Patent application number | Description | Published |
20090051020 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - A semiconductor memory device includes: A method of manufacturing a semiconductor device, wherein a semiconductor chip is mounted on a lead frame including a plurality of lead lines, and terminals included in the semiconductor chip are connected to the lead lines, thereby to manufacture the semiconductor device, comprising the steps of:
| 02-26-2009 |
20090161427 | NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE - A non-volatile semiconductor storage device includes: a memory cell array having memory cells arranged therein, the memory cells storing data in a non-volatile manner; and a plurality of transfer transistors transferring a voltage to the memory cells, the voltage to be supplied for data read, write and erase operations with respect to the memory cells. Each of the transfer transistors includes: a gate electrode formed on a semiconductor substrate via a gate insulation film; and diffusion layers formed to sandwich the gate electrode therebetween and functioning as drain/source layers. Upper layer wirings are provided above the diffusion layers and provided with a predetermined voltage to prevent depletion of the diffusion layers at least when the transfer transistors become conductive. | 06-25-2009 |
20100309733 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device is provided, which includes an input buffer provided with a first inverter that can electrically adjust circuit threshold values, a circuit: threshold value monitor provided with a second inverter having the same circuit configuration as the first inverter to detect the circuit threshold values of the first inverter when the input and output of the second inverter are short-circuited, respectively, a memory storing parameter values that correspond to the circuit threshold values detected by the circuit threshold value monitor, and a data-reader circuit reading the parameter values given to the first inverter from the memory. | 12-09-2010 |
20110128063 | SEMICONDUCTOR INTEGRATED CIRCUIT - According to one embodiment, a semiconductor integrated circuit includes first and second level shift circuits. The first level shifter includes a plurality of transistors and is connected to a power source voltage supply node of a first power source system and to which a first signal of a second power source system and a level inversion signal of the first signal are input. The second level shifter includes a plurality of transistors and is connected to the power source voltage supply node of the first power source system and to which the level inversion signal of the first signal of the second power source system and an output signal of the first level shifter are input. The first and second level shifters have substantially the same circuit configuration and driving abilities of corresponding ones of the transistors in the first and second level shifters are substantially set equal. | 06-02-2011 |
20110128073 | SEMICONDUCTOR INTEGRATED CIRCUIT - According to one embodiment, a semiconductor integrated circuit includes first to six transistors and a constant current source circuit. The first and second transistors form a current mirror circuit connected to a first power source node. The third and fourth transistors form a differential pair circuit. The third and fourth transistors receive first and second external signals at their gates, respectively. The constant current source circuit has one end connected to source terminals of the third and fourth transistors, and the other end connected to a second power source node. The fifth and sixth transistors form a current pathway between a common gate node of the first and second transistors and the constant current source circuit. The gate of fifth transistor is connected to a signal output node. The gate of sixth transistor receives a signal of logic opposite to a signal to be obtained at the signal output node. | 06-02-2011 |
20110133792 | BUFFER CIRCUIT - A buffer circuit in accordance with an embodiment comprises output transistors connected between a first fixed voltage terminal and an output terminal, and gate control transistors connected between a second fixed voltage terminal and a gate of one of the output transistors or between two of gates of the output transistors. The output transistors are configured to turn on to change a voltage of the output terminal. The gate control transistors are configured to apply a gate voltage to the gates of the output transistors. A gate of each of the gate control transistors is applied with a certain voltage, such that when a source of each of the gate control transistors changes from a first potential to a second potential, a potential difference between the gate and the source attains a threshold voltage or greater, whereby each of the gate control transistors is turned on. | 06-09-2011 |
20120250423 | INPUT CIRCUIT - The first input circuit detects an input signal to output a first output signal having the same phase as the input signal. The second input circuit is configured to detect a first strobe signal to output a second output signal. The third input circuit is configured to detect a second strobe signal as a reversed signal of the first strobe signal to output a third output signal. A data latch circuit includes a first latch circuit and a second latch circuit. It is configured to latch the first output signal in either one of the first latch circuit or the second latch circuit according to the first output signal, the second output signal and the third output signal. It also allows the other one of the first latch circuit or the second latch circuit to input the first output signal thereto. | 10-04-2012 |
20130027108 | LEVEL SHIFT CIRCUIT - According to one embodiment, a level shift circuit includes a plurality of level shift units which are connected to each other and in which the delay time of the rising edge of an output voltage is different from the delay time of the falling edge of the output voltage. The delay time of the rising edge of the output voltage from the previous level shift unit is compensated by the delay time of the falling edge of the output voltage from the next level shift unit, and the delay time of the falling edge of the output voltage from the previous level shift unit is compensated by the delay time of the rising edge of the output voltage from the next level shift unit. | 01-31-2013 |
20130181764 | SEMICONDUCTOR INTEGRATED CIRCUIT - A constant current source circuit includes one end connected to a second node as sources of third and fourth transistors, and the other end connected to a second power supply node that supplies a second voltage different from a first voltage. The clamp circuit is configured to form a current path between the second node and the second power supply node. It adjusts the potential of the second node to a certain potential when a first external input signal is switched from a first state to a second state. | 07-18-2013 |
