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Masayuki Suzuki

Masayuki Suzuki, Shiga JP

Patent application numberDescriptionPublished
20110102125PLANE COIL - A plane coil which reduces an increase of an effective resistance in a high-frequency area and is made thinner is provided. The plane coil is equipped with plural conductive wires which are parallel to each other, wherein the conductive wires are arranged in a plane and spirally wound, and coil ends of the respective conductive wires are electrically connected to each other at coil lead-out portions and thus are connected in parallel. The conductive wires are arranged in plane, so that a coil thickness does not increase, and the coil is made thinner. Moreover, the plural conductive wires are connected in parallel, an increase of an effective resistance due to an influence of a skin effect in a high-frequency area is reduced.05-05-2011

Masayuki Suzuki, Kyoto JP

Patent application numberDescriptionPublished
20110095683High pressure discharge lamp and method of manufacturing high pressure discharge lamp - A high pressure discharge lamp has a sealing portion that is made of glass and a sealing metal piece. In a method of manufacturing the high pressure discharge lamp, the sealing metal piece is irradiated with laser beam whose pulse width is 1×1004-28-2011
20110139997Ion transporter, ion transport method, ion beam irradiator, and medical particle beam irradiator - To obtain high-directivity, stable, and high-intensity ion beam.06-16-2011

Masayuki Suzuki, Kizukawa-Shi JP

Patent application numberDescriptionPublished
20110096385PLASMA SHUTTER FORMING APPARATUS AND FORMING METHOD - A plasma shutter forming apparatus for forming a plasma shutter used in a system configured to generate and accelerate radiations by irradiating a target with a laser pulse and generating a high-density plasma for blocking the laser pulse which is returned as a feedback light to upstream of the system without being absorbed by the high-density plasma, including a plasma shutter generating target, and a plasma shutter triggering laser irradiator, wherein the laser pulse from the plasma shutter triggering laser irradiator is directed to the plasma shutter generating target to generate the high-density plasma and form the plasma shutter, thereby blocking the laser pulse which is returned as the feedback light. Optics are prevented from becoming damaged by feedback light reflecting when generating the high-density plasma in a laser-driven radiation generating system and returning back to the upstream of the laser system.04-28-2011

Masayuki Suzuki, Kanagawa JP

Patent application numberDescriptionPublished
20090163425Peptide Inhibiting Angiotensin Converting Enzyme - The invention provides a peptide having an activity of inhibiting angiotensin-converting enzyme (ACE), and a food and drink and/or a pharmaceutical composition containing the peptide.06-25-2009
20100314618THIN FILM TRANSISTOR, METHOD OF PRODUCING THE SAME, ELETCTROOPTIC APPARATUS, AND SENSOR - A thin film transistor includes: a substrate; and, on the substrate, an oxide semiconductor film which serves as an active layer and contains In, Ga, and Zn, a gate electrode, a gate insulating film, a source electrode, and a drain electrode, wherein, when a molar ratio of In, Ga, and Zn in the oxide semiconductor film is expressed as In:Ga:Zn=(2.0−x):x:y, wherein 0.012-16-2010
20100320458IGZO-BASED OXIDE MATERIAL AND METHOD OF PRODUCING IGZO-BASED OXIDE MATERIAL - The invention provides an IGZO-based oxide material and a method of producing the same, the IGZO-based oxide material being represented by a composition formula of In12-23-2010
20100320459THIN FILM TRANSISTOR AND METHOD OF PRODUCING THIN FILM TRANSISTOR - The invention provides a thin film transistor comprising an active layer, the active layer comprising an IGZO-based oxide material, the IGZO-based oxide material being represented by a composition formula of In12-23-2010
20110042668AMORPHOUS OXIDE SEMICONDUCTOR MATERIAL, FIELD-EFFECT TRANSISTOR, AND DISPLAY DEVICE - There is provided an amorphous oxide semiconductor material including an amorphous oxide semiconductor including In, Ga and Zn, wherein when In:Ga:Zn=a:b:c denotes an element composition ratio of the oxide semiconductor, the element composition ratio is defined by the range of a+b=2 and b<2 and c<4b−3.2 and c>−5b+8 and 1≦c≦2.02-24-2011

