Patent application number | Description | Published |
20080202692 | ADHESIVE TAPE JOINING APPARATUS - An apparatus of this invention includes: a workpiece holding mechanism that holds a ring frame and a wafer; a tape supplying device that supplies a continuous dicing tape or a continuous carrier tape to which a precut dicing tape is joined, to a joining position; a joining unit that joins the continuous dicing tape or the precut dicing tape separated from the carrier tape, to the ring frame and the semiconductor wafer; a tape cutting mechanism that cuts the dicing tape joined to the ring frame along a contour of the ring frame; and a residual tape collecting section that takes up and collects a residual tape after the cutting. | 08-28-2008 |
20080230183 | RELEASING METHOD AND RELEASING APPARATUS OF WORK HAVING ADHESIVE TAPE - In a method for releasing a work having an adhesive tape from a holding member which sucks and holds the work having the adhesive tape, the work having the adhesive tape is released from the holding member while supplying a gas which reduces a holding force of the holding member between the holding member and the work having the adhesive tape. | 09-25-2008 |
20080293221 | METHOD FOR HOLDING SEMICONDUCTOR WAFER - Provided is a method comprising:
| 11-27-2008 |
20090009755 | METHOD FOR DETECTING POSITION OF DEFECT ON SEMICONDUCTOR WAFER - A method of this invention involves: detecting a shape of an outer periphery of a semiconductor wafer with a first detecting device; determining a center position of the semiconductor wafer based on a detected result by the first detecting device; receiving a light beam reflected from a surface of the semiconductor wafer with a second detecting device; detecting an alignment part based on a detected result by the second detecting device to determine a position of the alignment part; and detecting a defect based on the detected result by the second detecting device to determine a position of the defect. | 01-08-2009 |
20090011525 | METHOD FOR JOINING ADHESIVE TAPE TO SEMICONDUCTOR WAFER AND METHOD FOR SEPARATING PROTECTIVE TAPE FROM SEMICONDUCTOR WAFER - An arithmetic processing part in a controller detects a position of a defect such as a chip or a crack that occurs at an outer periphery of a semiconductor wafer, and then a memory in the controller stores position information of the defect. The controller reads the position information of the defect through a network in each process. On the basis of this position information, the controller determines a direction of joining a dicing tape to the semiconductor wafer or a direction of separating a protective tape from a front face of the semiconductor wafer. | 01-08-2009 |
20090065144 | PROTECTIVE TAPE SEPARATION METHOD AND PROTECTIVE TAPE SEPARATION APPARATUS - A surface height of a protective tape joined to a wafer mounted and held on a separation table is detected, an operation amount of approaching a joining member to the protective tape until a separation tape wound around the joining member contacts the protective tape based on detected information, the joining member is operation controlled to approach the protective tape based on the calculated operation amount, the joining member and the separation table are relatively moved along a direction of a surface of the protective tape in a state of maintaining the height of the joining member to join the separation tape to the protective tape, and the separation tape is separated from the surface of the wafer integrally with the protective tape. | 03-12-2009 |
20090090451 | PROTECTIVE TAPE SEPARATION METHOD AND APPARATUS USING THE SAME - A surface height of a protective tape joined to a wafer mounted and held on a separation table is detected, a lowering operation distance of a needle is calculated based on such detected information, and a lowering operation amount for approaching a joining member to the protective tape until the separation tape winded around the joining member contacts the protective tape is calculated. A separating site is formed in the protective tape and the protective tape is separated while controlling a height of each member based on the calculated lowering operation amount. | 04-09-2009 |
