Patent application number | Description | Published |
20090009775 | Reticle, apparatus for monitoring optical system, method for monitoring optical system, and method for manufacturing reticle - A reticle has a mask substrate, a test pattern established on the mask substrate having an asymmetrical diffraction grating so as to generate positive first order diffracting light and negative first order diffracting light in different diffraction efficiencies, and a device pattern adjacent to the test pattern established on the mask substrate. | 01-08-2009 |
20100166289 | FEATURE-QUANTITY EXTRACTING METHOD, DESIGNED-CIRCUIT-PATTERN VERIFYING METHOD, AND COMPUTER PROGRAM PRODUCT - Feature-quantity extraction parameters used by feature-quantity extraction functions for calculating feature quantities used as explanatory variables of a resist model for predicting a resist image are set. The feature-quantity extraction functions, for which the feature-quantity extraction parameters are set, are caused to act on optical images of a pattern of a photomask to calculate feature quantities from the optical images. | 07-01-2010 |
20110224934 | EVALUATING APPARATUS, EVALUATING METHOD, AND COMPUTER PROGRAM PRODUCT - According to one embodiment, an evaluating apparatus includes a resist-pattern-data acquiring unit and an evaluating unit. The resist-pattern-data acquiring unit acquires resist pattern data having a plurality of feature values including at least two among a hole diameter measured concerning a pattern for hole formation in the resist pattern, an aspect ratio of the hole diameter, and a difference of hole diameters at a plurality of signal thresholds. The evaluating unit calculates an evaluation value using an evaluation function for evaluating whether a hole pattern formed on a processing target by using the pattern for hole formation is unopened and the resist pattern data and evaluates presence or absence of a risk that the hole pattern is unopened. | 09-15-2011 |
20110229988 | PATTERN FORMING METHOD, PROCESSING METHOD, AND PROCESSING APPARATUS - According to the embodiments, a distribution of a recess portion shape is calculated based on a result obtained by measuring the recess portion shape of a first projection and recess pattern formed on a surface of a template. Next, a distribution of an application amount of a curing agent to a processing target layer is calculated based on the distribution of the recess portion shape, and the curing agent is applied to the processing target layer based on this distribution of the application amount of the curing agent. Next, a second projection and recess pattern is formed by transferring the first projection and recess pattern onto the curing agent by causing the curing agent to cure in a state where the first projection and recess pattern is in contact with the curing agent. | 09-22-2011 |
20110245956 | Method and system for managing semiconductor manufacturing device - A management system includes a variable-period setting unit that sets a variable period in which quality-control values vary. Then, a retrieving unit retrieves events sandwiching the variable period. The events can be a maintenance of the semiconductor manufacturing device and/or a change of a correction value. An analysis-period setting unit sets an analysis period for analyzing a cause of variation of the quality-control values between the events retrieved by the retrieving unit. | 10-06-2011 |
20110315077 | TEMPLATE, MANUFACTURING METHOD, AND PROCESSING METHOD - According to the embodiments, a template is obtain which is used for imprint of forming a second projection and recess pattern formed of a curing agent on a processing target layer by transferring a first projection and recess pattern onto the curing agent by filling the first projection and recess pattern with the curing agent and curing the curing agent. The template includes the first projection and recess pattern on one surface side of a substrate. The first projection and recess pattern is such that height positions of bottom surfaces of recess portions are approximately the same, and includes two or more types of projection portions whose height from the bottom surfaces of the recess portions is different. | 12-29-2011 |
20120205782 | Imprint Apparatus, Imprint Method, and Process Condition Selection Method - An imprint apparatus of one embodiment includes: a resist dropping unit adapted to drop resist onto a substrate; a patterning unit adapted to pattern the resist into transfer patterns corresponding to the template patterns; and a control unit configured to change a dropping condition for a resist dropping process shot by shot. The control unit is adapted to control, as the dropping condition, the distance to the position of a droplet of the resist to be dropped onto the substrate from a position on the substrate to be pressed with an assessment pattern, the assessment pattern being one of the template patterns that is to be assessed. | 08-16-2012 |
20120324407 | SIMULATION MODEL CREATING METHOD, COMPUTER PROGRAM PRODUCT, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - According to a simulation model creating method of an embodiment, a resist pattern is formed by transferring a mask pattern on a first substrate with an exposing amount and a focus value being changed, and a line width of the resist pattern is measured. Next, measurement results which are not within an allowable change range due to an irregularity of the exposing amount, an irregularity of the focus value or pattern feature amount are removed. In addition, measurement results which are not with in an allowable change range due to an irregularity of the line width of the mask pattern are removed. Next, a simulation model is created by using measurement results which are not removed. | 12-20-2012 |
