Patent application number | Description | Published |
20090072700 | PHOSPHOR-CONTAINING MOLDED MEMBER, METHOD OF MANUFACTURING THE SAME, AND LIGHT EMITTING DEVICE HAVING THE SAME - In a method of manufacturing a phosphor-containing molded member, an inorganic powder in a mixture with a phosphor powder is melted by using Spark Plasma Sintering method, and then cooled. In a phosphor-containing molded member, a content of the phosphor therein is 5% by weight or more. | 03-19-2009 |
20110147778 | LIGHT EMITTING DEVICE - To provide a light emitting device capable of improving both color unevenness and an emission output power. | 06-23-2011 |
20110248304 | LIGHT EMITTING DEVICE - The first wavelength converting member, the light emitting element, and the second wavelength converting member are disposed in this order toward the opening of the recess portion on the bottom surface of the housing member through a light transmissive supporting member, and spaced away from the side surface of the recess portion. The first wavelength converting member is a plate shape member made of a composite of an inorganic binder made of an inorganic material and a fluorescent material. A light scattering surface is formed on at least a portion of the side surface of the recess portion, which is irradiated with the light emitted from the side surfaces of the wavelength converting member in parallel with the principal surface of the first wavelength converting member. | 10-13-2011 |
20110248623 | LIGHT EMITTING DEVICE - A light emitting device includes a housing member having a recess open upward, a light emitting element arranged in the recess and having a light emitting layer of a semiconductor, and a wavelength converting member arranged in the recess and capable of absorbing a part of light emission from the light emitting element and emitting light of different wavelength. The light emitting device is capable of mixing the light emission from the light emitting element and the light emission from the wavelength converting member to emit light from the opening of the recess. A light scattering surface for scattering light emission from the light emitting element and wavelength converting member is formed on at least part of the side surface of the recess. The light emitting element and the wavelength converting member are spaced apart from the side and bottom surfaces of the recess, and the side surfaces of the light emitting element are exposed without being covered with the wavelength converting member. | 10-13-2011 |
20130122620 | METHOD OF FORMING LIGHT CONVERTING LAYER, METHOD OF MANUFACTURING LIGHT CONVERTING MEMBER, AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE - Provided Is a method of forming a light converting layer capable of uniformly distributing fluorescent material particles, a method of manufacturing a light converting member capable of distributing fluorescent material particles, and a method of manufacturing a light emitting device capable of controlling color irregularities. The method of forming a light converting member comprising steps of, preparing fluorescent material particles, forming a bonding layer made of a resin on a base body; incorporating the fluorescent material particles in the bonding layer; and hardening the bonding layer. | 05-16-2013 |
20130316478 | LIGHT EMITTING DEVICE - A light emitting device capable of improving both color unevenness and emission output power is provided. The light emitting device includes a semiconductor light emitting element including a semiconductor layer that emits primary light; and a fluorescent material layer disposed on the light emitting side of the semiconductor light emitting element, that absorbs a part of the primary light and emits secondary light having a wavelength longer than that of the primary light; and emits light of blended color of the primary light and the secondary light of the light emitting element, and further includes a scattering layer in which particles having a mean particle size D that satisfies the inequality: 20 nm11-28-2013 | |
20150048398 | LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - To provide a light-emitting device that is provided with an optical member firmly bonded to a semiconductor light-emitting element and has a high light extraction efficiency, the light-emitting device includes a light-emitting element having a semiconductor layer and an optical member bonded to the light-emitting surface of the light-emitting element with a metal film being interposed therebetween wherein the metal film has a thickness in a film-forming rate conversion not less than 0.05 nm nor more than 2 times of an atomic diameter of the metal atoms forming the metal film. | 02-19-2015 |
20150076548 | METHOD OF MANUFACTURING LIGHT EMITTING DEVICE INCLUDING LIGHT EMITTING ELEMENT AND WAVELENGTH CONVERTING MEMBER - A light emitting device includes a light emitting element and a wavelength converting member bonded with each other. The light emitting element has, from the wavelength converting member side, a first region and a second region. The wavelength converting member has, from the light emitting element side, a third region and a fourth region. The first region has an irregular atomic arrangement compared with the second region. The third region has an irregular atomic arrangement compared with the fourth region. The first region and the third region are directly bonded. | 03-19-2015 |