20090095418 | ULTRAVIOLET IRRADIATION METHOD AND APPARATUS USING THE SAME - The ultraviolet ray is applied on the surface of the protective tape from an ultraviolet ray generator. In addition, the ultraviolet ray having intensity higher than that from the ultraviolet ray generator is applied on spot on the wafer edge by an irradiation gun. In this case, the ultraviolet ray intensity and the rotation speed of the holding table are controlled by a controller so that the ultraviolet irradiation amount per unit area of the wafer edge portion becomes equal to that to the joining surface of the protective tape. | 04-16-2009 |
20090133549 | PROTECTIVE TAPE CUTTING METHOD FOR SEMICONDUCTOR WAFER AND DEVICE OF THE SAME - A cutter blade is relatively moved along an outer periphery of a semiconductor wafer, and dust generated at a tape cutting site by the cutter blade and attached to an upper surface of the protective tape is collected with a dust collecting member which relatively moves with the cutter blade with respect to the semiconductor wafer, and the dust collected at a predetermined portion is suctioned and removed with a suction nozzle after the completion of tape cutting. | 05-28-2009 |
20090133551 | METHOD FOR CUTTING PROTECTIVE TAPE OF SEMICONDUCTOR WAFER AND PROTECTIVE TAPE CUTTING DEVICE - A cutter blade is cut-in by being moved towards a deep part of a notch from one open end of the notch while being moved in a forward direction with respect to an outer periphery of a wafer. Immediately before a blade edge reaches the deep part of the notch, cutting movement of the cutter blade is once stopped, reversely moved to a initial piercing position, and thereafter, the cutter blade is moved towards the deep part of the notch from the other open end of the notch while being moved in a reverse direction with respect to the outer periphery of the wafer. | 05-28-2009 |
20090133815 | LABEL JOINING METHOD AND LABEL JOINING APPARATUS - A receiver base receives from below a front end portion of a label that is fed forward from a folded-back portion of an release paper and droops forward, so that the label is held in a predetermined forwardly and downwardly inclined posture. In a process of separating and feeding the label in such a statewhere part of a rear end of the label is joined and held onto the release paper, a suction head having a downward suction surface that is inclined forward and downward is brought closer to a top surface of the label being separated so as to suck the label. | 05-28-2009 |
20090205679 | CUTTER BLADE CLEANING METHOD AND CUTTER BLADE CLEANING DEVICE, AS WELL AS ADHESIVE TAPE JOINING APPARATUS INCLUDING THE SAME - A cutter blade cuts an adhesive tape and then returns to its standby position. Thereafter, a cleaning unit moves to a position below the cutter blade, and the cutter blade moves downward to a predetermined height. Herein, a cleaning member impregnated with a wash liquid is pierced with the cutter blade in order to clean an adherent on the cutter blade. Each time the cutter blade cleaning process is executed, the pierced position of the cleaning member with the cutter blade is changed. | 08-20-2009 |
20090211710 | ADHESIVE TAPE JOINING APPARATUS - An adhesive tape joining apparatus of this invention adopts an inverted âTâ-shaped layout configured with a rectangular section that extends laterally when being viewed in a plane and a protrusion section that is coupled on a center of the rectangular section. An adhesive tape joining part is disposed in the protrusion section and joins an adhesive tape to a ring frame and a wafer. A transport mechanism is disposed in the rectangular section and transports the wafer, the ring frame, and the wafer held by the ring frame. An electronic substrate processing unit is disposed in at least one of two regions adjoining to the rectangular section with the protrusion section being interposed therebetween, and is coupled to the transport mechanism. | 08-27-2009 |
20090218046 | ADHESIVE FILM POSITION DETECTOR AND ADHESIVE FILM JOINING APPARATUS - An illuminator emits light obliquely to an end of an adhesive film. A CCD camera is provided in a direction perpendicular to the adhesive film to capture an image of the light reflected irregularly from the end of the adhesive film. A black plate is provided on a back side of the adhesive film. In the image obtained by the CCD camera, therefore, only the end of the adhesive film is displayed whitely in a line shape. A position of the adhesive film is determined based on a line corresponding to the end of the adhesive film. Since the light reflected from the end of the adhesive film is utilized, the position of the adhesive film can be determined accurately irrespective of a color of the adhesive film, a color of a base film to which the adhesive film is joined, and a depth of each color. | 09-03-2009 |
