Patent application number | Description | Published |
20130093126 | MOLD MADE OF A COMPOSITE MATERIAL AND PROCESS EMPLOYING THIS MOLD - A mold for manufacturing products made of composite materials, which comprises at least one functional portion made of a composite material joined to at least one interface made of a composite material which projects at least partially around the functional portion, said mold being provided with one or more mechanic fastening devices for the coupling with at least another mold. | 04-18-2013 |
20130341971 | PROCESS FOR MANUFACTURING COMPOSITE MATERIAL PRODUCTS, AS WELL AS PRODUCTS MANUFACTURED WITH THIS PROCESS - Process for manufacturing composite material products is disclosed having at least the following operating steps:
| 12-26-2013 |
20140007377 | HINGE FOR COMPOSITE MATERIALS AND PROCESS FOR ITS MANUFACTURE - A hinge is disclosed having at least two groups of layers of fibers arranged on and/or under two opposite edges, respectively, of at least one substrate of a material flexible and compatible for the adhesion with resins for composite materials, so that a central portion of the substrate is not covered by these layers, the substrate and the layers being incorporated in a cured and flexible resin. The present invention also relates to a process for manufacturing said hinge. | 01-09-2014 |
20140083606 | PROCESS AND SYSTEM FOR MANUFACTURING COMPOSITE MATERIAL PRODUCTS, AS WELL AS PRODUCTS MANUFACTURED WITH THIS PROCESS OR SYSTEM - Disclosed is a process for manufacturing composite material products, having the following operating steps:
| 03-27-2014 |
20140378582 | PROCESS FOR MANUFACTURING ARTICLES IN CARBON FIBER AND ARTICLE MANUFACTURED WITH THIS PROCESS - The invention relates to a heat compression molding process for the manufacturing of composite material articles, the process comprising the steps of i) providing a mold ( | 12-25-2014 |
20150047151 | HINGE IN COMPOSITE MATERIAL AND PROCESS FOR ITS MANUFACTURE - Disclosed is a hinge having a rigid portion integral with a flexible portion suitable to be bent with respect to the rigid portion, wherein the rigid portion has a substrate in a rigid composite material and the flexible portion has a first flexible sheet, wherein a first portion of the first flexible sheet is joined at least partially to the substrate by means of at least one first layer of resin for composite materials, wherein the flexible portion also has a second flexible sheet joined at least partially by means of at least one second layer of resin for composite materials both to the first portion of the first flexible sheet and to at least one second portion of the first flexible sheet which is not joined to the substrate. | 02-19-2015 |
20150224678 | MOLD MADE OF A COMPOSITE MATERIAL AND PROCESS EMPLOYING THIS MOLD - A mold for manufacturing products made of composite materials, which comprises at least one functional portion made of a composite material joined to at least one interface made of a composite material which projects at least partially around the functional portion, said mold being provided with one or more mechanic fastening devices for the coupling with at least another mold. | 08-13-2015 |
20150231855 | CARBON FIBER FABRIC AND PROCESS FOR ITS MANUFACTURE - Woven carbon fiber, in which a polyurethane film or acrylic is joined to at least one side of this fabric. The present invention also relates to a process for the manufacture of such fabric, as well as a product of clothing or leather goods comprising this fabric. | 08-20-2015 |
Patent application number | Description | Published |
20100059822 | METHOD AND SYSTEM FOR MONOLITHIC INTEGRATION OF PHOTONICS AND ELECTRONICS IN CMOS PROCESSES - Methods and systems for monolithic integration of photonics and electronics in CMOS processes are disclosed and may include fabricating photonic and electronic devices on a single CMOS wafer with different silicon layer thicknesses. The devices may be fabricated on a semiconductor-on-insulator (SOI) wafer utilizing a bulk CMOS process and/or on a SOI wafer utilizing a SOI CMOS process. The different thicknesses may be fabricated utilizing a double SOI process and/or a selective area growth process. Cladding layers may be fabricated utilizing one or more oxygen implants and/or utilizing CMOS trench oxide on the CMOS wafer. Silicon may be deposited on the CMOS trench oxide utilizing epitaxial lateral overgrowth. Cladding layers may be fabricated utilizing selective backside etching. Reflective surfaces may be fabricated by depositing metal on the selectively etched regions. Silicon dioxide or silicon germanium integrated in the CMOS wafer may be utilized as an etch stop layer. | 03-11-2010 |
20110042553 | Method and System for Optoelectronic Receivers Utilizing Waveguide Heterojunction Phototransistors Integrated in a CMOS SOI Wafer - A method and system for optoelectronic receivers utilizing waveguide heterojunction phototransistors (HPTs) integrated in a CMOS SOI wafer are disclosed and may include receiving optical signals via optical fibers operably coupled to a top surface of the chip. Electrical signals may be generated utilizing HPTs that detect the optical signals. The electrical signals may be amplified via voltage amplifiers, or transimpedance amplifiers, the outputs of which may be utilized to bias the HPTs by a feedback network. The optical signals may be coupled into opposite ends of the HPTs. A collector of the HPTs may comprise a silicon layer and a germanium layer, a base may comprise a silicon germanium alloy with germanium composition ranging from 70% to 100%, and an emitter including crystalline or poly Si or SiGe. The optical signals may be demodulated by communicating a mixer signal to a base terminal of the HPTs. | 02-24-2011 |
