Patent application number | Description | Published |
20100026355 | Load drive device and control system of the same - A load drive device for driving an inductive load by PWM controlling a switching element includes synchronization control unit, a synchronization signal input terminal, and a synchronization signal output terminal. The synchronization control unit outputs the PWM signal to the switching element. The synchronization control unit receives a synchronization signal through the input terminal from an exterior. The synchronization control unit outputs the synchronization signal through the output terminal to an exterior. When the synchronization control unit does not receive the synchronization signal, the synchronization control unit outputs the synchronization signal such that a first switching period of the PWM signal is prevented from overlapping with a second switching period of a PWM signal of an external device. When the synchronization control unit receives the synchronization signal, the synchronization control unit generates the PWM signal based on the synchronization signal. | 02-04-2010 |
20100109136 | Semiconductor device including semiconductor chip mounted on lead frame - A semiconductor device includes a lead frame, a semiconductor chip, a substrate, a plurality of chip parts, a plurality of wires, and a resin member. The lead frame includes a chip mounted section and a plurality of lead sections. The semiconductor chip is mounted on the chip mounted section. The substrate is mounted on the chip mounted section. The chip parts are mounted on the substrate. Each of the chip parts has a first end portion and a second end portion in one direction, and each of the chip parts has a first electrode at the first end portion and a second electrode at the second end portion. Each of the wires couples the second electrode of one of the chip parts and one of the lead sections. The resin member covers the lead frame, the semiconductor chip, the substrate, the chip parts, and the wires. | 05-06-2010 |
20110268593 | ELECTRIC DEVICE MOUNTED IN ELECTRIC COMPRESSOR - An electric device includes: a circuit board arranged in cooling medium in a housing and having an electric element and an external coupling electrode, wherein the electric element is sealed in and mounted in a substrate, and the electric element is electrically coupled with the external coupling electrode; an external coupling terminal electrically coupled with the external coupling electrode; and a separation member for separating the external coupling terminal and a connection portion between the external coupling electrode and the external coupling terminal away from the cooling medium. | 11-03-2011 |
20110297431 | CONNECTION STRUCTURE - A connection structure includes a circuit board and a terminal. The circuit board includes an insulation base member containing thermoplastic resin, and a wiring portion arranged in the insulation base member. The wiring portion has a conductor pattern and an interlayer connector electrically connected to the conductor pattern. The terminal is electrically connected to a part of the wiring portion, and has a first section arranged inside of the insulation base member. The first section of the terminal is tightly contact with the thermoplastic resin of the insulation base member, such that the terminal is connected to the circuit board. | 12-08-2011 |
20130047426 | METHOD FOR MANUFACTURING ELECTRONIC APPARATUS - Multiple high-voltage side and low-voltage side electric conductors are formed from one sheet of a conductive plate in such a way that the multiple electric conductors are arranged in parallel to one another across an initial gap between the high-voltage side and the low-voltage side electric conductors. The multiple electric conductors are connected to one another via connecting portions. An intermediate portion of the connecting portion is deformed so as to reduce the initial gap to a smaller adjusted gap. Portions of the electric conductors as well as switching devices mounted to the electric conductors are sealed by sealing material. The connecting portions are cut away so that the electric conductors are finally separated from one another. | 02-28-2013 |
20140084437 | SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIP MOUNTED ON LEAD FRAME - A semiconductor device includes a lead frame, a semiconductor chip, a substrate, a plurality of chip parts, a plurality of wires, and a resin member. The lead frame includes a chip mounted section and a plurality of lead sections. The semiconductor chip is mounted on the chip mounted section. The substrate is mounted on the chip mounted section. The chip parts are mounted on the substrate. Each of the chip parts has a first end portion and a second end portion in one direction, and each of the chip parts has a first electrode at the first end portion and a second electrode at the second end portion. Each of the wires couples the second electrode of one of the chip parts and one of the lead sections. The resin member covers the lead frame, the semiconductor chip, the substrate, the chip parts, and the wires. | 03-27-2014 |
20140105767 | POWER SUPPLY MODULE - A power supply module configured to supply power to a load having a first connector terminal includes a body, an insulating member, and a second connector terminal. The body includes a frame for power supply. The insulating member seals the body such that the frame is exposed from the insulating member. The second connector terminal is configured to be fitted with the first connector terminal and is bonded to the frame. | 04-17-2014 |
20150362392 | PRESSURE SENSOR AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a pressure sensor includes: preparing a stem which has a cylindrical shape with a bottom as a diaphragm; mounting a sensor chip on the diaphragm; preparing a conductive member, in which an internal connection region is integrated with an external connection region electrically connected to an external circuit by an outer frame; forming a first resin mold to couple the internal connection region to the external connection region; separating the outer frame from the internal connection region and the external connection region; arranging the internal connection region in the stem; and electrically connecting the sensor chip and the internal connection region through the first connection member. | 12-17-2015 |