Patent applications by Masayuki Suzuki, Kanagawa JP

Masayuki Suzuki, Ashigarakami-Gun JP

Patent application numberDescriptionPublished
20110032963Eu-containing inorganic compound, luminescent composition and luminescent body containing the same, solid laser device, and light emitting device - An Eu-containing inorganic compound has a polycrystal structure, in which Eu has been doped into a matrix garnet type compound and has formed a solid solution in the matrix garnet type compound. A doping concentration of Eu occupying at an eight-coordination site of the garnet structure falls within the range of more than 0.5 mol % to 50.0 mol %, inclusive. The doping concentration of Eu occupying at the eight-coordination site of the garnet structure should preferably fall within the range of 5.0 mol % to 30.0 mol %.02-10-2011

Masayuki Suzuki, Suzhou JP

Patent application numberDescriptionPublished
20100320843POWER RECEPTION COIL UNIT - A power reception coil unit includes a power reception coil configured to be magnetically coupled to a power supply coil during a power transmission and a magnetic plate made of a magnetic material having electrical conductivity. The power reception coil is a planar coil. The magnetic plate has its surface opposed to the power reception coil and is parallel to the power reception coil. The magnetic plate is provided with a plurality of slits in the surface.12-23-2010

Masayuki Suzuki, Kanagawa-Ken JP

Patent application numberDescriptionPublished
20090081100Translucent material and manufacturing method of the same - After synthesizing particles by liquid phase synthesis, the solution is substituted without drying these particles, and here, a solution comprising a grain boundary phase composition consisting of at least one or more types selected from a group consisting of Al03-26-2009
20100276003LAYERED FILM AND MANUFACTURING METHOD THEREOF, PHOTOELECTRIC CONVERSION DEVICE AND MANUFACTURING METHOD THEREOF, AND SOLAR CELL APPARATUS - Using a manufacturing method which includes a process (A) for forming a particle layer of a plurality of one or more types of particles consisting mainly of a metal oxide and/or a metal hydroxide, and a process (B) for forming, using a reaction solution which includes one or more types of metal ions, a metal oxide layer consisting mainly of an oxide of the one or more types of metal ions on the particle layer so as to cover the particle layer without any cracks by a liquid phase method under a pH condition in which at least a portion of the plurality of particles remains without being dissolved by the reaction solution, a layered film having a layered structure of the particle layer and the metal oxide layer is manufactured.11-04-2010
20110140100THIN-FILM TRANSISTOR, METHOD OF PRODUCING THE SAME, AND DEVICES PROVIDED WITH THE SAME - A thin-film transistor including an oxide semiconductor layer is disclosed. The oxide semiconductor layer includes a first area, a second area and a third area forming a well-type potential in the film-thickness direction. The first area forms a well of the well-type potential and has a first electron affinity. The second area is disposed nearer to the gate electrode than the first area and has a second electron affinity smaller than the first electron affinity. The third area is disposed farther from the gate electrode than the first area and has a third electron affinity smaller than the first electron affinity. At least an oxygen concentration at the third area is lower than an oxygen concentration at the first area.06-16-2011

Patent applications by Masayuki Suzuki, Kanagawa-Ken JP

Masayuki Suzuki, Suzhou CN

Patent application numberDescriptionPublished
20100277004PLANAR COIL AND CONTACTLESS ELECTRIC POWER TRANSMISSION DEVICE USING THE SAME - This invention has an object to a planar coil, a contactless electric power transmission device using the same. This planar coil is configured to suppress an eddy current developed between adjacent turns of wire for minimizing adverse effects on ambient electrical appliances resulting from heat generation. The planar coil 11-04-2010

Masayuki Suzuki, Otsu-Shi JP

Patent application numberDescriptionPublished
20100181842CONTACTLESS POWER TRANSMISSION APPARATUS AND A METHOD OF MANUFACTURING A SECONDARY SIDE THEREOF - According to a first aspect, a secondary side of contactless power transmission apparatus includes: a holding member which is physically separated from a primary side; a magnetic layer; a shield layer for shielding electromagnetic noise; and a heat insulation layer. The secondary coil is a planar coil and supported by the holding member, and at least the magnetic layer is laminated on one side of the planar coil and unified with the planar coil. According to a second aspect, the secondary side of the apparatus includes a plurality of magnetic layers. Each permeability of the magnetic layers is different from each other, and each of the magnetic layers forms a magnetic path with the primary side.07-22-2010

