Patent application number | Description | Published |
20080236639 | SUBSTRATE TREATING APPARATUS - A substrate treating apparatus for treating substrates with a treating liquid includes a treating tank having an inner tank for storing the treating liquid, and an outer tank for collecting the treating liquid overflowing the inner tank. A supply pipe interconnects the inner tank and the outer tank for circulating the treating liquid. A first branch pipe is shunted from the supply pipe, and a separator is mounted on the first branch pipe for separating deionized water and a solvent in the treating liquid, and discharging the deionized water. A second branch pipe interconnects positions upstream and downstream of the separator, and a deionized water remover is mounted on the second branch pipe for adsorbing and removing deionized water from the treating liquid. An injection pipe is connected to the supply pipe for injecting deionized water in a position downstream of the separator. A solvent injector injects the solvent into the injection pipe. A controller carries out a deionized water cleaning process for supplying deionized water from the injection pipe and cleaning the substrates inside the cleaning tank with deionized water, then a replacing process for injecting the solvent from the solvent injector and replacing the deionized water with the solvent, a separating and removing process for switching to the first branch pipe and causing the separator to remove the deionized water from the treating liquid, and an adsorbing and removing process for switching to the second branch pipe and causing the deionized water remover to adsorb and remove the deionized water from the treating liquid. | 10-02-2008 |
20090084405 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD - A substrate treating apparatus for drying substrates in a solvent atmosphere after treating the substrates with a treating liquid. The apparatus includes a treating tank for storing the treating liquid, a holding mechanism for holding the substrates, the holding mechanism being movable at least between a treating position in the treating tank and a drying position above the treating tank, a chamber enclosing the treating tank, a solvent vapor supply device for supplying solvent vapor into the chamber, a concentration measuring device for measuring solvent concentration in the chamber, and an exhaust device for exhausting gas from the chamber. A controller causes the exhaust device to decompress an interior of the chamber, and causes the solvent vapor supply device to supply the solvent vapor into the chamber, after treating the substrates in the treating position in the treating tank with deionized water serving as the treating liquid. The controller also causes the exhaust device to decompress the interior of the chamber again when, with the substrates placed in the drying position, the solvent concentration has reached a predetermined value. | 04-02-2009 |
20090087566 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD - A substrate treating apparatus for treating substrates with treating liquids includes a treating tank for storing the treating liquids and receiving the substrates, a holding mechanism movable, while holding the substrates, between a treating position inside the treating tank and an upper position above the treating tank, a first supply device for supplying deionized water into the treating tank, a second supply device for supplying a water-soluble organic solvent in liquid form into the treating tank, a third supply device for supplying a water-insoluble organic solvent in liquid form into the treating tank, and a controller. With the holding mechanism having moved the substrates to the treating position, the controller carries out a deionized water cleaning process to clean the substrates by supplying the deionized water from the first supply device into the treating tank, treats the substrates with the water-soluble organic solvent by supplying the water-soluble organic solvent from the second supply device into the treating tank to replace the deionized water in the treating tank with the water-soluble organic solvent, treats the substrates with a mixture of the water-soluble organic solvent and water-insoluble organic solvent by supplying the water-soluble organic solvent from the second supply device into the treating tank and supplying the water-insoluble organic solvent from the third supply device into the treating tank, and thereafter moves the holding mechanism to the upper position. | 04-02-2009 |
20090117395 | POLYESTER LAMINATED FILM AND TRANSFER FOIL - A polyester laminated film includes at least a polyester layer, a highly crystalline polyester layer made of a highly crystalline polyester having a crystallinity parameter ΔTcg of 35° C. or lower, and a release layer laminated in that order, wherein the contact angle between the surface of the release layer and water in an atmosphere at room temperature of 23° C. and humidity of 65% is 85° or more. The polyester laminated film satisfies mold releasability, printability and thermoformability aspects, and is also excellent in cost performance. | 05-07-2009 |
20090123697 | Biaxially Oriented Polyester Film and Metallic Laminated Film - A biaxially oriented polyester film includes at least three polyester resin layers A1/B/A2, and has a melting point in the range of 246 to 270° C. The major component of the layer A is polyethylene terephthalate and the stress at 100% elongation in the film's longitudinal direction and width direction at 150° C. and 200° C. meets the following equations: 2≧(F100 | 05-14-2009 |
20090123756 | MATTE MULTILAYER POLYESTER FILM - A matt multiplayer polyester film includes at least to layers A and B, wherein the polyester of the layer A is a polyester with a glass transition temperature TgA of 30 to 70° C. consisting of (a) 60 to 95 wt % of a polyester and (b) 5 to 40 wt % of an incompatible resin, while the main one of the polyesters of the layer B is a copolyester with a melting point TmB of 120 to 210° C., the surface glossiness of the layer A being less than 50%. | 05-14-2009 |
20090169844 | POLYLACTIC ACID-BASED RESIN LAMINATE SHEET AND MOLDED PRODUCT THEREFROM - The polylactic acid-based resin laminate sheet is a laminate sheet including Layer A and Layer B of a polylactic acid-based resin composition, and the Layer A and the Layer B contain poly(meth)acrylate in a specified amount. The laminate sheet is excellent in transparency and heat resistance and, in addition, provides a polylactic acid-based resin laminate sheet capable of obtaining a molded product of high biobased content therefrom. | 07-02-2009 |
