Patent application number | Description | Published |
20090259352 | TRACK TRANSPORTATION SYSTEM - The essential feature of the present invention is the provision of a track transportation system in which a vehicle runs on a predetermined track, being automatically steered, having a simplified and lightweight structure so as to surely ensure a safety, and to be capable of carrying out efficient and high-speed operation. The track transportation system according to the present invention incorporates a steering mechanism for automatic steering by means of an M actuator, a protection guide rail laid on the track, protection guide wheels which travel together with the vehicle along the protection guide rail without making contact with the latter, and a control means for controlling automatic steering in accordance with a result of determination by a track data determining means for determining a straight portion, a curved portion, a turnout portion or the like of the track in view of vehicle position data, and steering caused by the protection wheels making contact with the protection guide rail. | 10-15-2009 |
20090288575 | BOGIE STRUCTURE FOR A TRACK VEHICLE - The present invention provides the structure of a bogie for a vehicle in a track type transportation system in which the vehicle runs along a predetermined track, which can be simplified, and lightweight and which can be run at a high speed with the maintainability therefor being enhanced, comprising a guide rail | 11-26-2009 |
20090301342 | GUIDED VEHICLE TRANSPORTATION SYSTEM - A guided vehicle transportation system is provided with which toppling down of the vehicle is prevented even when strong lateral external force exerts on the vehicle. The fail-safe mechanism of the system is composed such that a guard rail | 12-10-2009 |
20100100267 | METHOD OF AND APPARATUS FOR CONTROLLING STEERING OF A VEHICLE - In a track type transportation system, there is provided an automatic steering mechanism with which a vehicle can be moved forward and backward, and which can carry our fine control so as to allow the positions of the centers of axles of the front and rear wheels to substantially follow up one and the same locus. Before starting, a pattern steering angle table on which pattern steering angles for the front and rear wheels at respective change points of the track are listed is prepared in view of a track condition, a running condition and a vehicle condition from a departure point to a destination point, the vehicle | 04-22-2010 |
20110114742 | STRUCTURE OF BIFURVATION AND CROSSOVER SITE OF GUIDEWAY IN GUIDED VEHICLE TRANSPORTATION SYSTEM - Structure of a bifurcation site and crossover site of a guideway in a guided vehicle transportation system; in which the guideway consists of left and right roadbeds, a depression between the roadbeds, and a guard rail having a U-shaped groove laid down on the depression; and a fail-safe mechanism is constituted by the guard rail and guard wheels attached to the vehicle; is proposed. The vehicle is equipped with automatic steering mechanisms for steering front and rear wheels and guard wheels supported laterally rotatably by front and rear supporting arms which are supported laterally rot at ably underside the vehicle. The guard wheels are received in the groove of the guard rail. A movable guard plate and driving means thereof are provided to switch connection of the groove of the guard rail at a bifurcation thereof, and a movable plate and driving means thereof are provided to be able to plug or cover each of openings of grooves of guard rails in a region where the guard rail crosses a roadbed so that the movable plate is moved to plug or cover the groove thereby preparing a flat surface level with the roadbed. | 05-19-2011 |
20110187317 | NON-CONTACT TYPE POWER FEEDER SYSTEM FOR MOBILE OBJECT - Provided is a noncontact type power feeder system for feeding an electric power to a mobile object, which enables a quick charge and transmission of a high electric power and in which a power feeder and a power receiver can be readily manufactured at low cost, comprising a power feeder arranged along a running road surface for the mobile object | 08-04-2011 |
Patent application number | Description | Published |
20080197509 | Semiconductor package having stacked semiconductor chips - A semiconductor package including: a package substrate on the surface of which plural connection terminals are provided; a semiconductor chip on the surface of which plural bonding pads are provided; plural bonding wires that connect between the plural connection terminals and the plural bonding pads; a resin formed to fill a gap between the bonding wires and the surface of the semiconductor chip; and a semiconductor chip provided on the bonding wires via a film-shaped resin, wherein at least three of the plural bonding wires are formed at substantially the same heights and higher than other bonding wires. | 08-21-2008 |
20090086522 | ADDRESS LINE WIRING STRUCTURE AND PRINTED WIRING BOARD HAVING SAME - An address signal line having a stub structure connects between at least three memory elements and a data transferring element and transmits address signals for the memory elements. An address terminal of the data transferring element has an impedance lower than a characteristic impedance of the address signal line. A wiring length TL | 04-02-2009 |