20090272496 | PROTECTIVE TAPE JOINING APPARATUS - A chuck table is configured with a table main body having a wafer placement part holding a wafer placed thereon, and an annular tape support frame provided outside the wafer placement part with a cutter blade traveling groove being interposed therebetween. The tape support frame has, at a top face thereof, a plurality of linear grooves arranged in parallel in a tape joining direction, a large number of linear tape support parts each located between the linear grooves, and an annular tape support part supporting the protective tape at an outer side of the cutter blade traveling groove. | 11-05-2009 |
20100038009 | METHOD AND APPARATUS FOR JOINING PROTECTIVE TAPE TO SEMICONDUCTOR WAFER - A protective tape is supplied above the surface of a semiconductor wafer, and joined to the surface of the semiconductor wafer by rolling a joining roller while pressing the joining roller against the protective tape. Then the joined protective tape is cut out along the outer periphery of the semiconductor wafer. Subsequently, the protective tape is pressed with the pressure member to flatten the surface of the protective tape. | 02-18-2010 |
20100078114 | METHOD AND APPARATUS FOR JOINING ADHESIVE TAPE - An adhesive tape is supplied to a back face side of a ring frame, joined to the ring frame with a joining roller, and cut by pivoting a cutter blade along the ring frame. Subsequently, an inspection ring of an inspecting mechanism perform suction on the adhesive tape while contacting the adhesive tape adjacent an inner periphery of the ring frame. Separation of the adhesive tape from the ring frame is determined based on variations of the suction pressure. When the separation of the adhesive tape from the ring frame is detected, the adhesive tape is joined again with the joining roller provided in the cutter mechanism. | 04-01-2010 |
20100147442 | METHOD AND APPARATUS FOR SEPARATING PROTECTIVE TAPE FROM SEMICONDUCTOR WAFER - A method of this invention involves capturing an image of an outer periphery of a semiconductor wafer, by use of a CCD camera, performing image analysis on data about the captured image, detecting defects such as chips and cracks on the outer periphery of the semiconductor wafer, storing positions of the respective defects, calculating a clearance between the adjacent defects from information about the stored positions, comparing the calculated clearances with a preset width of a separation tape, and obtaining the clearance larger than the width of the separation tape, by arithmetic processing. If some of the clearances are larger than the width of the separation tape, this method also involves setting an appropriate one of the clearance as a position where the separation tape is joined, performing alignment on the semiconductor wafer, joining the separation tape to a protective tape joined to a surface of the semiconductor wafer, and separating the protective tape together with the separation tape from the surface of the semiconductor wafer. | 06-17-2010 |
20100171823 | ALIGNMENT APPARATUS FOR SEMICONDUCTOR WAFER - A wafer has an annular ridge formed along an outer periphery thereof to serve as a reinforcing portion, and a circuit pattern surrounded with the reinforcing portion. The wafer is placed on a wafer placement plane of a holding stage in a state that the circuit pattern is directed downward. The wafer placement plane is larger in size than the wafer. On the holding stage, a center of the wafer is aligned with a center of the holding stage in such a manner that a plurality of guide pins are engaged with relevant cutout portions formed on the reinforcing portion. Then, the holding stage rotates while suction-holding the reinforcing portion of the wafer, and simultaneously a photosensor detects a portion for alignment formed on the outer periphery of the wafer. | 07-08-2010 |
20100171966 | ALIGNMENT APPARATUS FOR SEMICONDUCTOR WAFER - An alignment apparatus of this invention includes a holding stage that is larger in size than a semiconductor wafer, and an optical sensor that optically detects a position of a peripheral edge of the semiconductor wafer placed on and suction-held by the holding stage. The holding stage has a slits formed thereon vertically in a circumferential direction, and an outer periphery of the semiconductor wafer lies on the slits. The optical sensor is of a transparent type and includes a projector and a photodetector opposed vertically to each other with the slit interposed therebetween. The optical sensor measures the peripheral edge of the semiconductor wafer on the slits of the holding stage. | 07-08-2010 |