20130228867 | SEMICONDUCTOR DEVICE PROTECTED FROM ELECTROSTATIC DISCHARGE - According to one embodiment, a semiconductor device includes a first semiconductor chip, at least one second semiconductor chip, a first connector, and a second connector. The first semiconductor chip includes a first input pad, first protection circuit, and first internal circuit. The at least one second semiconductor chip includes a second input pad, second protection circuit, and second internal circuit. The first connector electrically connects the first and second input pads. The second connector connects the first protection circuit and first input pad of the first semiconductor chip. The second protection circuit of the at least one second semiconductor chip is not connected to the second input pad. | 09-05-2013 |
20130242664 | INTERFACE CIRCUIT - According to an embodiment, an interface circuit is provided with an output buffer which generates an output waveform on the basis of the ON/OFF operation of a transistor and a driver circuit which drives the transistor and is capable of independently changing a turn-ON speed and a turn-OFF speed of the transistor. | 09-19-2013 |
20140062587 | SEMICONDUCTOR DEVICE HAVING STACKED CHIPS - According to one embodiment, a semiconductor device includes chips and a first selection circuit. Each of the chips has at least first and second vias for transmitting at least first and second address signals, these chips are stacked to be electrically connected via the first and second vias. The first selection circuit is provided in each chip, includes a logic circuit that selects a chip based on at least the first and second address signals, and supplies a result of operating the first and second address signals to the subsequent chip. | 03-06-2014 |
20140140152 | SEMICONDUCTOR STORAGE DEVICE AND CONTROL METHOD THEREOF - According to one embodiment, a semiconductor storage device includes a plurality of semiconductor chips and a control unit. The plurality of semiconductor chips is configured to connect to a signal transmission path and is controlled individually by individual chip enable signals. The plurality of semiconductor chips each includes a termination circuit connected to the signal transmission path. When one of the semiconductor chips is selected to input or output data, the control unit activates the termination circuit provided in the semiconductor chip that is not selected based on a first instruction signal and the chip enable signal. | 05-22-2014 |
20140285231 | SEMICONDUCTOR DEVICE AND TRIMMING METHOD FOR THE SAME - According to one embodiment, a semiconductor device includes a termination circuit and a controller. The termination circuit includes a first resistor connected to an external connection terminal, a plurality of first transistors of a first conductive type connected in parallel between the first resistor and a voltage source, a second resistor connected to the external connection terminal, and a plurality of second transistors of a second conductive type connected in parallel between the second resistor and ground. The controller is configured to control switching of the first and second transistors such that a combined resistance value of the first and second resistors and the termination circuit is constant. | 09-25-2014 |
20140285247 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes a first differential amplifier and a second differential amplifier. The first differential amplifier charges the first output terminal with a second voltage different from a first voltage. The first differential amplifier uses a first clock signal, stopping the charging at the first output terminal, receives first complementary data of the first voltage at the rising edge of a second clock signal, and outputs the first complementary data at the second voltage. The second differential amplifier charges the second output terminal with the second voltage. The second differential amplifier uses a third clock signal, stopping the charging at the second output terminal, receives second complementary data of the first voltage at the rising edge of a fourth clock signal, and outputs the second complementary data at the second voltage. | 09-25-2014 |
20140286091 | SEMICONDUCTOR INTEGRATED CIRCUIT - A semiconductor integrated circuit includes a reference voltage generation circuit configured to generate a reference voltage, and a voltage changing circuit configured to generate a second voltage from a first voltage based on a difference between the second voltage and the reference voltage and apply the second voltage to a load capacitance. The reference voltage generation circuit includes a variable current source and a capacitor which are connected in series and is configured to change the reference voltage linearly. | 09-25-2014 |
20150016205 | SEMICONDUCTOR CIRCUIT - A semiconductor circuit includes a first input section into which a first input signal is inputted, a second input section into which a second input signal is inputted, an output generation circuit which is connected to the first and second input sections and generates an output signal based on the input signals, an output section which outputs the output signal, and a current source which is connected to connection nodes between the input sections and the output generation circuit. | 01-15-2015 |
20150070084 | SEMICONDUCTOR DEVICE - A semiconductor device includes an input-part receiving a first voltage and an output-part outputing a second voltage. A current mirror part receives the first voltage. A reference voltage is supplied to a gate of a reference transistor. The reference transistor is electrically connected between the current-mirror part and a ground voltage. A monitor transistor includes a gate electrically connected to the second power-supply voltage, and is electrically connected between the current-mirror part and the ground voltage. A voltage-generation transistor includes a gate electrically connected to both the current-mirror part and the reference transistor. The voltage-generation transistor is electrically connected between the input-part and the output-part. A first capacitor including one end electrically connected to the output-part, and the other end electrically connected to both the current-mirror part and the reference transistor. | 03-12-2015 |
20150078085 | SEMICONDUCTOR DEVICE HAVING STACKED CHIPS - According to one embodiment, a semiconductor device includes chips and a first selection circuit. Each of the chips has at least first and second vias for transmitting at least first and second address signals, these chips are stacked to be electrically connected via the first and second vias. The first selection circuit is provided in each chip, includes a logic circuit that selects a chip based on at least the first and second address signals, and supplies a result of operating the first and second address signals to the subsequent chip. | 03-19-2015 |