Patent application number | Description | Published |
20080241759 | METHOD OF MANUFACTURING WIRING CIRCUIT BOARD - A conductor circuit ( | 10-02-2008 |
20090101394 | PHOTOSENSITIVE RESIN COMPOSITION AND FLEXIBLE PRINTED WIRING CIRCUT BOARD HAVING INSULATIVE COVER LAYER FORMED OF PHOTOSENSITIVE RESIN COMPOSITION - A photosensitive resin composition which is excellent in flame resistance, resolution and flexibility, and substantially free from deposition of components thereof to prevent contamination of a product. The photosensitive resin composition comprises: | 04-23-2009 |
20090149003 | DICING DIE-BONDING FILM - The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer ( | 06-11-2009 |
20100093155 | DICING/DIE-BONDING FILM, METHOD OF FIXING CHIPPED WORK AND SEMICONDUCTOR DEVICE - A dicing/die-bonding film including a pressure-sensitive adhesive layer ( | 04-15-2010 |
20100270060 | PHOTOSENSITIVE RESIN COMPOSITION, FLEXIBLE CIRCUIT BOARD EMPLOYING THE SAME, AND CIRCUIT BOARD PRODUCTION METHOD - A photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after the IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; and (D) a photopolymerization initiator. The photosensitive resin composition has a tensile breaking elongation percentage of not less than 10% and a 2% weight loss temperature of not lower than 260° C. after being cured. | 10-28-2010 |
20110030998 | PHOTOSENSITIVE RESIN COMPOSITION, FLEXIBLE CIRCUIT BOARD EMPLOYING THE SAME, AND CIRCUIT BOARD PRODUCTION METHOD - A halogen-free and flame-resistant photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after an IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; (D) a photopolymerization initiator; and a cyclic phosphazene (E) represented by the following general formula (1): | 02-10-2011 |
20110147952 | DICING DIE-BONDING FILM - The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer ( | 06-23-2011 |
20120067625 | SUSPENSION BOARD WITH A CIRCUIT FOR USE IN A HARD DISK DRIVE - A suspension board with a circuit for use in a hard disk drive shows a small change in PSA (attitude angle) relative to a change in humidity and can support a slider including a magnetic head in a stable and highly precise manner. The suspension board with a circuit for use in a hard disk drive includes a substrate made of metal, an undercoat insulating layer provided on the substrate made of metal, a conductive layer provided on the undercoat insulating layer | 03-22-2012 |
20120067626 | PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT BOARD WITH METAL SUPPORT USING THE SAME - A photosensitive resin composition contains a component (A) and at least one of a component (B) and a component (C). In addition, in the circuit board with metal support including: a metal support; a base insulating layer; a conductive layer formed of a wiring circuit pattern; and a cover insulating layer, at least one of the above-mentioned base insulating layer and cover insulating layer is made of the above-mentioned photosensitive resin composition.
| 03-22-2012 |
20120088333 | DICING/DIE-BONDING FILM, METHOD OF FIXING CHIPPED WORK AND SEMICONDUCTOR DEVICE - A dicing/die-bonding film including a pressure-sensitive adhesive layer ( | 04-12-2012 |
20120175151 | SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF - A suspension board with circuit includes a gimbal portion. The gimbal portion includes a tongue portion formed at the inner side of the opening for being mounted with a slider mounted with a magnetic head for being electrically connected to the conductive layer, an outrigger portion formed at the outer side of the opening to support the tongue portion, and a passing portion passing through the opening of the gimbal portion and/or an outer side region of the outrigger portion. The passing portion includes the conductive layer and the insulating layer covering the conductive layer. The thickness of a lower half portion of the insulating layer in the passing portion is the same as that of an upper half portion thereof. | 07-12-2012 |
20120211263 | WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF - A wired circuit board includes an insulating layer formed with an insulating opening extending through the insulating layer in a thickness direction, and a conductive pattern including a wire formed on the insulating layer and a terminal connected to the wire. The terminal includes a filling portion with which the insulating opening of the insulating layer is internally filled, a first projecting portion formed to continue to the filling portion and project from the filling portion on one side in the thickness direction, and a second projecting portion formed to continue to the filling portion and project from the filling portion on the other side in the thickness direction. | 08-23-2012 |
Patent application number | Description | Published |
20090100907 | GAS SENSOR - A gas sensor including a metal shell; a detection element main body held by the metal shell; a porous protection layer coated on a leading end portion of the detection element main body; and a protector including a side wall surrounding an element protruding portion of the detection element main body protruding from a leading end of the metal shell. The side wall has introduction holes formed therein which allow gas to be introduced. The porous protection layer includes a first portion; and a second portion provided on a base end side with respect to the first portion and having a progressively reduced thickness in a direction toward a leading end of the detection element. The second portion is disposed closer to the base end of the detection element than the introduction holes in the axial direction. | 04-23-2009 |