20130224635 | MASK PATTERN CREATION METHOD, RECORDING MEDIUM, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - According to one embodiment, a mask pattern creation method includes extracting an area, in which a DSA material is directed self-assembled to form a DSA pattern, from a design pattern area based on a design pattern and information on the DSA material. The method also includes creating a guide pattern that causes the DSA pattern to be formed in the area based on the design pattern, the information on the DSA material, the area, and a design constraint when forming the guide pattern. The method further includes creating a mask pattern of the guide pattern using the guide pattern. | 08-29-2013 |
20140284846 | MOLD AND MOLD MANUFACTURING METHOD - According to one embodiment, a mold includes a base, a first concave pattern, a second concave pattern, and a third concave pattern. The base includes a first surface and a pedestal projecting from the first surface. The pedestal includes a first region and a second region disposed outside the first region. The first concave pattern is formed in the first region. The second concave pattern is formed in the second region. The third concave pattern extends from the first region to the second region. | 09-25-2014 |
Patent application number | Description | Published |
20090192743 | SAMPLING ESTIMATING METHOD, SAMPLING INSPECTION ESTIMATING APPARATUS, AND COMPUTER READABLE MEDIUM STORING SAMPLING INSPECTION ESTIMATING PROGRAM - A sampling inspection estimating method comprises determining an acceptable range of a measured value and an acceptable range of a acceptance probability, determining a first sampling plan to be inspected and a condition of calculating a first acceptance variables of lots, obtaining a first measured value of a production lot based on the determined first sampling plan, calculating first acceptance variables of lots based on the obtained first measured value and the determined condition of calculating the first acceptance variables of lots, calculating a first acceptance probability based on the first acceptance variables of lots, determining a second sampling plan to be inspected and a condition of calculating a second acceptance variables of lots, obtaining a second measured value of a production lot based on the determined second sampling plan, calculating second acceptance variables of lots based on the obtained second measured value and the determined condition of calculating the second acceptance variables of lots, calculating a second acceptance probability based on the second acceptance variables of lots, calculating operating characteristics of the first and second sampling plans based on the first acceptance probability and the second acceptance probability, and estimating the operating characteristics by using the determined acceptable range of the acceptance probability. | 07-30-2009 |
20090240362 | SIMULATION MODEL CREATING METHOD, MASK DATA CREATING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A simulation model creating method computes, for measurement results of a line width of a resist pattern formed with varied an exposure amount and focus value, a permissible fluctuation range of the pattern line width from a distribution of the exposure amount and a distribution of the focus value; computes difference values between the measurement results and corresponding approximation values on a fitting function which has the exposure amount and focus value as parameters; compares the difference values with the permissible fluctuation range; deletes any measurement values for which the difference value is larger than the permissible fluctuation range, and recomputes the fitting function accordingly; and deletes measurement values outside a permissible fluctuation range of a pattern line width of the mask, and creates a simulation model. | 09-24-2009 |
20090246654 | METHOD FOR EVALUATING LITHOGRAPHY APPARATUS AND METHOD FOR CONTROLLING LITHOGRAPHY APPARATUS - An evaluation method for lithography apparatus including a coating unit, an exposure unit, a heating unit and a development unit, the evaluation method including forming an evaluation resist pattern by using the lithography apparatus, the evaluation resist pattern including first and second evaluation patterns, the first and second evaluation patterns having different peripheral environments, measuring dimensions of the first and second evaluation patterns to obtain a dimensional difference between the first and second resist evaluation patterns, estimating an exposure dose of a resist when the resist is exposed by the exposure unit, the estimating the exposure dose being performed based on the dimensional difference between the first and second resist evaluation patterns, and estimating an effective heating temperature of the resist when the resist is heated by the heating unit, the estimating the effective heating temperature being performed based on the estimated exposure dose and the dimensional difference. | 10-01-2009 |
20090305148 | PATTERN DATA CREATING METHOD, PHOTOMASK FABRICATING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A pattern data creating method according to an embodiment of the present invention creates data of a mask pattern to be arranged on a photomask. The method includes creating a test mask pattern by moving positions of plural edges in a given mask pattern according to a predetermined probability density distribution, the test mask pattern having dimension values which are different from dimension values of the given mask pattern, obtaining dimension values of a wafer pattern, which are measured by exposing a wafer with a test mask on which the test mask pattern is arranged, forming the wafer pattern on the wafer by the exposure, and measuring the dimension values of the wafer pattern on the wafer, obtaining a relationship between the dimension values of the wafer pattern and the dimension values of the test mask pattern, and creating, by using the relationship, the mask pattern having dimension values by which a wafer pattern having predetermined dimension values is formed. | 12-10-2009 |