20100243125 | PROTECTIVE TAPE SEPARATING METHOD AND PROTECTIVE TAPE SEPARATING APPARATUS USING THE SAME - As a drive block moves that is connected to a movable table of a tape separation device, a pressure occurs from pressing the movable table disposed forward with the drive block. A pressure sensor detects the pressure as a separation load of a protective tape. A control device drives a motor in accordance with the separation load to control a moving speed of the tape separation device. | 09-30-2010 |
20100294416 | PROTECTIVE TAPE JOINING METHOD AND PROTECTIVE TAPE JOINING APPARATUS - A tape level detecting device detects a level of a protective tape supplied above a holding table in a given position on a side where joining of the protective tape starts to control the level of the protective tape in the given position on the side where the joining starts in accordance with detected results on the level of the protective tape such that the detected level of the protective tape may fall within a reference range set in advance. | 11-25-2010 |
20100300612 | WAFER MOUNTING METHOD AND WAFER MOUNTING APPARATUS - A reinforcing support substrate is joined to a surface of the semiconductor wafer via a double-faced adhesive tape, and then is removed from the semiconductor wafer. Subsequently, the semiconductor wafer with the support substrate removed therefrom is adhesively held on a rear face of a ring frame via a support adhesive tape, and the double-faced adhesive tape is separated from the surface of the semiconductor wafer integrate with the ring frame. | 12-02-2010 |
20100301233 | ULTRAVIOLET IRRADIATION DEVICE - Prior to applying of ultraviolet rays to a surface of a wafer with a protective tape joined thereto that is placed and held on a holding table, an illumination sensor moves to a position below an ultraviolet irradiation unit having ultraviolet light emitting diodes arranged in one dimensional array to measure ultraviolet intensity in a position corresponding to a surface of the protective tape, and output voltage of each diode is controlled so as to maintain a uniform accumulated quantity of light in an area of the protective tape where ultraviolet rays are applied that is determined from the result of measurement and a turning velocity of the holding table. | 12-02-2010 |
20110017391 | ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS - A wafer holding table that suction-holds a wafer of a mount frame moves downward below a frame holding table when a joining roller passes over an exposed portion of an adhesive tape between the wafer W and the ring frame f. Here, the exposed portion of the adhesive tape inclines obliquely downward, thereby joining the adhesive tape to the mount frame. | 01-27-2011 |
20110045234 | METHOD AND CONFIGURATION FOR REINFORCING PLATE MATERIAL - A joining roller rolls while pressing on a separator on a surface of a double-faced adhesive tape with through holes in rectangular shapes regularly formed therein in a longitudinal tape direction, and the double-faced adhesive tape is joined to a building panel. Thereafter, the separator is separated and the reinforcing member is joined to an adhesive layer of the double-faced adhesive tape while being pressed with the reinforcing member being kept parallel to the double-faced adhesive tape. | 02-24-2011 |
20110048609 | ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS - A joint detector detects a joint in an adhesive tape supplied from a tape supply section, and a computing unit determines a suitable cutting position of the adhesive tape for removing the joint in accordance with the detected results. A controller controls each mechanism to operate so as to satisfy the determined results by the computing unit. Thereafter, the adhesive tape including the joint is cut and removed. | 03-03-2011 |
20110048630 | PROTECTIVE TAPE SEPARATING METHOD AND APPARATUS - A chuck table adhesively holds a rear face of a mount frame subject to a dicing process with a protective tape joined thereto, and a suction plate having a heater embedded therein contacts and heats the protective tape. Consequently, an adhesion layer of the protective tape reduces its adhesive force due to foaming and expansion. Thereafter, the suction plate moves upward while keeping its suction force to separate the protective tape from all of chips. | 03-03-2011 |