20110305416 | METHOD AND SYSTEM FOR MULTI-MODE INTEGRATED RECEIVERS - A method and system for multi-mode integrated receivers are disclosed and may include receiving an optical signal from an optical fiber coupled to a chip comprising a photonic circuit. The photonic circuit may comprise an optical coupler, one or more multi-mode optical waveguides, and a detector. The received optical signal may be coupled to a plurality of optical modes in the one or more multi-mode optical waveguides, which are communicated to a detector to generate an electrical signal from the communicated modes. The optical coupler may comprise a grating coupler. The chip may comprise a CMOS chip, and the optical fiber may comprise a single-mode or a multi-mode fiber. The detector may comprise a germanium or silicon-germanium photodiode, and/or a waveguide detector. The optical fiber may be coupled to a top surface of the chip and the multi-mode optical waveguides may comprise rib waveguides. | 12-15-2011 |
20120132993 | Monolithic Integration Of Photonics And Electronics In CMOS Processes - Methods and systems for monolithic integration of photonics and electronics in CMOS processes are disclosed and may include fabricating photonic and electronic devices on two CMOS wafers with different silicon layer thicknesses for the photonic and electronic devices bonded to at least a portion of each of the wafers together, where a first of the CMOS wafers includes the photonic devices and a second of the CMOS wafers includes the electronic devices. The electrical devices may be coupled to optical devices utilizing through-silicon vias. The different thicknesses may be fabricated utilizing a selective area growth process. Cladding layers may be fabricated utilizing oxygen implants and/or utilizing CMOS trench oxide on the CMOS wafers. Silicon may be deposited on the CMOS trench oxide utilizing epitaxial lateral overgrowth. Cladding layers may be fabricated utilizing selective backside etching. Reflective surfaces may be fabricated by depositing metal on the selectively etched regions. | 05-31-2012 |
20120135566 | Monolithic Integration Of Photonics And Electronics In CMOS Processes - Methods and systems for monolithic integration of photonics and electronics in CMOS processes are disclosed and may include fabricating photonic and electronic devices on two CMOS wafers with different silicon layer thicknesses for the photonic and electronic devices with at least a portion of each of the wafers bonded together, where a first of the CMOS wafers includes the photonic devices and a second of the CMOS wafers includes the electronic devices. The electrical devices may be coupled to optical devices utilizing through-silicon vias. The different thicknesses may be fabricated utilizing a selective area growth process. Cladding layers may be fabricated utilizing oxygen implants and/or utilizing CMOS trench oxide on the CMOS wafers. Silicon may be deposited on the CMOS trench oxide utilizing epitaxial lateral overgrowth. Cladding layers may be fabricated utilizing selective backside etching. Reflective surfaces may be fabricated by depositing metal on the selectively etched regions. | 05-31-2012 |
20120301149 | Method And System For Hybrid Integration Of Optical Communication Systems - Methods and systems for hybrid integration of optical communication systems are disclosed and may include receiving continuous wave (CW) optical signals in a silicon photonics die (SPD) from an optical source external to the SPD. The received CW optical signals may be processed based on electrical signals received from an electronics die bonded to the SPD via metal interconnects. Modulated optical signals may be received in the SPD from optical fibers coupled to the SPD. Electrical signals may be generated in the SPD based on the received modulated optical signals and communicated to the electronics die via the metal interconnects. The CW optical signals may be received from an optical source assembly coupled to the SPD and/or from one or more optical fibers coupled to the SPD. The received CW optical signals may be processed utilizing one or more optical modulators, which may comprise Mach-Zehnder interferometer modulators. | 11-29-2012 |
20140084144 | METHOD AND SYSTEM FOR OPTOELECTRONIC RECEIVERS UTILIZING WAVEGUIDE HETEROJUNCTION PHOTOTRANSISTORS INTEGRATED IN A CMOS SOI WAFER - A method and system for optoelectronic receivers utilizing waveguide heterojunction phototransistors (HPTs) integrated in a CMOS SOI wafer are disclosed and may include receiving optical signals via a top surface of a photonically-enabled CMOS chip; and generating electrical signals in the chip utilizing one or more HPTs that detect optical signals. The HPTs may comprise a base and a split collector, with the split collector comprising a silicon-on-insulator (SOI) layer and a germanium layer. The thickness of the germanium layer may be such that carriers in the base do not interact with defects from an interface between the SOI layer and the germanium layer. The electrical signals may be amplified by amplifiers, the outputs of which may be utilized to bias the HPTs by a feedback network. An electrode formed longitudinally in the direction of light travel through the HPTs may bias the base of the HPTs. | 03-27-2014 |
