Patent application number | Description | Published |
20090294912 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device wherein destruction of a sealing ring caused by cracking of an interlayer dielectric film is difficult to occur, as well as a method for manufacturing the semiconductor device, are provided. A first laminate comprises first interlayer dielectric films having a first mechanical strength. A second laminate comprises second interlayer dielectric films having a mechanical strength higher than the first mechanical strength. A first region includes first metallic layers and vias provided within the first laminate. A second region includes second metallic layers and vias provided within the second laminate. When seen in plan, the second region overlaps at least a part of the first region, is not coupled with the first region by vias, and sandwiches the second interlayer dielectric film between it and the first region. | 12-03-2009 |
20100151673 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - To provide a semiconductor device having a structure in which a barrier metal film containing nitrogen is formed in a connection surface between a copper alloy wiring and a via, in which the electric resistance between the copper alloy wiring and the via can be prevented from rising, and the electric resistance can be prevented from varying. A semiconductor device according to the present invention comprises a first copper alloy wiring, a via and a first barrier metal film. The first copper alloy wiring is formed in an interlayer insulation film and contains a predetermined additive element in a main component Cu. The via is formed in an interlayer insulation film and electrically connected to the upper surface of the first copper alloy wiring. The first barrier metal film is formed so as to be in contact with the first copper alloy wiring in the connection part between the first copper alloy wiring and the via and contains nitrogen. The predetermined additive element reacts with nitrogen to form a high-resistance part. In addition, the concentration of the predetermined additive element is not more than 0.04 wt %. | 06-17-2010 |
20100261334 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device wherein destruction of a sealing ring caused by cracking of an interlayer dielectric film is difficult to occur, as well as a method for manufacturing the semiconductor device, are provided. A first laminate comprises first interlayer dielectric films having a first mechanical strength. A second laminate comprises second interlayer dielectric films having a mechanical strength higher than the first mechanical strength. A first region includes first metallic layers and vias provided within the first laminate. A second region includes second metallic layers and vias provided within the second laminate. When seen in plan, the second region overlaps at least a part of the first region, is not coupled with the first region by vias, and sandwiches the second interlayer dielectric film between it and the first region. | 10-14-2010 |
20100327449 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - To provide a semiconductor device having a structure in which a barrier metal film containing nitrogen is formed in a connection surface between a copper alloy wiring and a via, in which the electric resistance between the copper alloy wiring and the via can be prevented from rising, and the electric resistance can be prevented from varying. A semiconductor device according to the present invention comprises a first copper alloy wiring, a via and a first barrier metal film. The first copper alloy wiring is formed in an interlayer insulation film and contains a predetermined additive element in a main component Cu. The via is formed in an interlayer insulation film and electrically connected to the upper surface of the first copper alloy wiring. The first barrier metal film is formed so as to be in contact with the first copper alloy wiring in the connection part between the first copper alloy wiring and the via and contains nitrogen. The predetermined additive element reacts with nitrogen to form a high-resistance part. In addition, the concentration of the predetermined additive element is not more than 0.04 wt %. | 12-30-2010 |
20110266657 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device wherein destruction of a sealing ring caused by cracking of an interlayer dielectric film is difficult to occur, as well as a method for manufacturing the semiconductor device, are provided. A first laminate comprises first interlayer dielectric films having a first mechanical strength. A second laminate comprises second interlayer dielectric films having a mechanical strength higher than the first mechanical strength. A first region includes first metallic layers and vias provided within the first laminate. A second region includes second metallic layers and vias provided within the second laminate. When seen in plan, the second region overlaps at least a part of the first region, is not coupled with the first region by vias, and sandwiches the second interlayer dielectric film between it and the first region. | 11-03-2011 |
20120267793 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device wherein destruction of a sealing ring caused by cracking of an interlayer dielectric film is difficult to occur, as well as a method for manufacturing the semiconductor device, are provided. A first laminate comprises first interlayer dielectric films having a first mechanical strength. A second laminate comprises second interlayer dielectric films having a mechanical strength higher than the first mechanical strength. A first region includes first metallic layers and vias provided within the first laminate. A second region includes second metallic layers and vias provided within the second laminate. When seen in plan, the second region overlaps at least a part of the first region, is not coupled with the first region by vias, and sandwiches the second interlayer dielectric film between it and the first region. | 10-25-2012 |