20110056615 | ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS - A nipper formed of a pair of nip blocks in an open state suction-holds on nip surfaces thereof a front end of the adhesive tape that is folded back with an edge member and separated from a separator. Then, the nip block on a front end side pivots to unite the nip surfaces of the nip blocks to each other. As a result, the adhesive tape is bent inwardly and adhesive layers thereof are adhered to each other to form a tab. The nip block on a rear end side suction-holds a rear end of the cut adhesive tape. Then, the nip block on the rear end side pivots to bend the adhesive tape inwardly for forming a tab. | 03-10-2011 |
20110073241 | METHOD AND APPARATUS FOR SEPARATING PROTECTIVE TAPE - A tape separation mechanism suction-holds a chip into which a substrate is diced that is adhesively held on a mount frame via a protective tape, and moves to place the chip in a mounting position of the substrate on a substrate holding stage. A heater heats via a head the protective tape joined to a surface of the chip at the mounting position that loses its adhesive force due to foam and expansion through heating. Thereafter, the tape separation mechanism moves upward while suction-holding the protective tape, thereby separating and removing the protective tape from the chip. | 03-31-2011 |
20110079357 | ADHESIVE TAPE JOINING APPARATUS - A collection bobbin is provided on a vertical line that travels a center of a supply bobbin. A pair of connection mechanisms is provided at front both sides of a tape housing chamber. An adhesive tape transport carriage with connection portions at a forward end of a carriage frame is connected to the connection mechanisms in the apparatus body. Loading of a master roll of an adhesive tape to the supply bobbin and unloading of a roll of a residual cut tape may be performed at the same position. | 04-07-2011 |
20110117706 | PROTECTIVE TAPE JOINING METHOD AND PROTECTIVE TAPE JOINING APPARATUS - A cooling plate having a cooling pipe mounted therein in a serpentine shape is placed in a stack manner on a rear face of a chuck table for suction-holding a rear face of the semiconductor wafer. A coolant is circulated through the cooling pipe, thereby cooling the chuck table. The semiconductor wafer is suction-held while the chuck table is cooled. In addition, the protective tape is joined to the semiconductor wafer while the chuck table is cooled. That is, the protective tape is joined to the surface of the semiconductor wafer while being cooled indirectly via the semiconductor wafer cooled in advance through direct contact to the chuck table during joining of the protective tape. | 05-19-2011 |
20110120641 | ADHESIVE TAPE JOINING APPARATUS AND ADHESIVE TAPE JOINING METHOD - Upper and lower housings nip a supporting adhesive tape that is exposed between an outer periphery of a wafer and a ring frame, thereby forming a chamber. Here, the adhesive tape having a larger width than a diameter of the ring frame divides the chamber into the upper and lower housings to form two spaces. Pressure difference occurs between both spaces such that the lower housing has a reduced pressure than the upper housing for joining the adhesive tape to the wafer. | 05-26-2011 |
20110139333 | ADHESIVE TAPE JOINING METHOD AND APPARATUS USING THE SAME - A tape cutting mechanism cuts an adhesive tape joined to a semiconductor wafer along a contour of the wafer. A rotary encoder detects a rotating angle of each side roller for guiding a narrow region on both ends of an adhesive tape during winding up and collecting a cutout unnecessary tape. A determination section determines a fracture in the narrow region of the unnecessary tape through comparison between an actual rotating angle as a result of the detection and a preset reference rotating angle. | 06-16-2011 |
