Patent application number | Description | Published |
20090134010 | SPUTTERING APPARATUS AND SPUTTERING METHOD - A sputtering apparatus according to the present invention includes a substrate holding means for holding substrates and gas introducing routes having a plurality of gas jetting ports arranged at a plurality of places surrounding the substrates, and characterized in that at least one of the gas introducing routes is provided with a gas introduction connecting port, and the number of gas jetting ports provided in at least one of the gas introducing routes with the gas introduction connecting port is smaller than the number of gas jetting ports provided in the other gas introducing routes without the gas introduction connecting ports, or an aperture of each of the gas jetting ports provided in at least one of the gas introducing routes with the gas introduction connecting port is smaller than an aperture of each of the gas jetting ports provided in the other gas introducing routes without the gas introduction connecting ports. | 05-28-2009 |
20090134012 | SPUTTERING APPARATUS AND SPUTTERING METHOD - A gas introduction path intended for improving uniformity of the supply of a process gas is provided. A sputtering apparatus of the present invention has substrate holding means that holds a substrate and a gas introduction path, which has a plurality of gas spouts arranged in a closed curve in a plurality of positions surrounding the circumference of the substrate, and gas-introduction connections are provided in at least two positions substantially opposed to each other on the closed curve. Such two gas introduction paths are provided symmetrically with respect to the substrate on the front surface side and the rear surface side of the substrate. | 05-28-2009 |
20090169923 | SUBSTRATE PROCESSING USING THE VAPOR SUPPLYING APPARATUS - A vapor supplying apparatus comprises a holding unit for holding a liquid or solid substance; cooling means for cooling the holding unit; detection means for detecting the temperature of the holding unit; and a control means for controlling said cooling means based on the temperature detected by the detection means. The temperature of the holding unit is adjusted by using the cooling means under the control of the control means, thereby to control vaporization or sublimation of the liquid or solid substance in supplying a vapor of the substance. Means for measuring the pressure of the vapor vaporized or sublimated from the liquid or the solid substance is provided under the atmosphere in which the water supplying apparatus is placed, and the control means controls the temperature of the holding unit so that the pressure of the vapor becomes a predetermined value based on the measured pressure. | 07-02-2009 |
20100025363 | SUBSTRATE PROCESSING APPARATUS, AND MAGNETIC RECORDING MEDIUM MANUFACTURING METHOD - The present invention provides a substrate processing apparatus capable of suppressing mutual contamination and/or damage of the insides of ion beam generators arranged opposite each other via a substrate, and a magnetic recording medium manufacturing method. A substrate processing apparatus according to an embodiment of the present invention includes a first ion beam generator that applies an ion beam to one surface to be processed of a substrate W, and a second ion beam generator that applies an ion beam to another surface to be processed, which are arranged opposite each other via the substrate W, and an area of a first grid in the first ion beam generator, and an area of a second grid in the second ion beam generator, each area corresponding to an opening of the substrate W, are occluded. | 02-04-2010 |
20100028529 | SUBSTRATE PROCESSING APPARATUS, AND MAGNETIC RECORDING MEDIUM MANUFACTURING METHOD - The present invention provides a substrate processing apparatus capable of suppressing mutual contamination and/or damage of the insides of ion beam generators arranged opposite each other via a substrate, and a magnetic recording medium manufacturing method. A substrate processing apparatus according to an embodiment of the present invention includes a first ion beam generator that applies an ion beam to one surface to be processed of a substrate, and a second ion beam generator that applies an ion beam to another surface to be processed, which are arranged opposite each other via the substrate, and a first grid in the first ion beam generator, and a second grid in the second ion beam generator are configured so as to be asymmetrical to each other. | 02-04-2010 |
20100096568 | SUBSTRATE PROCESSING APPARATUS AND CLEANING METHOD OF THE SAME - A method for cleaning a substrate processing apparatus in which a first ion beam generator and a second ion beam generator are arranged opposite to each other to sandwich a plane on which a substrate is to be placed, and which processes two surfaces of the substrate, comprises steps of retreating the substrate from a position between the first ion beam generator and the second ion beam generator, and cleaning the second ion beam generator by emitting an ion beam from the first ion beam generator to the second ion beam generator. | 04-22-2010 |
20110168545 | MULTILAYER-FILM SPUTTERING APPARATUS AND METHOD OF FORMING MULTILAYER FILM - Provided is a sputtering apparatus which can form a multilayer film giving high productivity and with less spiral pattern by effective use of targets, and a method of forming multilayer film using the apparatus. An embodiment is a multilayer-film sputtering apparatus comprising: a rotatable cathode unit ( | 07-14-2011 |
20110192344 | FILM FORMING APPARATUS - The invention provides a multi-film forming apparatus including a substrate holder stock chamber for storing a plurality of substrate holders separately from a path in the multi-film forming apparatus, so that production can be performed without being affected by the process of removing a film accumulated on the surface of the substrate holder and the process of replacing the substrate holder, or by the process of removing a film accumulated on the surface of the substrate holder or the process of replacing the substrate holder, and hence high-throughput production is possible. A branch path is provided on the path of the multi-film forming apparatus, and a substrate holder stock chamber for storing a plurality of substrate holders which enables retrieval of the substrate holder from the path and feeding of the substrate holder to the path is provided. | 08-11-2011 |
20130133571 | FILM FORMING APPARATUS - The invention provides a multi-film forming apparatus including a substrate holder stock chamber for storing a plurality of substrate holders separately from a path in the multi-film forming apparatus, so that production can be performed without being affected by the process of removing a film accumulated on the surface of the substrate holder and the process of replacing the substrate holder, or by the process of removing a film accumulated on the surface of the substrate holder or the process of replacing the substrate holder, and hence high-throughput production is possible. A branch path is provided on the path of the multi-film forming apparatus, and a substrate holder stock chamber for storing a plurality of substrate holders which enables retrieval of the substrate holder from the path and feeding of the substrate holder to the path is provided. | 05-30-2013 |