20090134506 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND FLEXIBLE SUBSTRATE FOR MOUNTING SEMICONDUCTOR - A semiconductor device includes a second semiconductor package, which includes a substrate and at least one semiconductor package. The substrate includes a terminal group formed on a surface thereof. At least one first semiconductor package is stacked on the substrate, and includes a plurality of flexible substrates, each of which includes a wiring group on a surface thereof and each of which is bending-deformable. At least one first semiconductor package includes a plurality of semiconductor elements mounted on a plurality of flexible substrates. Electric conduction through the second semiconductor package is established by connecting the wiring group on each of a plurality of flexible substrates to the terminal group on the substrate. Further, at least one terminal of the terminal group on the substrate is electrically connected to all of the plurality of semiconductor elements on at least one first semiconductor package, and at least one other terminal of the terminal group is electrically connected only to particular semiconductor elements of the plurality of semiconductor elements. | 05-28-2009 |
20090206492 | Semiconductor device - A semiconductor device includes a semiconductor chip, a first substrate, and a second substrate. The first substrate includes a plurality of wires and a plurality of first electrodes, each first electrode being connected with each wire. The second substrate includes the semiconductor chip that is mounted thereon, and a plurality of second electrodes with, each second electrode being connected with the each first electrode of the first substrate. The widths of the wires of the first substrate are different depending on the lengths of the wires. By changing the widths of the wires depending on their lengths, it is possible to reduce variation in stiffness of the electrodes and vicinities of electrodes, whereby variation in ultrasonic bonding strength can be reduced. | 08-20-2009 |
20100038767 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - The semiconductor device includes a stacked semiconductor package in which end portions of a plurality of flexible substrates have bonded portions which are connected together by wirings and in which a plurality of semiconductor packages are electrically connected to a mother substrate via the bonded portions. In at least a part of a region of portions of the plurality of flexible substrates that extends from the side surfaces of each of the semiconductor elements, and that is present between side surfaces of each of the semiconductor elements and the bonded portions of the flexible substrates, the plurality of flexible substrates have a curved portion, and the shape of the curved portion of at least one flexible substrate is different from the shape of a curved portion of another flexible substrate adjacent to this flexible substrate. | 02-18-2010 |
20100052133 | STACK TYPE SEMICONDUCTOR DEVICE WITH REINFORCING RESIN - A semiconductor device includes a plurality of semiconductor packages each with a semiconductor element and a flexible board. The flexible board is wider than the semiconductor element and is electrically connected to the semiconductor element. The plurality of semiconductor packages are stacked on one surface of a mother board. The semiconductor element is positioned between the flexible boards of the semiconductor packages in adjacent layers. The flexible boards in the adjacent layers are joined together at junction portions positioned at a part of the flexible boards which sticks out from an area in which the semiconductor elements and the flexible boards overlap. A reinforcing resin is provided in at least a part of the area between the flexible boards in the adjacent layers and between the junction portion of the flexible boards and the corresponding semiconductor element. The reinforcing resin contacts at least a part of the adjacent flexible board. | 03-04-2010 |
20110147945 | SEMICONDUCTOR DEVICE CAPABLE OF SUPPRESSING GENERATION OF CRACKS IN SEMICONDUCTOR CHIP DURING MANUFACTURING PROCESS - A semiconductor device includes a chip stacked body where a plurality of semiconductor chips are stacked, and penetration electrodes respectively formed in the semiconductor chips are electrically interconnected in stacking order of the semiconductor chips, a first support member that is disposed to face a first semiconductor chip formed in one end of the chip stacked body, and including electrodes electrically connected to the penetration electrodes of the first semiconductor chip, and a wiring board that is disposed to face a second semiconductor chip formed in an end opposed to the one end of the chip stacked body, and including external electrodes on a surface opposed to a surface facing the second semiconductor chip that is to be electrically connected to the penetration electrodes of the second semiconductor chip. | 06-23-2011 |
20110207322 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes, but is not limited to, the following processes. A seed layer is formed over a substrate. The seed layer includes first, second, and third portions. A first electrode covering the first portion of the seed layer is formed without forming an electrode on the second and third portions of the seed layer. The third portion of the seed layer is removed so that the first and second portions remain over the substrate, and the first and second portions are separated from each other. | 08-25-2011 |
20120127675 | APPARATUS HAVING A WIRING BOARD AND MEMORY DEVICES - An address signal line having a stub structure connects between at least three memory elements and a data transferring element and transmits address signals for the memory elements. An address terminal of the data transferring element has an impedance lower than a characteristic impedance of the address signal line. A wiring length TL | 05-24-2012 |
