (C03-12-2009
20090156017METHOD FOR FORMING DIELECTRIC FILM USING SILOXANE-SILAZANE MIXTURE - A method of forming a dielectric film, includes: introducing a siloxane gas essentially constituted by Si, O, C, and H and a silazane gas essentially constituted by Si, N, H, and optionally C into a reaction chamber where a substrate is placed; depositing a siloxane-based film including Si—N bonds on the substrate by plasma reaction; and annealing the siloxane-based film on the substrate in an annealing chamber to remove Si—N bonds from the film.06-18-2009

Patent applications by Nobuo Matsuki, Tokyo JP

Takuji Matsuki, Tokyo JP

Patent application numberDescriptionPublished
20080258459Pipe Joint - A pipe joint 10-23-2008
20100162553DIAPHRAGM DAMPER AND METHOD OF PRODUCTION AND PRODUCTION APPARATUS OF SAME - A method of producing a diaphragm damper 07-01-2010

Patent applications by Takuji Matsuki, Tokyo JP

Yasuo Matsuki, Tokyo JP

Patent application numberDescriptionPublished
20090022891METHOD OF FORMING METAL FILM - A method of forming a metal film, comprising the steps of: 01-22-2009
20090142617COMPOSITION FOR FORMING SILICON-ALUMINUM FILM, SILICON-ALUMINUM FILM AND METHOD FOR FORMING THE SAME - A composition for forming a silicon.aluminum film, containing a silicon compound and an aluminum compound. The silicon.aluminum film is obtained by forming a coating film of the above composition and treating it with heat and/or light.06-04-2009
20090215920SILANE POLYMER AND METHOD FOR FORMING SILICON FILM - There are provided a silane polymer having a higher molecular weight from the viewpoints of wettability when applied to a substrate, a boiling point and safety, a composition which can form a high-quality silicon film easily, a silicon film forming composition which comprises a silane polymer obtained by irradiating a photopolymerizable silane compound with light of specific wavelength range to photopolymerize it, and a method for forming a silicon film which comprises applying the composition to a substrate and subjecting the coating film to a heat treatment and/or a light treatment.08-27-2009
20100029057SILICONE RESIN COMPOSITION AND METHOD OF FORMING A TRENCH ISOLATION - A silicone resin which is represented by the following rational formula (1) and solid at 120° C.:02-04-2010
20110158886POLYSILANE PRODUCTION PROCESS - A polysilane production process comprising reacting a specific silane compound typified by a cyclic silane compound represented by the following formula (2) in the presence of a binuclear metal complex represented by the following formula (4).06-30-2011
20110184141POLYMER PRODUCTION PROCESS - A polymer production process comprising reacting a compound represented by the following formula (1) in the presence of a binuclear metal complex represented by the following formula (2).07-28-2011
20110229654COMPOSITION AND METHOD FOR FORMING AN ALUMINUM FILM - A composition for forming an aluminum film, comprising a complex represented by the following formula (1) and a complex represented by the following formula (2), the molar ratio of the complex represented by the following formula (1) and the complex represented by the following formula (2) being 40:60 to 85:15:09-22-2011
20110236583CONTAINER CONTAINING A COBALT CARBONYL COMPLEX AND COBALT CARBONYL COMPLEX COMPOSITION - A container containing a cobalt carbonyl complex and a gas that contains carbon monoxide, and a cobalt carbonyl complex composition comprising a cobalt carbonyl complex and a solvent, wherein the concentration of carbon monoxide dissolved in the solvent is 0.001 to 1 wt %.09-29-2011
20110318939HIGH ORDER SILANE COMPOSITION AND METHOD OF MANUFACTURING A FILM-COATED SUBSTRATE - A composition comprising a high order silane compound and a solvent, wherein the solvent contains a cyclic hydrocarbon which has one or two double bonds and no alkyl group, is composed of only carbon and hydrogen and has a refractive index of 1.40 to 1.51, a specific permittivity of not more than 3.0 and a molecular weight of not more than 180.12-29-2011
20120064302PATTERNING METHOD - A patterning method comprising the steps of:03-15-2012

Patent applications by Yasuo Matsuki, Tokyo JP

Yutaka Matsuki, Tokyo JP

Patent application numberDescriptionPublished
20110045287SEALING RESIN SHEET - Disclosed is a sealing resin sheet for allowing a resin layer in a softened state to adhere to and seal a material to be sealed, wherein the resin layer comprises an adhesive resin.02-24-2011