Patent application number | Description | Published |
20080217051 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A wiring board including a plated through hole provided on the wiring board, and an indicator provided around the plated through hole. The indicator indicating a processing state related to the plated through hole. | 09-11-2008 |
20080217052 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A wiring board including a plated through hole formed in the wiring board; a test plated through hole or a test via hole provided in the surrounding area of the plated through hole to check a processing state related to the plated through hole; and a conductive pattern used to electrically connect the plated through hole to the test through hole or the test via hole. | 09-11-2008 |
20090166080 | MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A multilayer wiring board is manufactured by preparing a first wiring board, a second wiring board, and a joint sheet. The first wiring board is provided with a via having a first through-hole in which a conductive film is formed. The second wiring board is provided with a second through-hole at a position substantially matching the position of the first through-hole. The joint sheet is provided with a third through-hole at a position substantially matching the positions of the first and the second through-holes. the first wiring board and the second wiring board are stacked and bonded together by heat and pressure with the joint sheet interposed therebetween. | 07-02-2009 |
20110073354 | PRINTED BOARD AND METHOD OF MANUFACTURING PRINTED BOARD - A printed board includes an insulating body that has a flat surface and includes insulating cloth including first fibers and second fibers that cross the first fibers at right angles on the flat surface, and printed wiring including a plurality of signal lines that run parallel to each other and are laid out on the flat surface of the insulating body so that a direction of the signal lines is tilted to a direction of the first or second fibers at an angle which is determined based on board-cutting efficiency of the insulating body and a predetermined delay-time difference between the signal lines. | 03-31-2011 |
20110232949 | Printed Wiring Board Manufacturing Method and Printed Wiring Board - A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings. | 09-29-2011 |
20110241233 | METHOD FOR MANUFACTURING OPTICAL WAVEGUIDE - A method for manufacturing an optical waveguide in which multiple cores are embedded in a parallel-arranged fashion within a single cladding, the cores having a refractive index of light different from that of the cladding, the method includes forming the multiple cores in a state where the adjacent cores are connected by a rib, forming the cladding around the rib and the multiple cores by curing a cladding material there around, and a cutting to the rib. | 10-06-2011 |
20110308840 | WIRING SUBSTRATE - A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles. | 12-22-2011 |
20110308842 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE WIRING SUBSTRATE - A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged. | 12-22-2011 |
20120106105 | WIRING BOARD HAVING A PLURALITY OF VIAS - A wiring board unit includes a connector having a plurality of terminals; and a wiring board on which the connector is mounted. The wiring board includes a first wiring pattern provided on a first wiring layer, a second wiring pattern provided on a second wiring layer at a position shallower than the first wiring layer, a first via formed in a first recess having a first depth, the first via being in contact with the first wiring pattern, and a second via formed in a second recess having a second depth that is smaller than the first depth, the second via being in contact with the second wiring pattern. | 05-03-2012 |
20120188735 | CIRCUIT BOARD AND ELECTRONIC DEVICE - An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings. | 07-26-2012 |
20120234587 | PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD UNIT, ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board is disclosed that includes insulating layers, conductive layers stacked with the insulating layers alternately, a through hole penetrating the insulating layers and the conductive layers, a first plate resist part formed on a first portion of an inner wall of the through hole, the first portion being located from one end of the through hole to one of the conductive layers stacked between one pair of the insulating layers, and a plated part formed on a second portion of the inner wall of the through hole other than the first portion. | 09-20-2012 |
20150116962 | CIRCUIT BOARD AND ELECTRONIC DEVICE - An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings. | 04-30-2015 |
Patent application number | Description | Published |
20090087984 | FORMING METHOD OF ELECTRODE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A forming method of an electrode includes the steps of providing an electrode material on a conductive part; exposing the electrode material at a temperature equal to or higher than a melting point of the electrode material in an oxidizing atmosphere; and exposing the melted electrode material, in a reducing atmosphere, at a temperature equal to or higher than the melting point of the electrode material and lower than the temperature at which the electrode material is exposed in the oxidizing atmosphere. | 04-02-2009 |
20090184156 | PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR - A process for producing a semiconductor device, includes: first melting by heating only a superior portion of a bump formed on an electrode on one principle surface of a semiconductor substrate; and second melting the entire bump by also heating an inferior portion of the bump. | 07-23-2009 |