20120187402 | SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor chip having first and second surfaces. A first through electrode extends through the semiconductor chip. A first surface electrode is positioned on the first surface of the semiconductor chip and coupled to a first end of the first through electrode. A second surface electrode is positioned on the second surface of the semiconductor chip. The second surface electrode is coupled to a second end of the first through electrode. A second through electrode extends through the semiconductor chip and has third and fourth ends. A third surface electrode is positioned on the second surface of the semiconductor chip and is coupled to the fourth end of the second through electrode. The semiconductor device is free of a surface electrode on the first surface of the semiconductor chip and is coupled to the third end of the second through electrode. | 07-26-2012 |
20120313258 | SEMICONDUCTOR DEVICE HAVING THROUGH SILICON VIAS AND MANUFACTURING METHOD THEREOF - In The semiconductor device, a semiconductor substrate has first and second surfaces. A circuitry layer is formed over the first surface and a first insulating layer is further formed over the circuitry layer. A second insulating layer including a first insulating element is formed over the second surface. A third insulating layer including a second insulating element different from the first insulating element of the second insulating layer is formed over the second surface with an intervention of the second insulating layer therebetween. A penetration electrode penetrates through the semiconductor substrate, the circuitry layer, the first insulating layer, the second insulating layer and the third insulating layer. | 12-13-2012 |
20130000384 | MEASUREMENT SENSOR FOR MOLD INSIDE INFORMATION - Gas pressure in a cavity is detected with a rod-shaped casing that attaches to an hole that opens into the cavity. A porous filter whose top end face matches with a mold cavity face at a top end of the rod-shaped casing separates gas from melt. Cavity gas from an introduction chamber introduces gas through the porous filter, and a gas pressure sensor detects pressure in the chamber. Melt pressure in the cavity is detected with a pressure transmission rod inserted into the rod-shaped casing whose top end face matches with the mold cavity face, and a pressure sensor fixed and held facing a rear end of the pressure transmission rod detects the cavity melt pressure. Cavity melt temperature is detected with a temperature sensor attached to a thin hole formed at the pressure transmission rod's center and includes a thermocouple at a top end part side of the hole. | 01-03-2013 |
20140091656 | THREE-PHASE PERMANENT MAGNET TYPE MOTOR - A three-phase permanent magnet type motor has a stator in which a plurality of windings wound in a same direction are disposed, and the number of slots is 12n; a rotor in which the number of poles of the permanent magnet is 10n or 14n; and multilayer wiring boards for performing the connection so as to be 2m parallel. The three-phase permanent magnet type motor has a circuit configuration in which, among U-phase, V-phase, and W-phase, adjacent in-phase windings are connected in parallel and are connected in series with a like-pole winding of a symmetrical in-phase second winding group facing at 6-slot pitch angle, when a center of a first winding group of the adjacent in-phase windings is set as a reference axis, and in-phase transition wiring patterns are disposed on the same layer of the multilayer wiring boards in a line symmetrical manner. | 04-03-2014 |
20140299878 | SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR DEVICE - A semiconductor device includes a package substrate, and a stack of semiconductor chips over the package substrate, each of the semiconductor chips including first and second surfaces, each of the semiconductor chips including a first through electrode that extends through each of the semiconductor chips, a first surface electrode positioned on the first surface of each of the semiconductor chips, the first surface electrode being coupled to a first end of the first through electrode, a second surface electrode positioned on the second surface of each of the semiconductor chips, the second surface electrode being coupled to a second end of the first through electrode, a second through electrode that extends through each of the semiconductor chips, the second through electrode having third and fourth ends, and a third surface electrode positioned on the second surface of the first semiconductor chip. | 10-09-2014 |
20150374881 | HUMAN CORNEAL ENDOTHELIAL CELL SHEET - The present invention provides a human corneal endothelial cell sheet having a curvature fitting a human corneal endothelial surface, particularly, the human corneal endothelial cell sheet supported by a cell support having a curvature fitting a human corneal endothelial surface, and a production method of a human corneal endothelial cell sheet having a curvature fitting a human corneal endothelial surface, which includes the following steps:
| 12-31-2015 |
20160079207 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - [Problem] To provide a semiconductor device suitable for use as an upper-side package of a semiconductor device having a PoP structure. [Solution] This invention is provided with a semiconductor chip ( | 03-17-2016 |
Patent application number | Description | Published |
20090121678 | Feeder-Lineless Traffic System and Charging Method Therefor - Provided is a railway type feeder-lineless traffic system in which the weight of a vehicle is reduced while the structure of the vehicle is simplified, and it is possible to carry out a quick charge during a brief stopping time at a station or the like. A charging method in a feeder-lineless traffic system in which a vehicle mounted thereon with an electric storage unit runs on a predetermined pathway with the use of a power, and the electric storage unit in the vehicle is charged from a charger set up on the pathway, wherein a contact charging way in which a power feeder | 05-14-2009 |
