Patent application number | Description | Published |
20090235499 | TANTALUM CAPACITOR - A tantalum capacitor includes: sintered bodies which are disposed at intervals and respectively have first surfaces forming the same surface; and electrode rods which respectively extend into the tantalum sintered bodies and project from the first surfaces of the tantalum sintered bodies. The tantalum capacitor further includes: layers composed of an oxide film layer, a functional polymer layer or a manganese layer, and a carbon layer which are sequentially laminated on surfaces of each of the tantalum sintered bodies excluding the first surface; a conductive layer which covers outside surfaces of the tantalum sintered bodies excluding the first surfaces; and an electrode plate having openings respectively formed at positions corresponding to the first surfaces of the tantalum sintered bodies so that the electrode rods are exposed through the openings. The electrode plate is connected to the conductive layer and spreads across the first surfaces of the tantalum sintered bodies. | 09-24-2009 |
20100090872 | Keyboard and information processing device - A keyboard includes a base, and plural keys arranged on the base, wherein at least a part of the plural keys are arranged in plural steps in a depth direction of the keyboard, in the shape of a sector in such a manner that the keys closer to a central portion in a width direction of the keyboard are arranged backward whereas the keys closer to both end portions in the width direction of the keyboard are arranged forward. | 04-15-2010 |
20100132189 | Method for taking an electronic component out of a carrier tape - A method for taking an electronic component out of a carrier tape configured to house the electronic component in a concave that is defined by a sidewall and a bottom surface reduces a binding force applied by the concave to the electronic component by stretching the sidewall to outside near a perforation hole that is formed at least one of the sidewall and a portion of the bottom surface adjacent to the sidewall. | 06-03-2010 |
20100246149 | CONNECTION MEMBER AND PRINTED CIRCUIT BOARD UNIT - A connection member is disposed between a semiconductor package and a printed wiring board. The connection member includes: a base member formed of an insulating material; a plurality of through-holes provided in the base member at corresponding positions between a plurality of first terminal pads of the semiconductor package and a plurality of second terminal pads of the printed wiring board; and an electronic component inserted in the plurality of through-holes, the electronic component having a first electrode and a second electrode at ends thereof, the first electrode connected to one of the first terminal pads, the second electrode connected to one of the second terminal pads. | 09-30-2010 |
20110073240 | CRYSTAL-OSCILLATOR FABRICATING APPARATUS AND METHOD - A method of fabricating a crystal oscillator includes applying an adhesive to an electrode pad; determining whether the applied adhesive is in an area outside of the electrode pad; removing at least part of the adhesive in the area outside of the electrode pad using a laser beam when a portion of the applied adhesive is determined to be in the area outside of the electrode pad; and disposing an electrode of a crystal resonator on the adhesive applied to the electrode pad. | 03-31-2011 |
20110095656 | PIEZOELECTRIC OSCILLATOR AND MANUFACTURING METHOD THEREOF - A piezoelectric oscillator includes: a package including a floor surface and a step portion thereinside; a conductive adhesive applied on the step portion; and a piezoelectric vibrator including one end placed on the step portion via the conductive adhesive. The floor surface is provided with a recess filled with a resin material having a thermal deformation property. The package includes a sidewall having transparency. | 04-28-2011 |
20110169377 | PIEZOELECTRIC OSCILLATOR - A piezoelectric crystal unit includes a package including a concave portion; a piezoelectric element having a protruding electrode and disposed within the package; and an electrically conductive adhesive contained in the concave portion. The piezoelectric element is fixed to the package with the protruding electrode embedded in the concave portion of the package. | 07-14-2011 |
20110241792 | PACKAGE, PIEZOELECTRIC VIBRATOR AND PIEZOELECTRIC OSCILLATOR - A package is configured to accommodate a piezoelectric element. The package includes a guide part having a plurality of spaces into which electrodes of the piezoelectric element is inserted, respectively. The plurality of spaces of the guide part are separated from each other. | 10-06-2011 |
20110302774 | METHOD FOR MANUFACTURING OSCILLATOR DEVICE AND OSCILLATOR DEVICE - An oscillator device manufacturing method includes: placing an oscillator provided with electrodes on a convex pedestal provided on an assembly table; arranging, on the assembly table, a frame member including an opening surrounded by a frame thereof and provided with electrode pads on the frame such that the opening is positioned at the pedestal; connecting the electrode pads to the electrodes of the oscillator placed on the pedestal via wires, while the frame member is arranged on the assembly table; removing the frame member from the assembly table together with the oscillator after the connecting, and bonding the frame member connected to the oscillator to a substrate. By using the method, the oscillator device including the oscillator suspended in air above the substrate can be efficiently manufactured. In stead of using the frame member, a frame body in which frame members are arrayed can be employed. | 12-15-2011 |