20110139375 | METHOD AND APPARATUS FOR SEPARATING ADHESIVE TAPE - An adhesive tape joined to a wafer is irradiated with ultraviolet rays via diodes. Simultaneously, a heater heats the adhesive tape to a preset temperature. Consequently, an ultraviolet reaction with the diodes and an infrared reaction with the heater may ensure promotion of a polymerization reaction, which results in cure of an adhesive that is not curable with only ultraviolet rays. As a result, an adhesive force of the adhesion tape may sufficiently be reduced. After ultraviolet irradiation via the diodes and heating with the heater, a separation mechanism separates the adhesive tape from the wafer. Therefore, accurate separation may be realized of the adhesive tape joined to the wafer. | 06-16-2011 |
20110232820 | ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS - A frame transport unit places a ring frame on a frame holding section of a holding table, and a holding arm suspendingly holds a protection sheet to place it on a wafer holding table. The holding arm suction-holds a wafer to place it on the protection sheet such that a circuit surface of the wafer is directed downward. An adhesive tape is joined to the wafer and the ring frame suction-held via the protection sheet. | 09-29-2011 |
20110232841 | SEMICONDUCTOR WAFER MOUNTING METHOD AND SEMICONDUCTOR WAFER MOUNTING APPARATUS - An elastic body approximately throughout a holding region of a semiconductor wafer is provided in a recess at a center of a holding table that holds the semiconductor wafer. An adhesive tape is joined over a rear face of the semiconductor wafer and a ring frame by rolling a joining roller while the elastic body receives and supports a surface of the semiconductor wafer as a circuit surface. | 09-29-2011 |
20110236171 | WORKPIECE TRANSPORT METHOD AND WORKPIECE TRANSPORT DEVICE - Two or more pads having through holes formed therein concentrically at given pitches are provided on a U-shaped holding arm. Compressed air is sprayed from the pad to a protection sheet to generate negative pressure between a holding surface of the holding arm and the protection sheet for suspendingly holding a wafer with the protection sheet floating, or the pad suction-holds and transports a rear face of the wafer having an exposed circuit surface. | 09-29-2011 |
20110275179 | PROTECTIVE TAPE JOINING METHOD AND PROTECTIVE TAPE USED THEREFOR - Provided is an improved method of joining a protective tape having one object to suppress generation of bending of a semiconductor wafer after a back-grinding process. The protective tape is supplied toward the semiconductor wafer suction-held on a chuck table, and an intermediate sheet is supplied along an upper side of the protective tape. Then, the intermediate sheet is interposed between a joining member and the protective tape along a surface of a base material in the protective tape so as to be movable. Under this state, the joining member and the semiconductor wafer move relative to each other in a horizontal direction, whereby the protective tape is joined to a surface of the semiconductor wafer. | 11-10-2011 |
20120082516 | WORKPIECE TRANSPORT METHOD AND WORKPIECE TRANSPORT APPARATUS - A wafer floats and is transported while gas is blown from holes passing vertically through a middle portion of a transport path against a rear face of the wafer to be transported, and from holes on opposite sides of the transport path that are inclined obliquely relative to a traveling direction of the wafer toward a center axis of the transport path against the rear face of the wafer. In the step of transporting the wafer, a flow rate of gas is adjusted that is blown from the holes on a side where the wafer deviates from a transport course. | 04-05-2012 |
20120085478 | DOUBLE-FACED ADHESIVE TAPE JOINING METHOD AND DOUBLE-FACED ADHESIVE TAPE JOINING APPARATUS - A piece of a double-faced adhesive tape cut into a substrate shape is separated from a carrier tape with an edge knife. The separated piece of the double-faced adhesive tape is joined to a substrate relatively moving at a speed synchronized to a separation speed. It is monitored whether or not the piece of the double-faced adhesive tape is in good joining condition to the substrate to which a joining process has been performed. When poor joining is detected, the piece of the double-faced adhesive tape is separated and removed from the substrate in poor joining condition, and a piece of the double-faced adhesive tape is again joined to the substrate from which the piece of the double-faced adhesive tape is already separated and removed. | 04-12-2012 |