20140130596 | ANGULAR VELOCITY DETECTION DEVICE - The purpose of the present invention is to achieve accurate angular velocity detection even when an angular velocity detection sensor is set in an environment in which oscillation and electromagnetic noise have significant influence. Provided is an angular velocity detection device which has an oscillating body displaceable in first and second directions that are perpendicular to each other, and which detects, as an angular velocity, a displacement of the oscillating body in the second direction while the oscillating body is being oscillated in the first direction, wherein in accordance with a frequency change in a drive signal for oscillating the oscillating body in the first direction, the frequency of a servo signal for detecting the angular velocity from the quantity of displacement in the second direction is changed (see | 05-15-2014 |
20140159174 | FLOWMETER - A flowmeter that improves a corrosion resistance is provided. | 06-12-2014 |
20140167781 | SENSOR DEVICE - An objective of the present invention is to provide a sensor device with an increased accuracy. In order to achieve the objective, provided is a sensor device includes: an external terminal | 06-19-2014 |
20140326064 | Thermal Type Flowmeter - Provided is a thermal type flowmeter in which contamination of a sensor element is reduced. The flowmeter includes a sensor element including a heating resistor formed in a thin film part, the thin film part being provided on a diaphragm formed on a substrate; a support member to locate the sensor element thereon; a secondary channel that includes part of the support member and takes in part of intake air flowing through an air intake pipeline; and a guide member provided on the support member or the sensor element that lies on a line L that extends along an air flow in the secondary channel and passing over the thin film part, the guide member allowing fine particles to be guided in a direction away from the line L, the fine particles coming together with an air flow along the surface of the support member or the sensor element. | 11-06-2014 |
20140360262 | Flow Rate Measuring Device - A flow rate measuring device with high precision is provided. | 12-11-2014 |
20150260765 | Sensor Device - In a related art sensor device, an output voltage of the sensor device is fixed not to a power supply voltage or a ground potential but to an intermediate potential upon disconnection of a power supply line or a ground line. A sensor device | 09-17-2015 |
20150300858 | THERMAL FLOW METER - In configurations in which a circuit element is connected in parallel with a resistor, it is difficult to detect a break in the two wires. A thermal flow meter includes a heating element and a temperature controlling bridge circuit that is formed of a plurality of resistors and controls the temperature of the heating element. The thermal flow meter includes: a circuit element connected in parallel with at least one resistor configuring the temperature controlling bridge circuit through two wires drawn from both ends of the resistor; a voltage detection circuit that detects that the magnitude of voltage produced between the two wires has become smaller than a first predetermined value; and a fault signal output circuit that, when it is detected at the voltage detection circuit that the. magnitude of the voltage has become smaller than the first predetermined value, outputs a signal indicating a fault. | 10-22-2015 |
20150377676 | Fluid Measurement Device - There is provided a fluid measurement device that is high in measurement precision. The fluid measurement device has a circuit unit into which a first signal S | 12-31-2015 |
20160003686 | INTAKE AIR TEMPERATURE SENSOR AND FLOW MEASUREMENT DEVICE - An object of the present invention is to provide a compact and highly accurate intake air temperature sensor by integrating a fixed resistor, connected in series to a temperature sensing element, into an integrated circuit and dispensing with a reference resistor or a changeover switch for connecting the fixed resistor to this reference resistor. The intake air temperature sensor has a temperature sensing element whose resistance value varies with the intake temperature; an integrated circuit electrically connected to the temperature sensing element; a resistive element connected in series to the temperature sensing element; a writable memory that stores correction information corresponding to the resistance value of the resistive element; and a correction processing unit that corrects errors based on the resistance value of the resistive element, which are included in output signals of the temperature sensing element, on the basis of the correction information stored in the writable memory. | 01-07-2016 |
Patent application number | Description | Published |
20090292183 | BIOLOGICAL INFORMATION, ACQUISITION METHOD AND INSTRUMENT, AND PHYSIOLOGICALLY-ACTIVE SUBSTANCE MEASUREMENT METHOD AND INSTRUMENT - A biological information acquisition method for acquiring information on a living body on a basis of a quantified value of a physiologically active substance originated from the living body, includes a step of collecting the physiologically active substance from a body surface of the living body. | 11-26-2009 |
20100210458 | BIOMICROMOLECULE-SEPARATING, MONOLITHIC SILICA COLUMN AND ITS PRODUCTION PROCESS, AND SEPARATION METHOD OF BIOMICROMOLECULES - A biomicromolecule-separating, monolithic silica column having a silica matrix and pores formed in the silica matrix, the silica matrix and pores have been modified at surfaces thereof with a polymer, which is obtainable by polymerization of a monomer composition including a phosphorylcholine-analogous-group-containing monomer represented by the following formula (1): | 08-19-2010 |