20140286647 | Method And System For A Low-Voltage Integrated Silicon High-Speed Modulator - Methods and systems for a low-voltage integrated silicon high-speed modulator may include an optical modulator comprising first and second optical waveguides and two optical phase shifters, where each of the two optical phase shifters may comprise a p-n junction with a horizontal section and a vertical section and an optical signal is communicated to the first optical waveguide. A portion of the optical signal may then be coupled to the second optical waveguide. A phase of at least one optical signal in the waveguides may be modulated utilizing the optical phase shifters. A portion of the phase modulated optical signals may be coupled between the two waveguides, thereby generating two output signals from the modulator. A modulating signal may be applied to the phase shifters which may include a reverse bias. | 09-25-2014 |
20150270898 | Method And System For Monolithic Integration of Photonics And Electronics In CMOS Processes - Methods and systems for monolithic integration of photonics and electronics in CMOS processes are disclosed and may include in an optoelectronic transceiver comprising photonic and electronic devices from two complementary metal-oxide semiconductor (CMOS) die with different silicon layer thicknesses for the photonic and electronic devices, the CMOS die bonded together by metal contacts: communicating optical signals and electronic signals to and from said optoelectronic transceiver utilizing a received continuous wave optical signal as a source signal. A first of the CMOS die includes the photonic devices and a second includes the electronic devices. Electrical signals may be communicated between electrical devices to the optical devices utilizing through-silicon vias coupled to the metal contacts. The metal contacts may include back-end metals from a CMOS process. The electronic and photonic devices may be fabricated on SOI wafers, with the SOI wafers being diced to form the CMOS die. | 09-24-2015 |
Patent application number | Description | Published |
20120263096 | METHODS AND NODES FOR PROBING TYPES OF INTERFACES - Embodiments herein relate to a method in a relay node ( | 10-18-2012 |
20130109380 | METHODS OF SELECTING TARGET CELLS USING NEIGHBOR CELL INFORMATION AND RELATED NETWORK CONTROLLERS | 05-02-2013 |
20140126562 | BASE-STATION-TO-BASE-STATION GATEWAY AND RELATED DEVICES, METHODS, AND SYSTEMS - The present disclosure relates to a base-station-to-base-station (BS-BS) gateway in a Long Term Evolution (LTE) cellular communication network and methods of operation thereof. In one embodiment, the BS-BS gateway receives information from a first base station which includes a hostname and a network address of the first base station. The BS-BS gateway then stores a mapping between the hostname and the network address. Thereafter, in one embodiment, the BS-BS gateway enables a second base station to address messages to the first base station using the hostname of the first base station. In this manner, changes in the network address of the first base station will not affect the ability of the second base station to address messages to the first base station. In some embodiments, the first base station is a low-power base station (LP-BS) and the second base station is a high-power base station (HP-BS). | 05-08-2014 |
20140128086 | METHODS FOR BASE-STATION-TO-BASE-STATION CONNECTION MANAGEMENT - The present disclosure relates to a base station in a cellular communication network and methods of operation thereof. In one embodiment, a base station determines that the base station is transitioning to an unavailable state. The base station then notifies one or more radio network nodes with which the base station conducts base-station-to-node communication that the base station is unavailable. Thereafter, in one embodiment, the one or more radio network nodes cease communication attempts with the base station. In this manner, the radio network nodes can avoid spending additional resources on attempts to re-establish communication connections to base stations that tend to be offline more often (e.g., low-power base stations (LP-BSs)). | 05-08-2014 |
20140187244 | Relay Node, a Donor Radio Base Station and Methods Therein - Embodiments herein relate to a method in a relay node for acquiring information about a type of a radio network connection between a donor radio base station and a radio base station. The relay node and the donor radio base station are comprised in a radio communications network and the donor radio base station is serving the relay node. The relay node receives a message from the donor radio base station, which message is indicating a type of radio network application protocol, which type is related to a type of the radio network connection between the donor radio base station and the radio base station. The relay node determines the type of the radio network connection based on the type of radio network application protocol indicated in the message. The relay node also stores the type of radio network connection in relation to the radio base station for selecting the type of radio network connection when later communicating with the radio base station. | 07-03-2014 |
20150016306 | Autonomous Transport Layer Connection Setup by a Transport Layer Concentrator - The present disclosure concerns wireless communication. More particularly, a method and an apparatus (e.g. a SCTP concentrator) for setting up transport layer connections (e.g. SCTP associations) between a eNB and a (H)eNB are disclosed. | 01-15-2015 |