Masayuki Suzuki, Shinagawa-Ku JP

Patent application numberDescriptionPublished
20090130895CONNECTOR - A connector includes contacts each having a contact portion, an elastic portion and a fulcrum portion between the contact portion and a connection portion, and a pressure receiving portion; a housing fixing the contacts; and a slider having urging portions pivotally moved between the connection and pressure receiving portions of the contacts to urging the contact portions against the circuit board, thereby achieving reliable connection and miniaturization of the connector. In an aspect, the housing is formed on the side of a board insertion opening with a recessed portion for conducting the board. In another aspect, the contact includes upper and lower contact portions one above the other arranged alternately staggered so as to be connected to a circuit board having contact portions alternately staggered, so that no defective connection occurs, even if the circuit board is inserted erroneously upside down. In a further aspect, the connector further includes locking members having an engaging portion which engages an anchoring portion of the circuit board to prevent the circuit board from being removed. In one aspect, contacts of two kinds are inserted into the housing from opposite sides, respectively so that these contacts of the two kinds are into contact with the contact portions on respective surfaces of the circuit board. In a further aspect, moreover, a plate-shaped piece is provided in opposition to the contact portions of the contacts to prevent the housing from being deformed.05-21-2009
20100173518CONNECTOR - A connector includes contacts each having a contact portion, an elastic portion and a fulcrum portion between the contact portion and a connection portion, and a pressure receiving portion; a housing fixing the contacts; and a slider having urging portions pivotally moved between the connection and pressure receiving portions of the contacts to urging the contact portions against the circuit board, thereby achieving reliable connection and miniaturization of the connector. In an aspect, the housing is formed on the side of a board insertion opening with a recessed portion for conducting the board. In another aspect, the contact includes upper and lower contact portions one above the other arranged alternately staggered so as to be connected to a circuit board having contact portions alternately staggered, so that no defective connection occurs, even if the circuit board is inserted erroneously upside down. In a further aspect, the connector further includes locking members having an engaging portion which engages an anchoring portion of the circuit board to prevent the circuit board from being removed. In one aspect, contacts of two kinds are inserted into the housing from opposite sides, respectively so that these contacts of the two kinds are into contact with the contact portions on respective surfaces of the circuit board. In a further aspect, moreover, a plate-shaped piece is provided in opposition to the contact portions of the contacts to prevent the housing from being deformed.07-08-2010

Patent applications by Masayuki Suzuki, Shinagawa-Ku JP

Masayuki Suzuki, Okayama JP

Patent application numberDescriptionPublished
20100061891Flow analysis system capable of quantitatively or semi-quantitatively determining element in sample - A flow analysis system or flow injection analysis system, providing a high detection sensitivity even when metallic elements contained in a sample are of extreme trace in amount, wherein a sealed vessel in which a reagent solution is encapsulated is composed of a material having an oxygen permeability of 10 fmol/m03-11-2010

Patent applications by Masayuki Suzuki, Okayama JP

Masayuki Suzuki, Chita-Shi JP

Patent application numberDescriptionPublished
20100037353METHOD FOR IMPROVING ACTIVITY OF REACTIVE OXYGEN SPECIES SCAVENGING ENZYMES - A highly safe, inexpensive and widely utilizable method, which has a mechanism backed by scientific grounds, for improving an activity of ROS (reactive oxygen species)-scavenging enzyme group; An increase in the amount of an enzyme or promotion of an enzyme activity of the ROS scavenging enzyme group such as superoxide dismutase, catalase or peroxidase is caused in an organism having the ROS-scavenging enzyme with one or two or more kinds of substances selected from the group consisting of erythritol, mannitol, sorbitol and xylitol in 0.01-10% administration concentration.02-11-2010