20090195219 | BATTERY SOC ESTIMATION PROGRAM, WIRELESS TRANSIT SYSTEM, AND METHOD OF CHARGING THE BATTERY - Occurrence of overcharging and over discharging of batteries mounted on vehicles that travel on predetermined tracks in a wireless transit system is prevented by estimating SOC of the batteries with accuracy. The program in which an equivalent circuit of the battery is set such that the equivalent circuit is composed of three circuit elements connected in series, a first component resistance which is influenced by instantaneous current variation, a component circuit consisting of a capacitance and a second component resistance connected in parallel which is influenced by slow and excessive response, and a terminal voltage of the battery, runs the computer to calculate open circuit voltage of the equivalent circuit using a value of the first component resistance calculated from measurement of current and voltage of the battery and value of k(=the second component resistance/the first component resistance) and τ(=the capacitance×the second component resistance) which are constant values specific to the battery determined based on measurements, and to calculate state of charge of the battery from the open circuit voltage. | 08-06-2009 |
20100036553 | TRACK TYPE TRANSPORTATION SYSTEM - In a track type protection system comprising an automatic steering mechanism and a fail-safe mechanism, provided is a detection mechanism which can detect a deviated value of a vehicle, widthwise of a track, and which is highly reliable. The track type transportation system in which the vehicle runs on the road surface of the track, comprising the steering mechanism for automatically steering the front and rear wheels of the vehicle by means of actuators, and the fail-safe mechanism composed of a protection track defined on the road surface of the track, and protection wheels provided in the lower part of the vehicle and adapted to run in the protection track without making contact with the protection track, wherein there are provided a pair of noncontact type displacement meters | 02-11-2010 |
Patent application number | Description | Published |
20130163779 | SOUND OUTPUT DEVICE - A sound output device for masking an operation sound generated by equipment, having: an operation determining unit that determines an operation mode to be executed by the equipment; and a sound output unit that outputs a masking sound on the basis of the operation mode determined by the operation determining unit, the masking sound changing at least in sound pressure level over time. | 06-27-2013 |
20140140525 | SOUND OUTPUT DEVICE - A sound output device to be mounted in equipment, the device comprises: a memory unit configured to store correction information for at least one from among date, day and time; a sound reproducing unit configured to reproduce a sound signal representing an additional sound for an operation sound of the equipment, to read, from the memory unit, correction information corresponding to at least one of the current date, day, and time from the memory unit, and to then output a reproduced sound signal after correcting its sound pressure level in accordance with the correction information being read; and a sound output unit configured to emit the additional sound based on the sound signal outputted by the sound reproducing unit. | 05-22-2014 |
20150277372 | IMAGE FORMING APPARATUS - An image forming apparatus has: an exhaust air duct capable of forming a first air flow path for an exhaust air cleaning function and a second air flow path for a room air cleaning function, the exhaust air duct having a common use space used in common for the exhaust air cleaning function and the room air cleaning function; a switching member configured to switch a flow path in the exhaust air duct, depending on which of the cleaning functions is activated; a fan configured to discharge air from the common use space in an active state of the exhaust air cleaning function and in an active state of the room air cleaning function; and a control unit configured to control the switching member and to adjust a rotation speed of the fan, depending on which of the cleaning functions is activated. | 10-01-2015 |
20160004218 | IMAGE FORMING APPARATUS - An image forming apparatus having: an inside-air duct having a first inlet to an inside of the image forming apparatus; a first ventilator provided in the inside-air duct; an outside-air duct having a second inlet to an outside of the image forming apparatus; a common duct into which the inside-air duct and the outside-air duct are merged; a second ventilator provided in at least one of the outside-air duct and the common duct; a filter provided in the common duct; and a control section that retrieves information indicative of an flow rate in the inside-air duct and increases a pressure produced by the second ventilator based on the retrieved information such that an flow rate in the outside-air duct is substantially constant with respect to an increase of the flow rate in the inside-air duct. | 01-07-2016 |
20160077488 | IMAGE FORMING APPARATUS - An image forming apparatus has a function to clean exhaust air from inside and to discharge cleaned air. The image forming apparatus has an exhaust air duct configured to guide internal air to outside, and a cleaning filter configured to clean air passing through the exhaust air duct. A cubic measure of an airflow path in the exhaust air duct during normal operation has a first value, and the cubic measure of the airflow path in the exhaust air duct during operation causing a large amount of harmful matters to be contained in the exhaust air from inside has a second value greater than the first value. | 03-17-2016 |