20120085488 | DOUBLE-FACED ADHESIVE TAPE JOINING METHOD AND DOUBLE-FACED ADHESIVE TAPE JOINING APPARATUS - An original master tape having a long carrier tape and a long double-faced adhesive tape joined thereto is guided to a knife edge to be folded back. The double-faced adhesive tape is half-cut on the carrier tape in front of the knife edge with a Thomson blade having a corresponding shape to a substrate. The original master tape is folded back at the knife edge. Accordingly, a piece of the double-faced adhesive tape cut into the substrate shape is separated from the carrier tape to be joined to the substrate traveling relatively at a speed synchronized to a separation speed. | 04-12-2012 |
20120090763 | METHOD AND APPARATUS FOR SEPARATING PROTECTIVE TAPE - A first holding table suction-holds an annular projection of a wafer remaining on a rear face thereof for surrounding a back grinding region. A second holding table having an outer peripheral wall adjacent to an inner wall of the annular projection is inserted into a flat portion inside the annular projection for joining a separating adhesive tape to a protective tape on a surface of the wafer while a flat plane of the flat portion is suction-held. Thereafter, the adhesive tape is separated. Accordingly, the adhesive tape is separated from the surface of the wafer together with the protective tape. | 04-19-2012 |
20120097338 | WORK BONDING AND SUPPORTING METHOD AND WORK BONDING AND SUPPORTING APPARATUS USING THE SAME - Tape heating means is allowed to come close to an adhesive tape for support and, in a heating state, the adhesive tape for support is stretched and tensioned with proper tension in a tape width direction and a transport direction. A heated work is bonded to an adhesive face of the tensioned adhesive tape for support, thereby supporting the work. | 04-26-2012 |
20120132412 | SEMICONDUCTOR WAFER TRANSPORT METHOD AND SEMICONDUCTOR WAFER TRANSPORT APPARATUS - A semiconductor wafer joined to a carrier via a double-faced adhesive tape having an adhesive layer of a heating separation property is heated for removal from the carrier. The double-faced adhesive tape is separated from the semiconductor wafer on a holding table. Thereafter, an air nozzle preliminarily cools the semiconductor wafer for a given time during transportation with a wafer transport section. Upon completion of the preliminary cooling, the semiconductor wafer is placed on a cooling stage to cool it to a target temperature. | 05-31-2012 |
20120160397 | MOUNTED WAFER MANUFACTURING METHOD - A liquid adhesive is applied to a circuit surface of a semiconductor wafer. A carrier is joined to a surface of the semiconductor wafer coated with the adhesive. A rear face of the semiconductor wafer is ground while the carrier is held. The semiconductor wafer is supported on a ring frame via a support adhesive tape. The carrier is removed from the semiconductor wafer. The adhesive tape is separated integrally with the film-like adhesive from the semiconductor wafer through joining a separation tape having a width larger than a diameter of the semiconductor wafer to the adhesive on the semiconductor wafer and then separating the separation tape. | 06-28-2012 |
20120247657 | SUBSTRATE TRANSFER METHOD AND SUBSTRATE TRANSFER APPARATUS - A ring frame and a substrate are held on each table via an adhesive tape. An annular separation member presses the adhesive tape between the ring frame and the substrate, thereby separating the adhesive tape from the ring frame. After separation, the adhesive tape hung down is held by a holding member. Surfaces of the ring frame and the substrate are transferred onto a new adhesive tape while the adhesive tape is pressed by a joining roller. Then the separated adhesive tape is held by the holding member. The substrate joined to the new adhesive tape to be integrated with the frame is moved upward and horizontally. Thereby the separated adhesive tape is separated from the surface of the substrate. | 10-04-2012 |
20120298283 | SEMICONDUCTOR WAFER MOUNTING METHOD AND SEMICONDUCTOR WAFER MOUNTING APPARATUS - A workpiece is unloaded from a wafer-receiving container. A first discriminating sensor detects a front surface of the workpiece, and determines either a semiconductor wafer or a spacer is the workpiece. Where the workpiece is a wafer, the first discriminating sensor also determines whether or not a protective tape is on the front surface of the workpiece. Where it is determined that a protective tape is not on the front surface, a second discriminating sensor detects a back surface of the wafer for discriminating the presence or absence of the protective tape. | 11-29-2012 |