| Patent application number | Description | Published |
|---|
| 20080203101 | Gas storage tank and method of manufacturing the same - The technique of the invention manufactures a gas storage tank, which includes a gas absorbent/adsorbent and is capable of storing a high-pressure gas. The manufacturing process of a hydrogen storage tank first assembles a heat exchanger unit and packs the particles of hydrogen storage alloy into the heat exchanger unit. The manufacturing process then blocks hydrogen storage alloy filling holes used for packing the hydrogen storage alloy in the heat exchanger unit and attaches a detachable cover member to a hydrogen inlet. The manufacturing process subsequently locates the heat exchange unit filled with the hydrogen storage alloy in a cylindrical tank and narrows both ends of the tank to form joint openings. The manufacturing process then heat-treating the tank under water cooling and detaches the cover member. The manufacturing process attaches joint assemblies to the joint openings and forms a reinforcement layer around the outer circumference of the tank to complete the hydrogen storage tank. | 08-28-2008 |
| 20090134204 | Soldering Method and Semiconductor Module Manufacturing Method - A soldering method for soldering a semiconductor element to each of bonding portions defined at a plurality of locations on a circuit board is disclosed. The soldering method includes laying out the bonding portions in a non-linear manner in at least three locations on the circuit board, placing the semiconductor elements on the bonding portions with solder in between, placing a weight on the at least three semiconductor elements, which are laid out in a non-linear manner, so that the weight extends over the semiconductor elements, and soldering the semiconductor elements to the bonding portions by melting the solder while pressurizing the semiconductor elements with the weight. This reduces variations in thickness of the solder at the plurality of bonding portions when soldering the plurality of semiconductor elements to the circuit board. | 05-28-2009 |
| 20090134205 | Soldering Method, Method for Manufacturing Semiconductor Module, and Soldering Apparatus - A soldering method for soldering an electronic component to a circuit board is disclosed. The soldering method includes placing the electronic component on the bonding portion of the circuit board with solder arranged between the electronic component and the bonding portion, placing a weight on the electronic component, and heating and melting the solder while pressing the electronic component toward the circuit board with the weight. The weight is spaced from the electronic component while the temperature of the solder is still high after the melted solder wets the bonding portion and the bonding surface of the electronic component and spreads out therebetween. | 05-28-2009 |
| 20090184152 | Soldering Method, Semiconductor Module Manufacturing Method, and Soldering Apparatus - A soldering method for soldering an electronic component onto a circuit board is provided. The soldering method uses a cooling circuit board as the circuit board. The cooling circuit board includes an insulation substrate and a metal heat sink. The insulation substrate has a front surface with a metal circuit and a rear surface to which the heat sink is fixed. The heat sink has a refrigerant passage. The electronic component is arranged on the metal circuit with solder in between. A heated heating medium is supplied to the refrigerant passage when heating and melting the solder. | 07-23-2009 |
| 20090218386 | Soldering Method, Soldering Apparatus and Method for Manufacturing Semiconductor Device - An object-to-be-soldered ( | 09-03-2009 |
| 20090266811 | Soldering Apparatus and Soldering Method - A soldering apparatus has a sealable container which accommodates a circuit board therein, weights disposed immediately upon semiconductor devices to press the semiconductor devices toward the circuit board, and high-frequency heating coils causing the weight to generate heat due to electromagnetic induction. The high-frequency heating coils are disposed away from the weights. The heat generated in each weight is applied to a plurality of joint sites of the circuit board, thereby soldering the semiconductor devices to the joint sites. As a result, efficient heating is realized while simplifying the configuration of the apparatus. | 10-29-2009 |
| 20090275174 | Soldering Container and Production Method of Semiconductor Device - A soldering container configured to be conveyed by a conveyance mechanism during soldering in a state accommodating a soldering subject. The container includes a sealable container body for accommodating the soldering subject. The container body includes at least one communication passage enabling communication between the inside and outside of the container body. The container body is configured to be connectable to an atmospheric adjustment device for adjusting an internal atmosphere of the container body through the communication passage. | 11-05-2009 |
| 20090302458 | Heat Sink For Power Module - A heat sink ( | 12-10-2009 |