20120032323 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A preferred aim of the invention is to provide technique for improving reliability of semiconductor devices when using a low-dielectric-constant film having a lower dielectric constant than a silicon oxide film to a part of an interlayer insulating film. More specifically, to achieve the preferred aim, an interlayer insulating film IL | 02-09-2012 |
20120046529 | PHYSIOLOGICALLY ACTIVE SUBSTANCE COLLECTING DEVICE - A physiologically active substance collecting device, includes: a collecting section brought into contact with a body surface of a living organism to acquire a physiologically active substance from the body surface; and a liquid sending means for sending a solvent to the collecting section, the collecting section having an aperture at which the solvent flown by being sent from the liquid sending means contacts the body surface. | 02-23-2012 |
20120058496 | PHYSIOLOGICALLY ACTIVE SUBSTANCE COLLECTING DEVICE AND BIOLOGICAL INFORMATION ACQUISITION METHOD - A physiologically active substance collecting device, includes: a collecting section brought into contact with a body surface of a living organism to acquire a physiologically active substance from the body surface; and a liquid sending means for sending a solvent to the collecting section, the collecting section having an aperture at which the solvent flown by being sent from the liquid sending means contacts the body surface. | 03-08-2012 |
20130078651 | INDIVIDUAL INFORMATION DETERMINING METHOD, INDIVIDUAL INFORMATION DETERMINING DEVICE, ELECTRONIC APPARATUS, AND INDIVIDUAL INFORMATION DETERMINING PROGRAM - Disclosed in an individual information determining method in which individual information of a subject is determined based on one or a plurality of pieces of biomolecule data collected from a surface of a body surface of the subject. | 03-28-2013 |
20130102062 | MICROCHIP FOR NUCLEIC ACID AMPLIFICATION REACTION AND METHOD OF PRODUCING THE SAME - Provided is a microchip for a nucleic acid amplification reaction, including a well configured to function as a reaction site of the nucleic acid amplification reaction, and the well has a center portion and a marginal portion, a substance anchored in a form that the substance is eccentrically-located less at the center portion and much at the marginal portion of the well, in which the substance is at least a part of a substance for the nucleic and amplification reaction. | 04-25-2013 |
20130153424 | MICROCHIP - Provided is a microchip, including independently an introduction area inside having a pressure negative to atmospheric pressure and into which a liquid is injected by puncturing, and a degassing area inside having a pressure negative to atmospheric pressure for degassing a cavity of a hollow tube that punctures the introduction area for injecting the liquid. | 06-20-2013 |
20140134077 | SAMPLE LIQUID INJECTION TOOL AND SAMPLE LIQUID HEAT TREATMENT APPARATUS - There is provided a sample liquid injection tool including a reservoir section configured to store a sample liquid, a channel having one end protruding from an outer surface and configured to discharge the sample liquid therein from a protrusion end to an outside, and a heating unit and a filter installed between the reservoir section and the channel to enable passage of the liquid. | 05-15-2014 |
20140284790 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device in which reliability of a bonding pad to which a conductive wire is bonded is achieved. A bonding pad having an OPM structure is formed of an Al—Cu alloy film having a Cu concentration of 2 wt % or more. By increasing the Cu concentration, the Al—Cu alloy film forming the bonding pad is hardened. Therefore, the bonding pad is difficult to be deformed by impact in bonding of a Cu wire, and deformation of an OPM film as following the deformation of the bonding pad can be reduced. In this manner, concentration of a stress on the OPM film caused by the impact from the Cu wire can be reduced, and therefore, the breakage of the OPM film can be prevented. | 09-25-2014 |
20140311910 | MICROCHIP AND METHOD OF MANUFACTURING MICROCHIP - Provided is a microchip including: an inlet part to which a liquid is injected; a plurality of analysis areas to which the liquid is supplied from the inlet part; and a flow channel which is formed to supply the liquid to the plurality of analysis areas at the same time. | 10-23-2014 |
20150017318 | METHOD FOR FABRICATING MICROCHIP FOR NUCLEIC ACID AMPLIFICATION REACTION - Provided is a method for fabricating a microchip for nucleic acid amplification reaction that is capable of simple and highly accurate analysis. Provided is a method for fabricating a microchip for nucleic acid amplification reaction, the method including a solidification step of drying a reagent solution including at least a part of substances required for a nucleic acid amplification reaction, and a containment step of arranging the reagent solution including the solidified substance in wells that serve as a reaction site for a nucleic acid amplification reaction. In the microchip for nucleic acid amplification reaction fabricated by the fabrication method, since substances required for the nucleic acid amplification reaction are contained by being solidified, non-specific amplification is suppressed in a nucleic acid amplification reaction, which enables highly accurate analysis. | 01-15-2015 |
20150139866 | MICROCHIP - Provided is a microchip which enables to easily confirm, from the outside of the microchip, filling of a solution into an analysis region. | 05-21-2015 |
20150313524 | BIOLOGICAL INFORMATION ACQUISITION METHOD AND INSTRUMENT, AND PHYSIOLOGICALLY-ACTIVE SUBSTANCE MEASUREMENT METHOD AND INSTRUMENT - A biological information acquisition method for acquiring information on a living body on a basis of a quantified value of a physiologically active substance originated from the living body, includes a step of collecting the physiologically active substance from a body surface of the living body. | 11-05-2015 |