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Masafumi Inoue

Masafumi Inoue, Singapore SG

Patent application numberDescriptionPublished
20090061417INFLUENZA A VIRUS DETECTION METHOD AND KIT THEREFORE - The invention provides oligonucleotides for a simple, specific and/or sensitive test for the presence of Influenza A. In particular, the present invention provides a primer(s), probe(s) and/or test(s) for Influenza A Subtype H5N1. Kits comprising probe(s) and/or primer(s) useful in the test are also provided.03-05-2009
20110039715INFLUENZA B VIRUS DETECTION METHOD AND KIT THEREFOR - The invention provides oligonucleotide(s) for simple, specific and/or sensitive test(s) for the presence of Influenza virus. In particular, the present invention provides oligonucleotide(s) for test(s) for the Influenza B virus. Kit(s) comprising the oligonucleotide(s) for use as probe(s) and/or primer(s) useful in the test(s) are also provided.02-17-2011
20120100545METHOD AND/OR PRIMERS FOR THE DETECTION OF MYCOBACTERIUM TUBERCULOSIS - The invention provides oligonucleotide(s) for simple, specific and/or sensitive test(s) for the presence of 04-26-2012

Patent applications by Masafumi Inoue, Singapore SG

Masafumi Inoue, Yamanashi JP

Patent application numberDescriptionPublished
20100264196ELECTRONIC COMPONENT MOUNTING METHOD - In electronic component mounting operation for mounting an electronic component having bumps provided on its lower surface to a substrate by soldering, solder paste is printed on electrodes, and positions of the solder paste are detected in print inspection. An inspection result is output as solder paste position data. In a resin coating process where corners are previously coated with reinforcing resin, control parameters of a coating device that applies the reinforcing resin are updated in accordance with solder paste position data, thereby correcting positions where the coating device applies the reinforcing resin. Mixed application of the reinforcing resin on the already-printed solder paste can thereby be prevented.10-21-2010

Masafumi Inoue, Tajimi-Shi JP

Patent application numberDescriptionPublished
20100158596Image Forming Apparatus - A transmission mechanism of an image forming apparatus includes: a first transmitting section transmitting a driving force of a drive mechanism to a first transporting roller; and a second transmitting section transmitting the driving force of the first transmitting section to a second transporting roller. The first transmitting section has a first gear rotatable integrally with the first transporting roller. The second transmitting section has a second gear engaged with the first gear; a shaft extended in a direction intersecting the rotational axes of the first and second transporting rollers, and rotatable integrally with the second gear; a third gear rotatable integrally with the shaft; and a fourth gear engaged with the third gear and rotatable integrally with the second transporting roller. The image forming apparatus is capable of transporting a paper favorably along a re-transporting path.06-24-2010

Masafumi Inoue, Tokyo JP

Patent application numberDescriptionPublished
20100130103POLISHING APPARATUS AND PROGRAM THEREOF - A polishing apparatus includes a loading section (05-27-2010