20110304954 | SOLID ELECTROLYTIC CAPACITOR AND POWER CIRCUIT - A solid electrolytic capacitor includes a capacitor element having two opposite cathode surfaces, a cathode terminal metal plate having a first cathode connecting portion electrically connected to one of the two opposite cathode surfaces, and an auxiliary cathode metal plate having a second cathode connecting portion electrically connected to the other one of the two opposite cathode surfaces of the capacitor element. The cathode terminal metal plate includes a groove electrically connected to the first cathode connecting portion. The auxiliary cathode metal plate includes an end portion that is electrically connected to the second cathode connecting portion and engages with the groove. The cathode terminal metal plate further includes an outer terminal portion. | 12-15-2011 |
20120056684 | METHOD OF FABRICATING RESONATOR, RESONATOR, AND OSCILLATOR - There is provided a method of fabricating a resonator, the method includes, joining a vibrating plate with a substrate at a first surface thereof, grinding a surface of the vibrating plate joined with the substrate, forming an electrode on the ground surface of the vibrating plate, and etching electively a region at a second surface of the substrate, where the second surface is opposite to the first surface and the region is corresponding to a position of the electrode. | 03-08-2012 |
20120062072 | Method of fabricating crystal unit, crystal unit fabrication mask, and crystal unit package - A method of fabricating a crystal unit fills an adhesive from a first opening in a front surface of a mask of each of penetration holes in the mask in a state in which the mask is set on a base, into each penetration hole, and heats, by a heating element, a sidewall region defining a second opening in a back surface of the mask, in order to cure a sidewall part of the adhesive in the sidewall region defining each penetration hole in contact with the adhesive filling each penetration hole. A crystal blank is bonded on the base using the adhesive in order to form the crystal unit, after removing the mask from the base. | 03-15-2012 |
20120088335 | MANUFACTURING METHOD OF THE ELECTRONIC COMPONENT - Manufacturing method of an electronic component including connecting one lead of a pair of leads to a surface parallel with a pn connection layer of an electronic element having a structure where the p-type layer and the n-type layer are connected by the pn connection layer provided between the p-type layer and the n-type layer, connecting another lead to another surface parallel with the pn connection layer; and forming a supporting part of the pair of the leads that is connected to and supporting the electronic element, and an electrode part functioning as an electrode, by bending the pair of the leads to an outside. | 04-12-2012 |
20120275128 | ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT ASSEMBLY APPARATUS - An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate. | 11-01-2012 |
20130118003 | METHOD OF MANUFACTURING COIL DEVICE - A method of manufacturing a coil device includes inserting planar insulating sheets into a single conductor formed in a solenoidal coil shape from a direction intersecting with a winding axis direction. | 05-16-2013 |
20140015114 | ELECTRONIC DEVICE MANUFACTURING METHOD, ELECTRONIC DEVICE, AND CHIP ASSEMBLY - An electronic device manufacturing method includes a cutting step at which a wafer is cut to obtain chips before pattern formation and a polishing step at which cut surfaces of the obtained chips are subjected in one batch to barrel polishing. The method further includes an aligning step at which the polished chips are aligned so that front surfaces thereof face in an upward direction. The method further includes a bonding step at which the cut surfaces of the aligned chips are bonded together with an adhesive to thereby form a chip assembly. The method further includes a pattern forming step at which a circuit pattern is formed on each of the chips of the chip assembly and a melting step at which the adhesive on the chip assembly is melted to thereby separate the chip assembly into chips after pattern formation. | 01-16-2014 |
20140021829 | TUNING FORK VIBRATOR - A tuning fork vibrator includes a package having an internal space having a rectangle column shape; a tuning fork vibration piece including a base, two vibration arms extending in parallel form the base and a first arm and a second arm extending obliquely from the base so as to interpose the two vibration arms, the tuning fork vibration piece having a length from the base to a tip in an extended direction of the two vibration arms which is longer than each side of the bottom surface of the internal space, wherein the tuning fork vibration piece is placed in the internal space with the extended direction set along a diagonal direction of the internal space, and a tip part of the first arm and a tip part of the second arm of the tuning fork vibration piece are fixed to the bottom surface of the internal space. | 01-23-2014 |
20140085775 | ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided an electrolytic capacitor which includes a capacitance portion that includes an anode and a cathode foils wound around, a separator being provided between the foils, a first conductor bar connected to the anode foil, a second conductor bar to the cathode foil, a casing that houses the capacitance portion, the first conductor bar, and the second conductor bar and is provided with an opening, a sealing material fitted to the opening, the sealing material including a first and a second holes, a first lead welded to the first conductor bar within the first hole, a second lead to the second conductor bar the second holed, a first insulating filler filled between the first hole and the first lead and filler being formed in a porous state, and a second insulating filler filled between the second hole and the second lead and being formed in a porous state. | 03-27-2014 |