20100068833 | System of testing semiconductor devices, a method for testing semiconductor devices, and a method for manufacturing semiconductor devices - A system of testing semiconductor devices includes a classification module configured to classify a plurality of lots into a plurality of groups; an apparatus assignment module configured to assign a plurality of testing apparatuses to each of the groups; and a test recipe creation module configured to create a test recipe to test defects in a second group other than a first group specified in the groups, the test recipe including a definition of testing positions in the second group defined by a rule different from the first group. | 03-18-2010 |
20100112485 | Reticle set, method for designing a reticle set, exposure monitoring method, inspection method for reticle set and manufacturing method for a semiconductor device - A reticle set, includes a first photomask having a circuit pattern provided with first and second openings provided adjacent to each other sandwiching a first opaque portion, and a monitor mark provided adjacent to the circuit pattern; and a second photomask having a trim pattern provided with a second opaque portion covering the first opaque portion in an area occupied by the circuit pattern and an extending portion connected to one end of the first opaque portion and extending outside the area when the second photomask is aligned with a pattern delineated on a substrate by the first photomask. | 05-06-2010 |
20150037713 | METHOD FOR DESIGNING MASK SET, RECORDING MEDIUM, TEMPLATE, AND METHOD FOR MANUFACTURING TEMPLATE - According to an embodiment, a method for designing a mask set is provided. In the method for designing the mask set, an imprint-alignment mark is arranged in a region other than a chip region in an imprint shot formed in a template. The imprint-alignment mark is used for alignment during an imprint. Subsequently, the shape of the imprint shot is set based on an arrangement position of the imprint-alignment mark. Subsequently, another pattern is arranged in a region where the region is other than the chip region in the imprint shot and the imprint-alignment mark is not arranged. The other pattern is used in a process other than the imprint. | 02-05-2015 |
20150217504 | IMPRINT TEMPLATE AND METHOD FOR MANUFACTURING THE SAME - According to one embodiment, an imprint template used for imprint includes a pattern region, a peripheral region, a region, and a first transmittance control part. The pattern region is provided with a first protrusion. The peripheral region surrounds the pattern region. The region is provided in the peripheral region and provided with a second protrusion. The first transmittance control part is provided in the peripheral region and configured to control intensity of light transmitted through the template in thickness direction. The template has a planar shape axisymmetric with respect to a line passing through center of the template. The region provided with the second protrusion and the first transmittance control part are provided at positions axisymmetric to each other with respect to the line passing through the center of the template. | 08-06-2015 |
20150224702 | PATTERN INSPECTION MEMBER, PATTERN INSPECTION METHOD, AND PATTERN INSPECTION APPARATUS - According to one embodiment, a pattern inspection member is a pattern inspection member to which a pattern provided in an inspection object is transferred. The pattern inspection member includes a component pertaining to photosensitivity or thermosensitivity, a component pertaining to stretching and a component pertaining to feature retention of the pattern. The component pertaining to photosensitivity or thermosensitivity includes a photosensitive resin or a thermosensitive resin. The component pertaining to stretching includes a thermoplastic resin including no cyclic structure. The component pertaining to feature retention of the pattern includes a thermoplastic resin including a cyclic structure. | 08-13-2015 |
20150235911 | PATTERN INSPECTION METHOD, PATTERN FORMATION CONTROL METHOD, AND PATTERN INSPECTION APPARATUS - According to one embodiment, in a pattern inspection method, a guide pattern is formed on a substrate. A block copolymer is applied on the guide pattern. Thereafter, the substrate is heated according to a predetermined heating condition to promote directed self assembly corresponding to a shape of the guide pattern with respect to the block copolymer. Further, the substrate is observed by a fluorescence microscope during heating or after heating the substrate. | 08-20-2015 |
Patent application number | Description | Published |
20120009791 | PATTERN FORMATION METHOD - According to one embodiment, a pattern formation method is disclosed. The method can include filling an imprint material between a first protrusion-depression pattern of a first pattern transfer layer formed on a first replica substrate and a second pattern transfer layer being transparent to energy radiation and formed on a second replica substrate transparent to the energy radiation. The method can include curing the imprint material by irradiating the imprint material with the energy radiation from an opposite surface side of the second replica substrate. The method can include releasing the first protrusion-depression pattern from the imprint material. The method can include forming a second protrusion-depression pattern in the second pattern transfer layer by processing the second pattern transfer layer using the imprint material as a mask. | 01-12-2012 |
