| Patent application number | Description | Published |
|---|
| 20080210065 | Method For Cutting Lead Terminal Of Packaged Electronic Component - A method for cutting a lead terminal of a packaged electronic component including a resin package ( | 09-04-2008 |
| 20080237627 | Semiconductor light-emitting device - A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region. | 10-02-2008 |
| 20080303045 | Semiconductor light emitting device - A semiconductor light emitting device includes a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead. The resin package includes a lens facing the semiconductor light emitting element. The lead includes an exposed portion that is not covered by the resin package. The exposed portion includes a first portion and a second portion, where the first portion has a first mount surface oriented backward along the optical axis of the lens, and the second portion has a second mount surface oriented perpendicularly to the optical axis of the lens. | 12-11-2008 |
| 20100044737 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device (A) includes a lead frame ( | 02-25-2010 |
| 20100072496 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device (A | 03-25-2010 |
| 20100171730 | DISPLAY - A display (A) includes a light source unit ( | 07-08-2010 |
| 20100276808 | SURFACE MOUNTING ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - The electric component includes at least a set of electrode terminals | 11-04-2010 |
| 20110042710 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region. | 02-24-2011 |