20140086276 | TEMPERATURE SENSOR AND TEMPERATURE COMPENSATION OSCILLATOR - A temperature sensor includes a resonator; a first oscillation circuit to oscillate the resonator in a first oscillation mode; a second oscillation circuit to oscillate the resonator in a second oscillation mode different from the first oscillation mode; a switching circuit to connect the resonator to the first oscillation circuit or the second oscillation circuit; a control circuit to control the switching circuit so that the first oscillation circuit and the second oscillation circuit are alternately connected to the resonator; and a temperature information output circuit to generate information representing a frequency difference between a signal output from the first oscillation circuit kept in a status of being connected to the resonator and a signal output from the second oscillation circuit kept in the status of being connected to the resonator on the basis of these signals and to output the frequency difference information as temperature information on the resonator. | 03-27-2014 |
20140158292 | METHOD OF FABRICATING CRYSTAL UNIT, CRYSTAL UNIT FABRICATION MASK, AND CRYSTAL UNIT PACKAGE - A method of fabricating a crystal unit fills an adhesive from a first opening in a front surface of a mask of each of penetration holes in the mask in a state in which the mask is set on a base, into each penetration hole, and heats, by a heating element, a sidewall region defining a second opening in a back surface of the mask, in order to cure a sidewall part of the adhesive in the sidewall region defining each penetration hole in contact with the adhesive filling each penetration hole. A crystal blank is bonded on the base using the adhesive in order to form the crystal unit, after removing the mask from the base. | 06-12-2014 |
20140168860 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - An electronic component includes a metal case with an opening at one end, a metal foil placed in an internal space of the metal case, a packing made of an elastic material and fit into the opening of the metal case, the packing having a through-bore, a cap made of a foamed material and provided at an outer side of the packing, a conductive tab inserted in the through-bore of the packing and connected at one end to the metal foil in the internal space of the metal case, and a lead with a first end connected to another end of the conductive tab and a second end projecting externally from the metal case. | 06-19-2014 |
20140183672 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - An electronic device includes: a first-member that includes a through-hole; a second-member that includes a connection-hole and that is in contact with the first-member in a state where the through-hole and the connection-hole are in communication with each other; a first-locking-surface that is formed on the first-member while extending radially outside of the through-hole and that faces a side opposite to the connection-hole-side; a second-locking-surface that is formed in the second-member while extending radially outside of the connection-hole and that faces a side opposite to the through-hole-side; and an adhesive-portion including a shaft-portion with which the through-hole and the connection-hole are filled, a first-large-diameter portion that is formed at an end of the shaft-portion and secured to the first-locking-surface, and a second-large-diameter portion that is formed at the other end of the shaft-portion and secured to the second-locking-surface. | 07-03-2014 |
20140340163 | OSCILLATOR DEVICE AND METHOD OF MOUNTING OSCILLATOR DEVICE - A oscillator device includes: a first substrate that has a first surface, a second surface, and a through hole extending between the first surface and the second surface; a crystal oscillator that is disposed on the first surface of the first substrate, the crystal oscillator including an electrode; a second substrate that is disposed on the crystal oscillator; a through electrode that is disposed in the through hole, that has a diameter smaller than a diameter of the through hole, that is electrically coupled to the electrode, and that extends between the first surface and the second surface; and a filling member with which an area between an inner wall of the through hole and the through electrode is filled. | 11-20-2014 |
20140340184 | TRANSFORMER DEVICE AND MANUFACTURING METHOD THEREOF - A transformer device includes: a transformer that includes a magnetic body core and a winding; a case that houses the transformer; an external terminal that is provided in the case; a relay section that is provided in the case and to which an end portion of the winding of the transformer is connected; and a conducting wire of which one end is wound around the external terminal and bonded thereto, and another end is connected to the relay section. | 11-20-2014 |
20140361666 | CRYSTAL RESONATOR, AND PRODUCTION METHOD THEREFOR - A crystal resonator includes: lower glass plates on which first electrodes are formed so as to extend from side surfaces to a bottom surface of the lower glass plates; a crystal plate which is provided over the lower glass plates and on which second electrodes to be coupled to the first electrodes are formed on a surface in contact with the lower glass plates; and an upper glass plate which is provided over the crystal plate; wherein the side surfaces of the lower glass plates on which the first electrodes are formed are provided with a protrusion that extends in parallel with a top surface and the bottom surface of the lower glass plates and that extends from one end to the other end of each of the side surfaces, and wherein the first electrodes are formed on the side surfaces that include surfaces of the protrusion. | 12-11-2014 |
20140361782 | ELECTRONIC COMPONENT INSPECTION APPARATUS AND METHOD - An electronic component inspection apparatus includes a light source arranged in a mounting area where at least one electronic component is mounted to a board and a light-receiving sensor arranged outside the mounting area to detect an intensity of a light received from the light source. A computer executes a program to perform a process of determining a state of joining parts in the mounting area based on a result of comparison of the intensity of the light received by the light-receiving sensor with an intensity of distribution previously acquired. | 12-11-2014 |