20090171065 | POLYETHER-POLYLACTIC ACID COMPOSITION AND POLYLACTIC ACID FILM CONTAINING SAME - A polyether-polylactic acid composition is excellent in storage stability, melt stability and hue. The polyether-polylactic acid composition includes a polyether and polylactic acid component and has a residual lactide content is 0.3 wt % or less, and an acid value is 50 equivalent/t or less. | 07-02-2009 |
20090207490 | Retardation film and polyester resin for optical use - The present invention relates to a retardation film using polyester having a photoelastic coefficient of −40×10 | 08-20-2009 |
20100167016 | POLYESTER FILM FOR MOLDED PART - A polyester film for molded part having low strain stress in processing, thermoforming in a target shape is easy and appearance is excellent even when a metallic thin membrane is provided. A polyester film for molded part includes a film having a polyester resin composition mixed with a resin (A) of polyethylene terephthalate and a resin (B) of polyester selected from the group consisting of a polybutylene terephthalate resin and a polytrimethylene terephthalate resin where a resin (A) is 10 to 90% by mass and a resin (B) is 90 to 10% by mass based on the total of resin (A) and resin (B), wherein the resin (B) of polyester comprises a resin (B1) of polybutylene terephthalate and a resin (B2) of polytrimethylene terephthalate being mixed such that a resin (B1) is 10 to 90% by mass and a resin (B2) is 90 to 10% by mass based on the total of resin (B1) and resin (B2), and a ratio (D/H) of a half bandwidth D (° C.) of a recrystallization peak in falling temperature by differential scanning calorimeter (DSC) to the peak height H (mW) is 3 to 150° C./mW. | 07-01-2010 |
20110000763 | Conveyor Device for Analyzer, Analyzer, Analyzing System, and Connector for Conveyor Device - A conveyor device | 01-06-2011 |
20110303242 | SUBSTRATE TREATING METHOD - A substrate treating method for treating substrates with a treating liquid includes a deionized water cleaning step for supplying deionized water from an injection pipe and cleaning the substrates inside a cleaning tank with deionized water, then a replacing step for injecting a solvent from a solvent injector and replacing the deionized water with the solvent, a separating and removing step for switching a channel to a branch pipe and causing a separator to remove the deionized water from the treating liquid, and an adsorbing and removing step for switching the channel to another branch pipe and causing a deionized water remover to adsorb and remove the deionized water from the treating liquid. | 12-15-2011 |
20120045581 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A hydrophobizing agent is supplied to a substrate and a surface of the substrate is hydrophobized. Thereafter, the substrate is dried. The substrate to be processed is maintained in a state of not contacting water until it is dried after being hydrophobized. Collapse of a pattern formed on the substrate surface is thereby suppressed or prevented. | 02-23-2012 |
20120100370 | POLYESTER LAMINATED FILM AND TRANSFER FOIL - A polyester laminated film includes at least a polyester layer, and a highly crystalline polyester layer including a highly crystalline polyester having a crystallinity parameter ΔTcg of 35° C. or lower, wherein both the polyester layer and the highly crystalline polyester layer have a planar orientation coefficient of 0.00 to 0.03. | 04-26-2012 |
20130014785 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSAANM KIMURA; MasahiroAACI KyotoAACO JPAAGP KIMURA; Masahiro Kyoto JPAANM OTSUJI; MasayukiAACI KyotoAACO JPAAGP OTSUJI; Masayuki Kyoto JP - A substrate processing method includes a removing step of removing unwanted matter from a substrate and a vaporizing step performed in parallel to the removing step. In the removing step, an HF vapor that contains hydrogen fluoride and a solvent vapor that contains a solvent capable of dissolving water and having a lower boiling point than water is supplied onto the substrate to etch and remove the unwanted matter. In the vaporizing step, the solvent on the substrate is vaporized. | 01-17-2013 |
20140199852 | PATTERN FORMING METHOD - A pattern forming method is provided for forming a pattern of a multilayer film including insulative films and electrically conductive films stacked together and having a hole formed therein on a substrate with the electrically conductive film being selectively accurately indented from an inner peripheral surface of the hole. The pattern forming method includes the steps of: alternately stacking at least two insulative films and at least two polysilicon films on a substrate to form a multilayer film including the at least two insulative films and the at least two polysilicon films; forming a hole extending through the at least two insulative films and the at least two polysilicon films in the multilayer film; and selectively etching the polysilicon films from a side wall of the hole through isotropic etching by feeding into the hole an etching gas prepared by diluting fluorine-containing halogen gas with an inert gas. | 07-17-2014 |
20140283882 | SUBSTRATE PROCESSING METHOD - A hydrophobizing agent is supplied to a substrate and a surface of the substrate is hydrophobized. Thereafter, the substrate is dried. The substrate to be processed is maintained in a state of not contacting water until it is dried after being hydrophobized. Collapse of a pattern formed on the substrate surface is thereby suppressed or prevented. | 09-25-2014 |
20150020968 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus of the present invention comprises a cooling mechanism for cooling a processing solution and a filter for removing impurities contained in the processing solution, at some midpoint in a circulation path of the processing solution. With this constitution, the substrate processing apparatus can precipitate the impurities dissolved in the processing solution and remove the precipitated impurities. It therefore becomes possible to maintain the performance of the processing solution and reuse the processing solution. Further, the frequency of changing the processing solution to a new solution decreases, and this causes an increase in availability of the substrate processing apparatus and a decrease in consumption and drainage of the processing solution. | 01-22-2015 |