Patent applications by Masafumi Inoue, Tokyo JP

Masafumi Inoue, Saga JP

Patent application numberDescriptionPublished
20080257937Electronic Component Mounting System, Electronic Component Mounting Device, and Electronic Component Mounting Method - To provide an electronic component mounting system, an electronic component placing device, and an electronic component mounting method, which can prevent waste due to the place of an electronic component onto a unit substrate having a print failure.10-23-2008
20080289175ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - In electronic component mounting for a plurality of individual substrates held on a carrier, solder position deviation data is calculated for each individual substrate based on a mark position recognition result on a carrier after solder printing, a solder position recognition result, and electrode position information indicating the position of an electrode on each individual substrate, an operation of calculating position correction data, which is used to correct the positional deviation to mount electronic components at proper positions, is performed for each individual substrate based on the calculated solder position deviation data and the calculated position correction data is feed-forwarded to an electronic component mounting apparatus, and an electronic component mounting operation of a component mounting mechanism is controlled based on the mark position recognition result and the position correction data.11-27-2008
20080289518SCREEN PRINTING APPARATUS AND SCREEN PRINTING METHOD - In supply of feedback data to improve a positional deviation quantity and a deviation state of a soldering paste printed on individual substrates held on the carrier, a plurality of average values of individual positional deviation for each of the individual substrates are obtained, and then, if the deviation value ΔM indicating a difference between the maximum value Mmax and the minimum value Mmin of the plurality of average values M of individual positional deviation is less than or equal to the tolerance value Δ(t), an intermediate value of the maximum value Mmax and the minimum value Mmin is obtained, and the positioning parameters of the mask plate and the carrier are corrected based on the intermediate value (Mmax+Mmin)/2.11-27-2008
20090014501ELECTRONIC COMPONENT MOUNTING SYSTEM, ELECTRONIC COMPONENT PLACING APPARATUS, AND ELECTRONIC COMPONENT MOUNTING METHOD - Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by solder-joint.01-15-2009
20090064489ELECTRONIC COMPONENTS MOUNTING SYSTEM, PLACEMENT STATE INSPECTING APPARATUS, AND ELECTRONIC COMPONENTS MOUNTING METHOD - In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process.03-12-2009
20090293265ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - One objective of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting defect due to a positioning error in the direction of the thickness of a substrate, and that can deliver a specific mounting quality.12-03-2009
20100071195ELECTRIC COMPONENT MOUNTING SYSTEM AND ELECTRIC COMPONENT MOUNTING METHOD - To provide an electronic component mounting system and an electronic component mounting method which can prevent a mounting failure due to positional error in a height direction of a substrate and ensure mounting quality.03-25-2010

Patent applications by Masafumi Inoue, Saga JP

Masafumi Inoue, Takatsuki JP

Patent application numberDescriptionPublished
200802076186- (Heterocyclyl-substituted Benzyl) -4-Oxoquinoline Compound and Use Thereof as HIV Integrase Inhibitor - The present invention relates to a compound represented by the following formula [I]08-28-2008
20110136778NITROGEN-CONTAINING SPIROCYCLIC COMPOUNDS AND PHARMACEUTICAL USES THEREOF - A compound of the following general formula [I]:06-09-2011

Masafumi Inoue, Miki JP

Patent application numberDescriptionPublished
20110148146PICK-UP STYLE UTILITY VEHICLE WITH EXPANDABLE CARGO BED - The present invention is a pick-up style utility vehicle with an expandable cargo bed, including a front seat, a rear seat, a stationary bottom plate serving as a bottom face of the cargo bed, an expansion bottom plate for expanding the bottom face of the cargo bed, and a shared linkage mechanism for holding the rear seat at a use position where the rear seat is positioned on the upper side of the stationary bottom plate and a shunting position where the rear seat is shunted into a rear leg room provided on the front lower side of the stationary bottom plate, and also for holding the expansion bottom plate at a storage position where the expansion bottom plate is placed out of the upper side of the leg room and an expansion position where the expansion bottom plate is positioned on the upper side of the leg room.06-23-2011
20110156428PICK-UP STYLE UTILITY VEHICLE WITH EXPANDABLE CARGO BED - A pick-up type utility vehicle with an expandable cargo bed, comprises a front seat, a rear seat; the cargo bed, and a screen separating between the rear seat and the cargo bed, on the chassis, the pick-up type utility vehicle further comprising an operating part for moving the screen, and a movement mechanism moving the screen toward the front and back direction by operation of the operating part.06-30-2011

Masafumi Inoue, Toyonaka-Shi JP

Patent application numberDescriptionPublished
20120122994INSECTICIDAL COMPOUND - An object of the present invention is to provide a new insecticidal compound by paying attention to the insecticidal activity contained in the flower part of marigold, and to provide an insecticide containing the compound as an active ingredient. There are provided an insecticidal compound represented by the following chemical formula: [Formula 1], and an insecticide containing the insecticidal compound as an active ingredient or an insecticide containing, as active ingredients, the insecticidal compound and an insecticidal compound represented by the following chemical formula: [Formula 2], wherein the insecticide can exhibit extraordinary insecticidal efficacy compared with existing pyrethroid-based insecticidal compounds.05-17-2012