| Patent application number | Description | Published |
|---|
| 20090311884 | CIRCUIT DEVICE, CIRCUIT DEVICE MANUFACTURING METHOD AND CONNECTING MEMBER - A circuit device which can form terminal portions at narrow pitches a manufacturing method of the circuit device, and a connecting member are provided. A circuit device | 12-17-2009 |
| 20100020497 | SUBSTRATE STRUCTURE - It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure | 01-28-2010 |
| 20100044100 | BOARD STRUCTURE AND ELECTRONIC DEVICE - A substrate structure whereby a resin part for coating a plurality of electronic components by one operation is given a shielding property and the mounting strength of electronic components with respect to the substrate is secured and an electronic device including the substrate structure are provided. | 02-25-2010 |
| 20110046113 | AMINE COMPOUND AND USE THEREOF - It is intended to provide novel amine compounds which are efficacious against diseases such as infection with HIV virus, rheumatism and cancer metastasis. Namely, amine compounds represented by the following general formula (1): | 02-24-2011 |
| Patent application number | Description | Published |
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| 20090215287 | Substrate Connecting Member and Connecting Structure - A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals. | 08-27-2009 |
| 20100008056 | STEREOSCOPIC ELECTRONIC CIRCUIT DEVICE, AND RELAY BOARD AND RELAY FRAME USED THEREIN - A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting. | 01-14-2010 |
| 20100155111 | MOUNTING STRUCTURE - A mounting structure of the present invention includes: electronic components, a first substrate on which the electronic components are mounted, a first resin for molding at least a part of a surface of the first substrate with the electronic components mounted on the surface, a second substrate on which the first substrate is mounted, connecting members for connecting the first substrate and the second substrate, and a flat reinforcing member disposed on the opposite surface of the second substrate from a surface on which the first substrate is mounted. The reinforcing member is disposed such that the longitudinal direction of the reinforcing member is arranged along the longitudinal direction of the first substrate. | 06-24-2010 |
| 20100167597 | ELECTRODE JUNCTION STRUCTURE AND MANUFACTURING METHOD THEREOF - The electrode junction structure includes: a glass substrate; a plurality of flexible substrates, in a planar view, arranged to cross over an edge of the glass substrate and arranged to have a space from each other along the edge; an adhesive for joining the glass substrate and each flexible substrate; and a sealing resin for covering junction portions between the glass substrate and each flexible substrate, wherein an edge of the sealing resin is formed so that the edge of the sealing resin has, in the planar view, a consecutive waveform portion in which a convex portion and a concave portion alternate with an imaginary line as a center axis, the imaginary line being parallel to the edge of the glass substrate and locating outer than the edge of the glass substrate, and wherein the convex portions are formed to be located on the flexible substrates. | 07-01-2010 |
| 20100187675 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - This semiconductor device is a semiconductor device in which a semiconductor element is flip-chip mounted onto a circuit substrate and the semiconductor element is covered and sealed with a sealing resin. A recess portion is formed in the sealing resin on a surface opposite to the mounting surface of the semiconductor element. Warping of the semiconductor device is reduced by the action of this recess portion. | 07-29-2010 |
| 20100207264 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MOUNTED STRUCTURE - A module substrate has an interconnection electrode that is exposed at a side end face thereof. A semiconductor component including an IC chip is mounted on the module substrate. A molded part comprising a resin is formed so as to cover at least a part of the semiconductor component. A coating with higher heat conductivity than the molded part is formed on the surface of the molded part by applying a paste made of material with higher heat conductivity than the molded part. This improves heat dissipation. The coating can be formed such that it extends to the surface of the main substrate on which the module substrate with the semiconductor component is mounted and comes into contact with the interconnection electrode on the surface of the main substrate. This further improves heat dissipation. | 08-19-2010 |