20120315349 | TEMPLATE, TEMPLATE MANUFACTURING METHOD, AND TEMPLATE MANUFACTURING APPARATUS - According to one embodiment, a template includes: a base substrate; and a pattern portion provided on the base substrate and including a concave-convex pattern formed from a master pattern. The concave-convex pattern is provided in a distorted state with respect to the master pattern in accordance with a distortion of an underlying pattern formed on a substrate to which a shape of the concave-convex pattern is to be transferred. | 12-13-2012 |
20120318561 | PATTERN FORMATION METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE - According to one embodiment, a pattern formation method includes: providing a first member; providing a second member; forming a third pattern; and removing a convex portion of a second pattern. The first member is provided on a major surface of a substrate and cured in a state of a template having a first pattern being brought into contact to form the second pattern including a convex portion in a first region on the major surface. The second member is provided in a concave portion adjacent to the convex portion of the second pattern. The third pattern is formed in the second member provided on a second region on the major surface. The removing the convex portion includes removing the convex portion of the second pattern to leave the third pattern and a fourth pattern formed by the second member provided in the concave portion on the major surface. | 12-20-2012 |
20130069278 | PATTERN FORMATION DEVICE, METHOD FOR PATTERN FORMATION, AND PROGRAM FOR PATTERN FORMATION - According to one embodiment, a pattern formation device that presses a template that includes a concave and convex part onto a transferring object and that forms a pattern in which a shape of the concave and convex part is transferred is provided. The device includes: a calculation part; an adjustment part; and a transfer. The calculation part calculates, using design information of the pattern, the distribution of force applied to the pattern at a time of releasing the template pressed onto the transferring object from the transferring object. The adjustment part adjusts forming conditions of the pattern in order to uniformly approach the distribution of force calculated by the calculation part. The transfer part transfers the shape of the concave and convex part to the transferring object according to the forming conditions adjusted by the adjustment part. | 03-21-2013 |
20130323925 | PATTERN FORMING METHOD, MOLD AND DATA PROCESSING METHOD - According to one embodiment, a pattern forming method is disclosed. The method can include forming an insulating layer on a major surface of a substrate. The method can include forming first and second openings on the insulating layer. The first opening has a first length in a first direction along the major surface, and the second opening has a second length longer than the first length in the first direction. The method can include forming a first pattern in the first opening. The method can include forming a second pattern in the second opening. The method can include forming a self-assembled material film contacting the insulating layer, the first pattern and the second pattern. The method can include forming a third pattern with guidance of the second pattern. In addition, the method can include forming a fourth pattern contacting the first pattern based on the third pattern. | 12-05-2013 |
20140346701 | PATTERN FORMATION DEVICE, METHOD FOR PATTERN FORMATION, AND PROGRAM FOR PATTERN FORMATION - According to one embodiment, a pattern formation device that presses a template that includes a concave and convex part onto a transferring object and that forms a pattern in which a shape of the concave and convex part is transferred is provided. The device includes: a calculation part; an adjustment part; and a transfer. The calculation part calculates, using design information of the pattern, the distribution of force applied to the pattern at a time of releasing the template pressed onto the transferring object from the transferring object. The adjustment part adjusts forming conditions of the pattern in order to uniformly approach the distribution of force calculated by the calculation part. The transfer part transfers the shape of the concave and convex part to the transferring object according to the forming conditions adjusted by the adjustment part. | 11-27-2014 |
20140354799 | PATTERN INSPECTION METHOD AND PATTERN INSPECTION APPARATUS - According to one embodiment, a pattern inspection method includes acquiring a first image using a first condition by irradiating an electron beam onto a pattern to be inspected, acquiring a second image using a second condition by irradiating the electron beam onto the pattern, the second condition being different from the first condition, and judging the existence/absence of defects of the pattern by comparing the first image and the second image. A pattern inspection apparatus includes an electron source, a converging part, a stage, an image acquisition part, a controller and a judgment part. The controller is configured to perform a control to acquire a first image using a first condition and acquire a second image using a second condition different from the first condition. The judgment part is configured to judge the existence/absence of defects of the pattern by comparing the first and the second image. | 12-04-2014 |