20150181481 | Method and Arrangement for Mobility Procedures - Cooperating nodes, and methods therein, for mobility procedures in a wireless communication system supporting UE groups. One of the cooperating nodes is a base station being associated with a UE group comprising UEs having correlated mobility related parameters. The method in the base station comprises receiving, from a first UE in the UE group, a mobility related parameter associated with the first UE. The method further comprises determining whether to initiate a mobility related procedure for a second UE in the UE group based on the received mobility related parameter; and further comprises initiating the mobility related procedure for the second UE when it is determined that the mobility related procedure is to be performed. Thereby, prediction and decisions related to mobility events, e.g. handover events, for the second UE or for the whole group may be performed e.g. before or without receiving any mobility information related to the second UE, thereby enabling early prediction and better preparation, which can lead to more robust mobility procedures. | 06-25-2015 |
Patent application number | Description | Published |
20090325295 | IN-VITRO MECHANICAL LOADING OF MUSCULOSKELETAL TISSUES - Musculoskeletal tissues produced in vitro are optimized in response to an externally applied mechanical load. The load applied may vary from tissue to tissue, depending upon the response desired, and may include intermittent axial, torsional, and bending loads to produce cortical structures. Compression alone is preferably applied to produce cancellous bone. A method according to the invention for culturing bone in vitro comprises: providing a culture vessel providing a scaffold material, supporting the scaffold material within the tissue culture vessel so as to be exposed to a tissue culture medium, and exerting a force on the scaffold material during growth of a bone construct (a cultured bone growth) around the scaffold material. Applicable apparatus preferably includes a culture vessel, holders for holding a scaffold within the tissue culture vessel, means for introducing a tissue culture medium to the tissue culture vessel, and an actuator adapted to apply a force to developing bone during the in vitro culture of the tissue, whether bone, cartilage, ligament, or composites thereof. | 12-31-2009 |
20100016977 | PCL RETAINING ACL SUBSTITUTING TKA APPARATUS AND METHOD - A new class of total knee replacement includes a posterior cruciate ligament retaining anterior cruciate ligament substituting apparatus and method. Particular design considerations include: 1) a specific extension surface separate from the flexion surface, 2) rotational control in full extension to create the so-called screw-home mechanism, 3) translation restraints that will substitute for ACL function including a CAM-post or other abutment mechanism while allowing normal PCL function which should improve natural proprioception, 4) a modified femoral component with separate radii of curvature for the flexion and extension arcs of at least one condyle, and 5) a tibial component with slope built into the posterior aspect of its bone contacting surface on both sides of the PCL. | 01-21-2010 |
20110112650 | MODIFIED MODULAR JOINT PROSTHESIS COMPONENT - A modified joint prosthesis component is provided to reduce the backside wear of the joint implant. Whether the joint implant is for the knee joint, the hip joint or another joint, it is the modified bearing insert engaging surface of the metal base construct that provides for greater friction and therefore less micro-motion and resultant minimized backside wear. | 05-12-2011 |
20110137222 | HEALING WOUND BANDAGING KIT AND METHOD - A wound healing bandaging kit includes a plurality of bandages, each with a flexible layer having a patient-contacting-surface and an outer surface. The outer surface on one of the bandages in the kit includes visual indicia portraying a neutral or negative message, and the outer surface on one of the bandages in the kit includes visual indicia portraying of a positive message. In the preferred embodiment, the visual indicia of a neutral or negative message includes the graphical image of a person's face with a neutral expression or a frown, and the visual indicia of a positive message includes the graphical image of a person's face with a smile. A method of treating a wound includes the steps of providing a wound healing bandaging kit with a plurality of bandages, one of which portrays a neutral or negative message, and another of which portrays a positive message. The bandage with the visual indicia portraying of a neutral or negative message is applied initially after a cut, bruise, surgical incision or trauma; the bandage with the visual indicia portraying a positive message is then applied after the cut, bruise, surgical incision or trauma has had an opportunity to heal. | 06-09-2011 |
20140249640 | MULTIPLE-CAM, POSTERIOR-STABILIZED KNEE PROSTHESIS - A distal femoral knee-replacement component provides additional points of cam action by either distinct bars or interconnected structural elements such as cam extensions to prevent early translation of the knee or dislocation of the femoral component over the tibial post which can occur in cruciate-substituting designs. | 09-04-2014 |