20120187181 | REFLOW APPARATUS, A REFLOW METHOD, AND A MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE - A reflow apparatus, where formic acid is used for cleaning a surface of a solder electrode on a processing target, is disclosed. The reflow apparatus includes a processing chamber, a formic acid introduction mechanism for supplying an atmosphere gas containing formic acid to the processing chamber, and a shielding member that is made of a material having corrosion resistance against formic acid. The shielding member is arranged between a reflow processing section of the processing chamber and an inner wall of the processing chamber. In place of or in addition to the shielding member, the reflow apparatus may include a heater for decomposing residual formic acid. | 07-26-2012 |
20120251968 | PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR - A process for producing a semiconductor device, includes: first melting by heating only a superior portion of a bump formed on an electrode on one principle surface of a semiconductor substrate; and second melting the entire bump by also heating an inferior portion of the bump. | 10-04-2012 |
Patent application number | Description | Published |
20110072216 | Memory control device and memory control method - Address information of target data is stored in an ELA register at the start of a cache excluding process performed by BackEviction, and a request processing unit continuously re-executes a data acquiring process while an address of data requested to be acquired by a processor is present in the ELA register. The address information of the target data is stored in an EWB buffer at the start of autonomous move-out performed by a processor, and the cache excluding process performed by BackEviction is stopped when the address of data subjected to BackEviction is present in the EWB buffer. | 03-24-2011 |
20130290654 | DATA WRITING CONTROL DEVICE, DATA WRITING CONTROL METHOD, AND INFORMATION PROCESSING DEVICE - A data writing control device includes: a determination unit that determines whether a request from a requestor is a partial-write request for data and the partial-write is continuously performed to the same address; a transmission unit that, when the request from the requestor is the partial-write request for data and the partial-write is performed to an address different from an address of the previous partial-write, transmits a read request for data to the requestor; and a hold unit that holds write data included in the partial-write request and data indicating a rewritten location of the write data until read data corresponding to the read request for the data is received. | 10-31-2013 |
20130339566 | INFORMATION PROCESSING DEVICE - An information processing device includes: a computing device having a first path for connecting between a computing unit configured to execute a computation process and a peripheral device, a second path for connecting between a computing unit that is included in another computing device and configured to execute a computation process and the peripheral device, and a switching unit configured to switch between the first path and the second path according to a switching signal; and a signal generation unit configured to generate a switching signal, and to output the generated signal to the switching unit. | 12-19-2013 |
20150078253 | INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING SYSTEM, COMMUNICATION METHOD, AND COMPUTER-READABLE STORAGE MEDIUM STORING COMMUNICATION PROGRAM - A routing table stores therein an upper unit for 60 G wireless, a lower unit for 60 G wireless, a left unit for 60 G wireless, a right unit for 60 G wireless, or a WLAN unit as a routing destination based on a direction from its own node to a destination node and a distance therebetween. A routing unit routes a packet to the upper unit for 60 G wireless, the lower unit for 60 G wireless, the left unit for 60 G wireless, the right unit for 60 G wireless, or the WLAN unit based on the routing destination retrieved from the routing table through table retrieval. | 03-19-2015 |
20150078382 | INFORMATION PROCESSING DEVICE, COMMUNICATION METHOD, AND COMPUTER-READABLE STORAGE MEDIUM STORING COMMUNICATION PROGRAM - A node address table (NAT) stores therein a MAC address and a node ID (NID) representing the position of a node in a rack in association with each other for each node, and retrieves NIDs of a destination and its own node based on a destination of a packet and the MAC address of the own node. A destination determination unit determines a routing destination of the packet based on the NIDs of the destination and the own node. A routing unit routes the packet to the routing destination determined by the destination determination unit. | 03-19-2015 |
Patent application number | Description | Published |
20090066484 | RF tag R/W (reader/writer) control method and control apparatus - A failure of execution of an R/W control command with respect to plural RF tags that are attached to a moving thing occurs. There are disclosed a method and apparatus for controlling an R/W (reader/writer) that performs a read/write operation on RF tags attached to a moving body. In this case, the RF tags that are attached to the moving body are detected using the R/W. A schedule that determines execution timing of a control command of the R/W that performs a data read/write operation on the RF tags in accordance with the detected RF tags is created. The R/W control command is executed with respect to the RF tags using the R/W in accordance with timing that is determined in the created schedule. | 03-12-2009 |
20100321167 | INDIVIDUAL-ITEM INFORMATION MANAGEMENT DEVICE AND METHOD - In an assembled product, a decrease in reading efficiency is avoided from being deteriorated by reading the electronic tags of the parts and the assembled product, registering their configuration information, and by placing read restriction on the electronic tags of the parts. For this purpose, manufacturing instruction information, used for assembling parts into an assembled product, is used. When replaced, the electronic tags of the assembled product are read, read restriction is removed from the assembled product, the electronic tag is read, the electronic tag of a new part to be installed is read, read restriction is placed on the electronic tag, and the configuration information is updated. An invalid part replacement is detected by comparing the configuration information. | 12-23-2010 |