Masayuki Suzuki, Shizuoka JP

Patent application numberDescriptionPublished
20100028287Hair cosmetic composition - The present invention provides a hair cosmetic composition which gives feeling of light-sliding smoothness and not-heavy feeling of not-unruliness to hair. In detail, the hair cosmetic composition comprises a both terminally long-chain alkylamino group-modified polyorganosiloxane having a viscosity at 25° C. of 1,000 to 5,000,000 mPas, represented by the formula: MD02-04-2010

Masayuki Suzuki, Kaisei-Machi JP

Patent application numberDescriptionPublished
20100001619PEROVSKITE-TYPE OXIDE SINGLE CRYSTAL AND METHOD OF MANUFACTURING THE SAME, COMPOSITE PIEZOELECTRIC MATERIAL, PIEZOELECTRIC VIBRATOR, ULTRASONIC PROBE, AND ULTRASONIC DIAGNOSTIC APPARATUS - A method of manufacturing a perovskite-type oxide single crystal having a desired composition and exhibiting excellent properties. The method includes the steps of: (a) forming a precursor of a perovskite-type oxide, at least a part of which is in an amorphous state, on a seed single crystal substrate to prepare a complex of the seed single crystal and the precursor, and (b) heat-treating the complex to induce solid phase epitaxy in the precursor, and thereby, forming a single crystal of the perovskite-type oxide.01-07-2010
20100001620MICROSTRUCTURE OF PEROVSKITE-TYPE OXIDE SINGLE CRYSTAL AND METHOD OF MANUFACTURING THE SAME, COMPOSITE PIEZOELECTRIC MATERIAL, PIEZOELECTRIC VIBRATOR, ULTRASONIC PROBE, AND ULTRASONIC DIAGNOSTIC APPARATUS - A method of manufacturing a microstructure of perovskite-type oxide single crystal having a desired composition and exhibiting excellent properties. The method includes the steps of: (a) forming a coating layer on a surface of a seed single crystal substrate, the coating layer containing the same metallic elements as those in a predetermined perovskite-type oxide; (b) forming a joint body having a micro-structured precursor of the predetermined perovskite-type oxide adhered to a surface of the coating layer; and (c) heat-treating the joint body to induce solid phase epitaxy, and thereby, single-crystallizing the precursor.01-07-2010

Masayuki Suzuki, Kawasaki JP

Patent application numberDescriptionPublished
20090232266SIGNAL PROCESSING DEVICE - A signal processing device includes a phase shifting unit for supplying a second clock signal having a predetermined phase difference relative to a first clock signal, a head recognition bit adding unit for adding a head recognition bit to a predetermined position of data constituting a packet, an inputting unit for reading out a data signal from the memory in synchronization with the second clock signal, a clock replacing unit for inputting the data signal on the basis of the second clock signal and outputting the data signal on the basis of first clock signal, a data shifting unit for shifting the data signal by an amount corresponding to a predetermined number of clock cycles, and an enable signal generating unit for generating an enable signal for recognizing an available length of the packet after an appearance of the head recognition bit in the output signal.09-17-2009

Masayuki Suzuki, Chita JP

Patent application numberDescriptionPublished
20090217393Growth Promoting Agent and Life Prolonging Agent - An object of the present invention is to provide a growth promoting agent and a life prolonging agent which are safer than a conventional one, and can be used for stable and effective production of animals including farm animals, domestic fowls and fishes/shellfishes, stable and effective cultivation of plants including vegetables, fruits and grains, stable and effective culture of microorganisms, and stable and effective cultivation of mushrooms. The present invention provides the growth promoting agent comprising a sugar alcohol, particularly erythritol, as an active ingredient and a life prolonging agent comprising a sugar alcohol, particularly erythritol, as an active ingredient.08-27-2009

