| Patent application number | Description | Published |
|---|
| 20090117828 | Polishing apparatus and substrate processing apparatus - The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing ( | 05-07-2009 |
| 20090142992 | Polishing apparatus and polishing method - The present invention provides a polishing apparatus for polishing a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position. | 06-04-2009 |
| 20100136886 | POLISHING APPARATUS AND SUBSTRATE PROCESSING APPARATUS - The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishing chamber therein, a rotational table for holding and rotating a substrate, a polishing tape supply mechanism for supplying a polishing tape into the polishing chamber and taking up the polishing tape which has been supplied to the polishing chamber, a polishing head for pressing the polishing tape against a bevel portion of the substrate, a liquid supply for supplying a liquid to a front surface and a rear surface of the substrate, and a regulation mechanism for making an internal pressure of the polishing chamber being set to be lower than an external pressure of the polishing chamber. | 06-03-2010 |
| 20100178851 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus for polishing a periphery of a substrate includes a substrate holder configured to rotate the substrate, a first polishing section configured to polish the periphery of the substrate by bringing a polishing layer of a first polishing tool into contact with the periphery of the substrate when rotated by the substrate holder, and a second polishing section configured to polish the periphery of the substrate by bringing a polishing layer of a second polishing tool into contact with the periphery of the substrate when rotated by the substrate holder. The polishing layer of the first polishing tool has hard first abrasive grains, and the polishing layer of the second polishing tool has second abrasive grains that are softer than the first abrasive grains. | 07-15-2010 |
| 20110136411 | METHOD AND APPARATUS FOR POLISHING A SUBSTRATE HAVING A GRINDED BACK SURFACE - A method capable of quickly polishing an angular portion formed by a grinded back surface and a circumferential surface of a substrate without causing damages on the thin substrate is provided. The method includes rotating the substrate about its center, and pressing a polishing tape against the angular portion formed by the back surface and the circumferential surface of the substrate to polish the angular portion. | 06-09-2011 |
| 20110207294 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes: pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon; and pressing a second polishing tape against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth. | 08-25-2011 |
| 20110217906 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing. | 09-08-2011 |
| 20110237164 | POLISHING APPARATUS, POLISHING METHOD AND PRESSING MEMBER FOR PRESSING A POLISHING TOOL - A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism | 09-29-2011 |
