Patent application number | Description | Published |
20080280394 | SYSTEMS AND METHODS FOR POST-CIRCUITIZATION ASSEMBLY - A method of making integrated circuit packages using a conductive plate as a substrate includes forming a partial circuit pattern on one side of the conductive plate by stamping or selectively removing a portion of the conductive plate through part of its thickness, and then electrically coupling semiconductor dies to the formed patterns on the conductive plate. The method further includes encapsulating at least a portion of the dies and the conductive plate with an encapsulant and removing a portion of the conductive plate from the side opposite the patterned side to form conductive traces based on the formed pattern. | 11-13-2008 |
20080283992 | Multi layer low cost cavity substrate fabrication for pop packages - In a method and system for fabricating a semiconductor device ( | 11-20-2008 |
20090014898 | SOLDER CAP APPLICATION PROCESS ON COPPER BUMP USING SOLDER POWDER FILM - A method used during the formation of a semiconductor device assembly can include contacting an end of a conductive bump (which can be a pillar, ball, pad, post, stud, or lead as well as other types of bumps) with a conductive powder such as a solder powder to adhere the conductive powder to the end of the bump. The powder can be flowed, for example by heating, to distribute it across the end of the bump. The flowed powder can be placed in contact with a conductive pad of a receiving substrate and can then be reflowed to facilitate electrical connection between the bump and the conductive pad. | 01-15-2009 |
20090297879 | Structure and Method for Reliable Solder Joints - A solder joint ( | 12-03-2009 |
20100062567 | Multi Layer Low Cost Cavity Substrate Fabrication for POP Packages - In a method and system for fabricating a semiconductor device ( | 03-11-2010 |
20120211889 | METHOD FOR CONTACTING AGGLOMERATE TERMINALS OF SEMICONDUCTOR PACKAGES - A plastic package ( | 08-23-2012 |
20140038358 | METHOD FOR CONTACTING AGGLOMERATE TERMINALS OF SEMICONDUCTOR PACKAGES - In fabricating a semiconductor device first layers are formed of sintered bondable and solderable metal on a carrier strip. The first layers are patterned into first pads and second pads. A set of first pads is surrounding each second pad. The first pads are spaced from the second pad by gaps. The patterned layers are formed of agglomerate metal vertically on the first layers of sintered bondable and solderable metal of the first pads and of the second pad. The second layers are formed of sintered bondable and solderable metal vertically on the layers of agglomerate metal of the first pads | 02-06-2014 |
20140367838 | LEADFRAME WITH LEAD OF VARYING THICKNESS - A leadframe that includes a die attachment pad and a lead having a bondwire attach portion with a thickness less than 50% of the thickness of an adjacent portion of the lead. Also a method of forming a leadframe includes forming a lead having a bond wire attach portion with an original thickness and coining the bond wire attach portion to a thickness less than 50% of the original thickness. An integrated circuit package and a method of forming an integrated circuit package are also disclosed. | 12-18-2014 |