| Patent application number | Description | Published |
| 20090235499 | TANTALUM CAPACITOR - A tantalum capacitor includes: sintered bodies which are disposed at intervals and respectively have first surfaces forming the same surface; and electrode rods which respectively extend into the tantalum sintered bodies and project from the first surfaces of the tantalum sintered bodies. The tantalum capacitor further includes: layers composed of an oxide film layer, a functional polymer layer or a manganese layer, and a carbon layer which are sequentially laminated on surfaces of each of the tantalum sintered bodies excluding the first surface; a conductive layer which covers outside surfaces of the tantalum sintered bodies excluding the first surfaces; and an electrode plate having openings respectively formed at positions corresponding to the first surfaces of the tantalum sintered bodies so that the electrode rods are exposed through the openings. The electrode plate is connected to the conductive layer and spreads across the first surfaces of the tantalum sintered bodies. | 09-24-2009 |
| 20100090872 | Keyboard and information processing device - A keyboard includes a base, and plural keys arranged on the base, wherein at least a part of the plural keys are arranged in plural steps in a depth direction of the keyboard, in the shape of a sector in such a manner that the keys closer to a central portion in a width direction of the keyboard are arranged backward whereas the keys closer to both end portions in the width direction of the keyboard are arranged forward. | 04-15-2010 |
| 20100132189 | Method for taking an electronic component out of a carrier tape - A method for taking an electronic component out of a carrier tape configured to house the electronic component in a concave that is defined by a sidewall and a bottom surface reduces a binding force applied by the concave to the electronic component by stretching the sidewall to outside near a perforation hole that is formed at least one of the sidewall and a portion of the bottom surface adjacent to the sidewall. | 06-03-2010 |
| 20100246149 | CONNECTION MEMBER AND PRINTED CIRCUIT BOARD UNIT - A connection member is disposed between a semiconductor package and a printed wiring board. The connection member includes: a base member formed of an insulating material; a plurality of through-holes provided in the base member at corresponding positions between a plurality of first terminal pads of the semiconductor package and a plurality of second terminal pads of the printed wiring board; and an electronic component inserted in the plurality of through-holes, the electronic component having a first electrode and a second electrode at ends thereof, the first electrode connected to one of the first terminal pads, the second electrode connected to one of the second terminal pads. | 09-30-2010 |
| 20110073240 | CRYSTAL-OSCILLATOR FABRICATING APPARATUS AND METHOD - A method of fabricating a crystal oscillator includes applying an adhesive to an electrode pad; determining whether the applied adhesive is in an area outside of the electrode pad; removing at least part of the adhesive in the area outside of the electrode pad using a laser beam when a portion of the applied adhesive is determined to be in the area outside of the electrode pad; and disposing an electrode of a crystal resonator on the adhesive applied to the electrode pad. | 03-31-2011 |
| 20110095656 | PIEZOELECTRIC OSCILLATOR AND MANUFACTURING METHOD THEREOF - A piezoelectric oscillator includes: a package including a floor surface and a step portion thereinside; a conductive adhesive applied on the step portion; and a piezoelectric vibrator including one end placed on the step portion via the conductive adhesive. The floor surface is provided with a recess filled with a resin material having a thermal deformation property. The package includes a sidewall having transparency. | 04-28-2011 |
| 20110169377 | PIEZOELECTRIC OSCILLATOR - A piezoelectric crystal unit includes a package including a concave portion; a piezoelectric element having a protruding electrode and disposed within the package; and an electrically conductive adhesive contained in the concave portion. The piezoelectric element is fixed to the package with the protruding electrode embedded in the concave portion of the package. | 07-14-2011 |
| 20110241792 | PACKAGE, PIEZOELECTRIC VIBRATOR AND PIEZOELECTRIC OSCILLATOR - A package is configured to accommodate a piezoelectric element. The package includes a guide part having a plurality of spaces into which electrodes of the piezoelectric element is inserted, respectively. The plurality of spaces of the guide part are separated from each other. | 10-06-2011 |