Masayuki Suzuki, Nanyo JP

Patent application numberDescriptionPublished
20080268578Manufacturing method of a semiconductor device - A non-leaded resin-sealed semiconductor device is manufactured by the steps of providing a conductive flat substrate (metal plate) of copper plate or the like, fixing semiconductor elements respectively to predetermined positions on the principal surface of the substrate by an insulating adhesive, electrically connecting electrodes on the surfaces of the semiconductor elements with predetermined partition parts of the substrate separate from the semiconductor elements by conductive wires, forming an insulating resin layer on the principal surface of the substrate to cover the semiconductor elements and wires, selectively removing the substrate from the rear of said substrate to form electrically independent partition parts whereof at least some are external electrode terminals, and selectively removing said resin layer to fragment the device into regions containing the semiconductor elements and the plural partition parts around the semiconductor elements. Thus, there is provided a compact non-leaded semiconductor device having a large number of electrode terminals.10-30-2008

Masayuki Suzuki, Aichi JP

Patent application numberDescriptionPublished
20080260998Metal-Coated Textile - An improved metal coated textile and its production method where the coating of metal is deposited onto the textile through sputtering process in thickness between 20 to 2000 angstroms, with less than 5% variance in thickness across the entire length and width of the textile with width up to and over 10000 mm and length up to and over 1000 meters. The improved sputtering process utilizes longer cathodes, arrangements of metal target(s), tension controller with tension meter(s), guard(s), cylinder cover(s), and control over the textile while traveling through the chamber. The metal layer deposited is highly adhesive to the textile and is suitable for producing clothing, swim wear, diving suit, tent, cushion, wall paper, curtain, carpet, protective cover, screen window, equipment casing, and various other items. The metal layer confers characteristics such as anti-bacterial, deodorizing, improved metallic appearance and texture, electrical conductivity, heat-shielding, heat retention, and dirt repellency to the textile.10-23-2008

Masayuki Suzuki, Saitama JP

Patent application numberDescriptionPublished
20110115084LEAD-FREE SOLDER CONNECTION STRUCTURE AND SOLDER BALL - Solder used for flip chip bonding inside a semiconductor package was a Sn—Pb solder such as a Pb-5Sn composition. Lead-free solders which have been studied are hard and easily form intermetallic compounds with Sn, so they were not suitable for a flip chip connection structure inside a semiconductor package, which requires stress relaxation properties. This problem is eliminated by a flip chip connection structure inside a semiconductor package using a lead-free solder which is characterized by consisting essentially of 0.01-0.5 mass percent of Ni and a remainder of Sn. 0.3-0.9 mass percent of Cu and 0.001-0.01 mass percent of P may be added to this solder composition.05-19-2011

Masayuki Suzuki, Gamagori-Shi JP

Patent application numberDescriptionPublished
20110275262METAL-COATED TEXTILE - An improved metal coated textile and its production method where the coating of metal is deposited onto the textile through sputtering process in thickness between 20 to 2000 angstroms, with less than 5% variance in thickness across the entire length and width of the textile with width up to and over 10000 mm and length up to and over 1000 meters. The improved sputtering process utilizes longer cathodes, arrangements of metal target(s), tension controller with tension meter(s), guard(s), cylinder cover(s), and control over the textile while traveling through the chamber. The metal layer deposited is highly adhesive to the textile and is suitable for producing clothing, swim wear, diving suit, tent, cushion, wall paper, curtain, carpet, protective cover, screen window, equipment casing, and various other items. The metal layer confers characteristics such as anti-bacterial, deodorizing, improved metallic appearance and texture, electrical conductivity, heat-shielding, heat retention, and dirt repellency to the textile.11-10-2011

Masayuki Suzuki, Hamura-Shi JP

Patent application numberDescriptionPublished
20110318489SUBSTRATE PROCESSING APPARATUS, PROCESSING TUBE, SUBSTRATE HOLDER, FIXING PART OF THE SUBSTRATE HOLDER, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD - There is provided a substrate processing apparatus, including: a substrate holder that holds a plurality of substrates (wafers) in a state of being arranged in a lateral direction (approximately in a horizontal direction) approximately in a vertical posture; a processing tube that houses the substrate holder; a throat side sealing part (throat side mechanical flange part) that air-tightly closes an opening part of the processing tube; a rotation part that rotates the substrate holder in a peripheral direction of the substrates, with an arrangement direction (a direction in which the substrates are held) of the plurality of substrates as a rotation axis, wherein the substrate holder includes a fixing part (movable holding part) and a fixture holding part for fixing the substrates approximately in a vertical posture.12-29-2011