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Matsuda, Yokosuka-Shi
Hiromitsu Matsuda, Yokosuka-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090065446 | PROCESS OF TREATING SELENIUM-CONTAINING LIQUID - It is to provide a process of treating a selenium-containing liquid which can inexpensively treat the selenium-containing liquid. The formation of selenate is inhibited by adding at least one selected from a group consisting of Ti and Mn into the selenium-containing liquid. | 03-12-2009 |
Katsuhiro Matsuda, Yokosuka-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090286077 | One-pack type adhesive precoating composition - The present invention relates to a one-pack type adhesive precoating composition comprising (a) a mixture of at least two thermoplastic polymers having different softening points by not less than 30° C., each of which containing a carboxylic acid group or a carboxylic acid anhydride group, (b) a thermoplastic elastomer and (c) a tackifier, dispersed in an organic solvent, with the proviso that the composition does not comprise a latent curing agent. | 11-19-2009 |
Mitsuhiro Matsuda, Yokosuka-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110043121 | LIGHTING CIRCUIT AND ILLUMINATION DEVICE - A lighting circuit according to embodiments includes: a self-hold element connected in series to an AC power source that generates power for lighting an illumination load, together with the illumination load, the self-hold element being configured to control supply of the power provided by the AC power source to the illumination load by the self-hold element being turned on/off; a noise prevention circuit connected in parallel to the self-hold element; and a damping circuit configured to connect a damping resistance to the noise prevention circuit parallely only for a predetermined period from turning-on of the self-hold element, thereby preventing the self-hold element from being repeatedly turned on/off during a period in which the self-hold element is on under normal conditions, due to a transient during power supply. | 02-24-2011 |
Ryotaro Matsuda, Yokosuka-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090023583 | PHOTOCATALYST MATERIAL, PHOTOCATALYST COMPOSITION USING THE SAME AND PHOTOCATALYST PRODUCT - An object of the invention is to provide a photocatalyst material having a higher catalyst effect than conventional photocatalyst materials. The photocatalyst material of the invention contains, as its major component, a tungsten oxide powder excited by a light source which emits light having a wavelength of 430 to 500 nm, the photocatalyst material having a decomposition ability of 50% or more wherein the decomposition ability is given by the following equation based on the following test: | 01-22-2009 |
| 20090296412 | LIGHTING SYSTEM - A spotlight is provided with a substrate having LEDs disposed thereon and a main body casing on which the substrate is provided. The main body casing has a rear side portion having thermal conductivity, which is thermally coupled to the substrate, and is capable of changing the irradiation angle of light emitted from the LEDs. A plurality of heat-radiating fins for forming grooves operating as a plurality of convection paths along the direction of changing the irradiation angle are provided on the rear side portion of the main body casing. | 12-03-2009 |
Shuhei Matsuda, Yokosuka-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100277083 | LIGHTING DEVICE - According to one embodiment, a lighting device includes a device board, a rectification device connected to a commercial power supply, a series LED circuit, and a transistor (current limiter) which limits a maximum current flowing through the series LED circuit. The series circuit mounted on the device board is configured by connecting in series a plurality of LED elements. Each of the LED elements lights when an output voltage of the rectification device is applied to the series circuit. A number of LED elements included in the series circuit is set in a manner that a voltage applied to the series LED circuit is 70 to 90% of the output voltage of the rectification device. | 11-04-2010 |
| 20100301731 | LIGHT EMITTING MODULE AND ILLUMINATION DEVICE - According to one embodiment, a light-emitting module includes a module substrate, a reflective layer, conductive layers, a light-emitting element, and a sealing member. A reflective layer is provided on a surface of an insulating layer of the module substrate, and the conductive layers are provided in the vicinity of the reflective layer. Further, the light-emitting element is provided on the reflective layer. Moreover, the translucent sealing member has translucency and bury the reflective layer, the conductive layers, and the light-emitting element. The ratio of the area occupied by the reflective layer and the conductive layers to the sealed region sealed by the sealing member is equal to or greater than 80%. | 12-02-2010 |
| 20110074290 | SELF-BALLASTED LAMP AND LIGHTING EQUIPMENT - A self-ballasted lamp includes: a base body; a light-emitting module and a globe which are provided at one end side of the base body; a cap provided at the other end side of the base body; and a lighting circuit housed between the base body and the cap. The light-emitting module has light-emitting portions each using a semiconductor light-emitting element, and a support portion projected at one end side of the base body, and the light-emitting portions are disposed at least on a circumferential surface of the support portion. A light-transmissive member is interposed between the light-emitting module and an inner face of the globe. | 03-31-2011 |
| 20110089805 | LIGHT-EMITTING APPARATUS AND LUMINAIRE - According to one embodiment, a light-emitting apparatus includes an insulating base made of ceramics, an obverse metallic component dividedly arranged on the front surface of the insulating base, semiconductor light-emitting elements mounted on the obverse metallic component, and a reverse metallic component arranged on a back surface of the insulating base and having a thickness same as or smaller than a thickness of the obverse metallic component and a volume equal to 50% or larger of a volume of the obverse metallic component. | 04-21-2011 |