20120217160 | GAS SENSOR ELEMENT AND GAS SENSOR - There is provided a gas sensor element, including a solid electrolyte layer, a pair of sensor electrodes arranged on a front side of the solid electrolyte layer, a pair of sensor leads arranged on a rear side of the solid electrolyte layer and connected to the respective sensor electrodes; and insulating layers, one of which is arranged between one of the sensor leads and the solid electrolyte layer and the other of which is arranged between the other sensor lead and the solid electrolyte layer. The sensor electrodes have rear end portions located on the insulating layers and overlapping front end portions of the sensor leads, respectively. The sensor leads are denser than the sensor electrodes and have front ends located in the same positions as or positions rear of front ends of the insulating layers, respectively. There is also provided a gas sensor with such a gas sensor element. | 08-30-2012 |
20130074582 | GAS SENSOR - A gas sensor including a plate-shaped detecting element is disclosed, wherein the detecting element has a pair of principle surfaces and a pair of side surfaces adjacent to the pair of principle surfaces, in a radical direction thereof, wherein a first chamfered portion is provided between at least one first principal surface of the pair of principal surfaces and the rear end surface of the detecting element, and wherein the angle between a first axis ridgeline portion formed by the first principal surface and a first side surface that is one of the pair of side surfaces and extending in the direction of the axis, and a first width ridgeline formed by the first principal surface and the first chamfered portion and extending in a width direction is larger than 90°. | 03-28-2013 |
20130233708 | GAS SENSOR - A gas sensor element having a chamfered portion. The chamfered portion has a leading end chamfered portion formed in a leading end portion of the gas sensor element, a rear end chamfered portion formed in a rear end portion of the gas sensor element, and an intermediate chamfered portion linking the leading end chamfered portion and rear end chamfered portion. The chamfer angle of the rear end chamfered portion is formed so as to be larger than the chamfer angle of the leading end chamfered portion. | 09-12-2013 |
20150075254 | GAS SENSOR ELEMENT AND GAS SENSOR - A gas sensor element comprises an elongated plate-like element including, at a forward end portion, a detecting section comprising a solid electrolyte body having an outer surface and a back surface, a detection electrode on the outer surface and a reference electrode on the back surface, and a porous layer covering the detection electrode. The coating layer includes a first protection layer entirely covering the detecting section, and a second protection layer circumferentially covering the first protection layer and extending at least from a forward end of the first protection layer to a position located rearward of the porous layer. The thickness of the first protection layer on the porous layer is larger than that of the first protection layer rearward of the porous layer. The thickness of the second protection layer rearward of the porous layer is larger than that of the second protection layer above the porous layer. | 03-19-2015 |
20150114085 | GAS SENSOR ELEMENT, GAS SENSOR, AND METHOD OF MANUFACTURING GAS SENSOR ELEMENT - A gas sensor element has a protection layer smaller in heat capacity than a conventional protection layer formed by a dipping process. A gas sensor includes the gas sensor element. The gas sensor element is manufactured by a method of manufacturing. The gas sensor element includes at least one space formed between a protection layer and an element body. The space is positioned over at least one of four vertexes of a forward end of the element body at a location at which the thickness of the protection layer is likely to become small. Therefore, it is possible to restrain breakage of the vertexes of the forward end of the element body which could otherwise result from thermal shock stemming from adhesion of water. The protection layer of the gas sensor element can be reduced in thickness and thus in heat capacity as compared with a conventional protection layer. | 04-30-2015 |
20150114102 | GAS SENSOR ELEMENT, GAS SENSOR, AND METHOD OF MANUFACTURING GAS SENSOR ELEMENT - A gas sensor element in an air/fuel ratio sensor includes an element body and a protection layer having two layers (a first layer and a second layer). The gas sensor element has at least one separation portion in the form of a space between the first layer and the second layer. The gas sensor element can temporarily accumulate, in the at least one separation portion, water which adheres to the surface of the protection layer and penetrates into the protection layer. Thus, as compared with a protection layer which is identical in thickness to the protection layer, but does not have separation portions, water adhering to the protection layer is less likely to reach the element body. Therefore, there can be restrained breakage of an end of the element body which could otherwise result from thermal shock stemming from adhesion of water. | 04-30-2015 |
20150323492 | GAS SENSOR - A gas sensor element of an air/fuel ratio sensor includes a plurality of through holes formed in an insulating substrate at forward end regions of corresponding electrode pads to which the through holes are connected. In the gas sensor element, the through holes are not formed within the longitudinal rear end regions and center regions of the electrode pads. Since in each of the electrode pads, the region of the electrode pad other than its forward end region occupies a greater area than that of the forward end region, it is easy to bring connection terminals into contact with the regions of the electrode pads other than their forward end regions. Therefore, it is possible to prevent the connection terminals from coming into contact with the through holes, so as to thereby prevent occurrence of an electrical connection failure between the connection terminals and the electrode pads. | 11-12-2015 |